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1. 发明申请

US20120161178A1 LED PACKAGE AND CHIP CARRIER THEREOF 审中-公开
标题翻译： LED封装和芯片载体
公开(公告)号：US20120161178A1
公开(公告)日：2012-06-28
申请号：US13217281
申请日：2011-08-25
申请人： HOU-TE LIN , JUNG-HSI FANG
发明人： HOU-TE LIN , JUNG-HSI FANG
IPC分类号： H01L33/60 , H05K1/02
CPC分类号： H01L33/62 , H01L33/486 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/00014
摘要： An LED package includes a chip carrier, an LED chip, and an encapsulation. The chip carrier includes a first surface, a second surface opposite to the first surface, and a side surface interconnecting the first surface and the second surface. The chip carrier includes an insulator defining two holes, and two electrodes. Each electrode includes a first contact end exposed on the first surface and separated from the side surface by the insulator, a second contact end exposed on the second surface, and a connecting portion connecting the first contact end to the second contact end; the connecting portion has a bent part received in the hole. The LED chip is mounted on the first surface of the chip carrier. The encapsulation covers the LED chip.
摘要翻译： LED封装包括芯片载体，LED芯片和封装。芯片载体包括第一表面，与第一表面相对的第二表面和将第一表面和第二表面互连的侧表面。芯片载体包括限定两个孔的绝缘体和两个电极。每个电极包括暴露在第一表面上并通过绝缘体与侧表面分离的第一接触端，暴露在第二表面上的第二接触端和将第一接触端连接到第二接触端的连接部分; 连接部分具有容纳在孔中的弯曲部分。 LED芯片安装在芯片载体的第一表面上。封装覆盖了LED芯片。

2. 发明申请

US20130161671A1 LIGHT EMITTING DIODE WITH SIDEWISE LIGHT OUTPUT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有边界光输出结构的发光二极管及其制造方法
公开(公告)号：US20130161671A1
公开(公告)日：2013-06-27
申请号：US13559615
申请日：2012-07-27
申请人： SHIH-YUAN HSU , HOU-TE LIN
发明人： SHIH-YUAN HSU , HOU-TE LIN
IPC分类号： H01L33/58 , H01L33/52
CPC分类号： H01L33/58 , H01L33/486 , H01L33/54 , H01L2224/48091 , H01L2924/01322 , H01L2933/0058 , H01L2933/0091 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode (LED) includes a substrate, an electrode structure positioned on the substrate, an LED component electrically connected to the electrode structure, and a lens structure positioned on the substrate and covering the LED component. The lens structure includes a rugged structure adjacent to the substrate; the roughness of the rugged structure decreases gradually along a direction from a center of the lens structure center toward a peripheral edge thereof. The present disclosure also provides a method for manufacturing the LED light source.
摘要翻译：发光二极管（LED）包括基板，位于基板上的电极结构，与电极结构电连接的LED部件，以及位于基板上并覆盖LED部件的透镜结构。透镜结构包括与基板相邻的凹凸结构; 凹凸结构的粗糙度沿着从透镜结构中心的中心朝向其周边的方向逐渐减小。本公开还提供了一种制造LED光源的方法。

