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1. 发明申请

US20180306619A1 FLOW METER 审中-公开
公开(公告)号：US20180306619A1
公开(公告)日：2018-10-25
申请号：US15770993
申请日：2016-10-05
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Akira UENODAN , Shinobu TASHIRO , Takeshi MORINO , Masatoshi OGATA , Tsubasa WATANABE , Norio ISHITSUKA
IPC分类号： G01F1/684
摘要： To obtain a flow meter with which it is possible to facilitate establishing an electrical connection with a conductor exposed in a location through which a gas to be measured passes. A flow meter that is provided with a lead and a circuit component placed on the lead, and that has a package in which part of the lead is molded from a resin, wherein the package is provided with an exposure portion for exposing part of the lead from the resin member, the exposure portion being electrically connected to a conductor that constitutes part of an auxiliary passage.

2. 发明申请

US20160146652A1 Method of Manufacturing Thermal Flow Meter 有权
标题翻译：制造热流量计的方法
公开(公告)号：US20160146652A1
公开(公告)日：2016-05-26
申请号：US14899567
申请日：2014-02-07
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Norio ISHITSUKA , Masatoshi OGATA , Tsutomu KONO , Tsubasa WATANABE , Shinobu TASHIRO , Noboru TOKUYASU
IPC分类号： G01F1/692
CPC分类号： G01F1/692 , G01F1/684 , G01F5/00
摘要： An objective of the present invention is, in a thermal flowmeter having a structure including a resin portion formed in the vicinity of a diaphragm structural portion using a mold, to prevent destruction of the diaphragm structural portion at the time of pressing the mold, in a method of manufacturing the thermal flow meter, including: supporting a gas flow measurement element 200 on support members 102b and 111, the gas flow measurement element 200 including a cavity portion 202 surrounded by a substrate inclined portion 202a inclined to a substrate surface, a diaphragm 201 that covers the cavity portion, and an electrical resistive element formed in the diaphragm 201; and covering the gas flow measurement element 200 and the support members 102b and 111 with the resin portion 104 formed with the mold, to set the mold 14 such that an acting portion of pressure force by the mold that molds the resin portion 104 is positioned outside the substrate inclined portion 202a in the entire periphery of the diaphragm 201.
摘要翻译：本发明的目的在于，在具有使用模具形成在隔膜结构部附近的树脂部的结构的热式流量计中，为了防止压模时的膜结构部的破坏，制造热流量计的方法包括：在支撑部件102b和111上支撑气体流量测量元件200，气体流量测量元件200包括由与基板表面倾斜的基板倾斜部分202a包围的空腔部分202，隔膜 201，其形成在隔膜201中;电阻元件，并用形成有模具的树脂部分104覆盖气体流量测量元件200和支撑构件102b和111，以将模具14设置成使得模制树脂部分104的模具的压力作用部分位于外部基板倾斜部分202a在隔膜201的整个周边。

3. 发明申请

US20210148743A1 Thermal-Type Flowmeter 有权
公开(公告)号：US20210148743A1
公开(公告)日：2021-05-20
申请号：US16637654
申请日：2018-07-17
申请人： Hitachi Automotive Systems, Ltd.
发明人： Akira UENODAN , Takayuki YOGO , Tsubasa WATANABE , Takahiro MIKI , Shinobu TASHIRO , Hiroaki HOSHIKA
IPC分类号： G01F1/696 , G01F5/00 , G01F1/684
摘要： Provided is a thermal-type flowmeter which can prevent a reduction of flow rate accuracy and reliability, and an increase of cost of the thermal-type flowmeter compared to the related art, and can add a function of an electrostatic scattering mechanism. The thermal-type flowmeter of the present invention includes a sub-passage into which part of a measurement target gas flowing in a main passage is taken, a flow rate detection element of a flow measurement unit which is disposed in the sub-passage, a circuit package which supports the flow rate detection element, and a substrate to which the circuit package is fixed. The flow rate detection element includes a detection surface to detect a flow rate of the measurement target gas. The detection surface is disposed to face the circuit substrate.

4. 发明申请

US20190267736A1 SEMICONDUCTOR MODULE 审中-公开
公开(公告)号：US20190267736A1
公开(公告)日：2019-08-29
申请号：US16348208
申请日：2017-10-17
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Tsubasa WATANABE , Hiroaki HOSHIKA , Takayuki YOGO
IPC分类号： H01R13/05 , H01R12/57 , H01R12/58
摘要： A semiconductor module includes: a circuit board on which a first semiconductor chip and a second semiconductor chip are mounted and includes a first through hole formed with a conductor foil therein; a press-fit terminal that is electrically connected to the conductor foil in the first through hole of the circuit board; and a second resin that is disposed on a surface side and a back surface side of the circuit board. Further, the press-fit terminal is provided with a pressure contact portion which is press-fitted into the first through hole and is electrically connected to the conductor foil in the first through hole, and the second resin on the surface side of the circuit board and the second resin on the back surface side of the circuit board are integrally formed via a second resin that is filled in the first through hole.

5. 发明申请

US20190323871A1 THERMAL FLOWMETER 审中-公开