3. 发明申请

US20130134463A1 LED PACKAGE AND LIGHT EMITTING DEVICE HAVING THE SAME 有权
标题翻译： LED封装和发光装置
公开(公告)号：US20130134463A1
公开(公告)日：2013-05-30
申请号：US13585847
申请日：2012-08-15
申请人： CHAO-HSIUNG CHANG , HOU-TE LIN
发明人： CHAO-HSIUNG CHANG , HOU-TE LIN
IPC分类号： H01L33/60
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2933/0033 , H01L2924/00014
摘要： An exemplary LED package includes first and second electrodes, an LED die and an encapsulation. An inner wall of each first and second electrode includes a first oblique plane. The LED die is surrounded by and electrically connected to the first and second electrodes. The LED die includes an outputting surface. The encapsulation is filled between the first electrode ant the second electrode and covers the LED die, and includes opposite first and second outer surfaces, wherein the second outer surface acts as an outputting surface of the LED package. A reflective layer is coated on the first outer surface of the encapsulation. The first oblique plane of the electrode structure is light reflective and extends aslant from the outputting surface of the LED die towards the outputting surface of the LED package along a direction away from the LED die.
摘要翻译：示例性的LED封装包括第一和第二电极，LED管芯和封装。每个第一和第二电极的内壁包括第一斜面。 LED管芯被第一和第二电极包围并电连接。 LED管芯包括输出表面。该封装件填充在第一电极和第二电极之间并覆盖LED管芯，并且包括相对的第一和第二外表面，其中第二外表面用作LED封装的输出表面。反射层涂覆在封装的第一外表面上。电极结构的第一倾斜平面是光反射的，并且从LED芯片的输出表面沿着远离LED管芯的方向向LED封装的输出表面倾斜延伸。

4. 发明申请

US20120224379A1 LIGHT EMITTING DIODE DEVICE 有权
标题翻译：发光二极管装置
公开(公告)号：US20120224379A1
公开(公告)日：2012-09-06
申请号：US13288031
申请日：2011-11-03
申请人： CHAO-HSIUNG CHANG , HOU-TE LIN , MING-TA TSAI
发明人： CHAO-HSIUNG CHANG , HOU-TE LIN , MING-TA TSAI
IPC分类号： F21V5/04 , F21V7/22
CPC分类号： H01L33/58 , G02B19/0028 , G02B19/0061 , H01L2224/48091 , H01L2924/00014
摘要： An LED device includes a substrate, an LED chip and a lens module. The substrate has an upper surface. The LED chip is arranged on the upper surface of the substrate. The LED chip has a light emitting surface away from the upper surface of the substrate. The lens module is arranged over the light emitting surface of the LED chip. The lens module includes a first lens. The first lens includes a first light outputting surface away from the light emitting surface of the LED chip. The first light outputting surface of the first lens defines a first cavity at a center thereof.
摘要翻译： LED装置包括基板，LED芯片和透镜模块。基板具有上表面。 LED芯片布置在基板的上表面上。 LED芯片具有远离基板的上表面的发光表面。透镜模块布置在LED芯片的发光表面上。透镜模块包括第一透镜。第一透镜包括远离LED芯片的发光表面的第一光输出表面。第一透镜的第一光输出表面在其中心处限定第一空腔。

5. 发明申请

US20120212964A1 LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：发光二极管封装
公开(公告)号：US20120212964A1
公开(公告)日：2012-08-23
申请号：US13288030
申请日：2011-11-03
申请人： CHAO-HSIUNG CHANG , HOU-TE LIN
发明人： CHAO-HSIUNG CHANG , HOU-TE LIN
IPC分类号： F21V7/04 , F21V7/00
CPC分类号： H01L33/60 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： An LED package includes a substrate, a transparent base, an LED chip and a reflective layer. The substrate has an upper surface. The transparent base is arranged on the upper surface of the substrate. The transparent base includes a first surface away from the substrate and a second surface opposite to the first surface. The LED chip is arranged on the first surface of the transparent base. The reflective layer is arranged between the substrate and the second surface of the transparent base.
摘要翻译： LED封装包括基板，透明基板，LED芯片和反射层。基板具有上表面。透明基底设置在基板的上表面上。透明基底包括远离基底的第一表面和与第一表面相对的第二表面。 LED芯片布置在透明基底的第一表面上。反射层布置在基板和透明基底的第二表面之间。

6. 发明申请

US20130168713A1 LED DEVICE HAVING UNIFORM DISTRIBUTION OF LIGHT INTENSITY OF LIGHT FILED 审中-公开
标题翻译：具有均匀分布光亮度的LED装置
公开(公告)号：US20130168713A1
公开(公告)日：2013-07-04
申请号：US13600133
申请日：2012-08-30
申请人： CHAO-HSIUNG CHANG , HOU-TE LIN
发明人： CHAO-HSIUNG CHANG , HOU-TE LIN
IPC分类号： H01L33/58
CPC分类号： H01L33/54 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： An LED device includes a substrate having a top surface, an LED chip arranged on the top surface of the substrate, an encapsulant arranged on the top surface of the substrate and covering the LED chip, and an optical element arranged over the encapsulant. The optical element includes a light input surface adjacent to the encapsulant and a light output surface opposite to the light input surface. The refractive index of the optical element is larger than that of the encapsulant.
摘要翻译： LED器件包括具有顶表面的衬底，布置在衬底的顶表面上的LED芯片，布置在衬底的顶表面上并覆盖LED芯片的密封剂以及布置在密封剂上的光学元件。光学元件包括与密封剂相邻的光输入表面和与光输入表面相对的光输出表面。光学元件的折射率大于密封剂的折射率。

7. 发明申请

US20130026510A1 LIGHT EMITTING DIODE DEVICE 失效
标题翻译：发光二极管装置
公开(公告)号：US20130026510A1
公开(公告)日：2013-01-31
申请号：US13424367
申请日：2012-03-19
申请人： HOU-TE LIN , CHAO-HSIUNG CHANG
发明人： HOU-TE LIN , CHAO-HSIUNG CHANG
IPC分类号： H01L27/15
CPC分类号： H01L25/0753 , H01L33/502 , H01L33/507 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A light emitting diode (LED) device includes a substrate, first and second LED chips arranged on the substrate, and a phosphor layer over the first and second LED chips. The phosphor layer includes a plurality of phosphor units, each including a phosphor particle and a silver halide layer encapsulating the phosphor particle. Light emitted from the second LED chip strikes the phosphor particles to generate a first light, which. combines with the light to generate a resultant light. The silver halide layer is reduced by the light from the first LED chip to produce silver particles around the phosphor particles. The silver particles can block the light emitted from the second LED chip from sticking the phosphor particles. By adjusting the current supplied to the first LED chip, the color temperature of the resultant light generated by the LED device can be changed.
摘要翻译：发光二极管（LED）器件包括衬底，布置在衬底上的第一和第二LED芯片以及在第一和第二LED芯片上的磷光体层。磷光体层包括多个荧光体单元，每个荧光体单元包括荧光体颗粒和包围磷光体颗粒的卤化银层。从第二LED芯片发射的光撞击荧光体颗粒以产生第一光。与光结合以产生结果光。通过来自第一LED芯片的光减少卤化银层，以在荧光体颗粒周围产生银颗粒。银颗粒可以阻挡从第二LED芯片发出的光粘附磷光体颗粒。通过调整提供给第一LED芯片的电流，可以改变由LED器件产生的合成光的色温。

8. 发明申请

US20130215355A1 BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY USING THE SAME 审中-公开
标题翻译：背光模块和使用其的液晶显示器
公开(公告)号：US20130215355A1
公开(公告)日：2013-08-22
申请号：US13471461
申请日：2012-05-15
申请人： HOU-TE LIN , CHAO-HSIUNG CHANG
发明人： HOU-TE LIN , CHAO-HSIUNG CHANG
IPC分类号： G02F1/1333 , G09F13/04
CPC分类号： G02F1/133603 , G02F1/133605 , G02F2001/133628
摘要： A backlight module includes a mounting plate and plural light-emitting diodes mounted on the mounting plate. The mounting plate includes plural ridges. Each of the ridges is strip-shaped and includes two mounting walls each extending inclinedly and upwardly from a corresponding connecting portion. An obtuse angle is formed between each of the mounting walls and the corresponding connecting portion. The light-emitting diodes are mounted on the mounting walls of the ridges, whereby the light-emitting diodes are tilted relative to connecting portions. The present disclosure further discloses a liquid crystal display using the backlight module. The light-emitting diodes face upwardly and inclinedly toward a liquid display screen of the display when the backlight module is located below the screen.
摘要翻译：背光模块包括安装板和安装在安装板上的多个发光二极管。安装板包括多个脊。每个脊是带状的，并且包括两个安装壁，每个安装壁从相应的连接部分倾斜向上延伸。在每个安装壁和相应的连接部分之间形成钝角。发光二极管安装在脊的安装壁上，由此发光二极管相对于连接部分倾斜。本公开进一步公开了使用背光模块的液晶显示器。当背光模块位于屏幕下方时，发光二极管朝向显示器的液体显示屏面朝上且倾斜。

9. 发明申请

US20130135844A1 LED AND BACKLIGHT MODULE USING THE SAME 有权
标题翻译： LED和背光模块使用相同
公开(公告)号：US20130135844A1
公开(公告)日：2013-05-30
申请号：US13559614
申请日：2012-07-27
申请人： CHAO-HSIUNG CHANG , HOU-TE LIN
发明人： CHAO-HSIUNG CHANG , HOU-TE LIN
IPC分类号： H01L33/46 , G09F13/04
CPC分类号： H01L33/48 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An LED includes a base, an LED chip, a first electrode, a second electrode, an encapsulating layer, and a reflective layer. The base forms a concave recessed from a top face thereof and a recess above the concave. The reflective layer is attached on the concave. The LED chip is received in the recess and located over the reflective layer. The LED chip has a light output face facing towards the reflective layer. The encapsulating layer is filled in the recess to cover the reflective layer and encapsulate the LED chip. The reflective layer includes a first reflective layer and a second reflective layer. The first reflective layer is located at a center of the concave. The second reflective layer surrounds and connects the first reflective layer. The first reflective layer has a curvature smaller than that of the second reflective layer.
摘要翻译： LED包括基底，LED芯片，第一电极，第二电极，封装层和反射层。基部从其顶面形成凹入凹部，在凹部上形成凹部。反射层附着在凹面上。 LED芯片被容纳在凹部中并且位于反射层之上。 LED芯片具有面向反射层的光输出面。封装层填充在凹部中以覆盖反射层并封装LED芯片。反射层包括第一反射层和第二反射层。第一反射层位于凹面的中心。第二反射层围绕并连接第一反射层。第一反射层的曲率比第二反射层的曲率小。

10. 发明申请

US20130009178A1 LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20130009178A1
公开(公告)日：2013-01-10
申请号：US13533981
申请日：2012-06-27
申请人： HOU-TE LIN , CHAO-HSIUNG CHANG
发明人： HOU-TE LIN , CHAO-HSIUNG CHANG
IPC分类号： H01L33/08 , H01L33/52
CPC分类号： H01L27/153 , H01L25/167 , H01L33/08 , H01L2224/48091 , H01L2933/0033 , H01L2933/005 , H01L2924/00014
摘要： A light emitting diode package includes an electrically insulated base, first and second electrodes, an LED chip, a voltage stabilizing module, and an encapsulative layer. The base has a first surface and an opposite second surface. The first and second electrodes are formed on the first surface of the base. The LED chip is electrically connected to the first and second electrodes. The voltage stabilizing module is formed on the first surface of the base, positioned between and electrically connected to the first and second electrodes. The voltage stabilizing module connects to the LED chip in reverse parallel and has a polarity arranged opposite to that of the LED chip. The voltage stabilizing module has an annular shape and encircles the first electrode. The encapsulative layer is formed on the base and covers the LED chip.
摘要翻译：发光二极管封装包括电绝缘基座，第一和第二电极，LED芯片，稳压模块和封装层。底座具有第一表面和相对的第二表面。第一和第二电极形成在基座的第一表面上。 LED芯片电连接到第一和第二电极。电压稳定模块形成在基座的第一表面上，位于第一和第二电极之间并与之电连接。电压稳定模块反向并联连接到LED芯片，具有与LED芯片相反的极性。电压稳定模块具有环形形状并且包围第一电极。封装层形成在基座上并覆盖LED芯片。

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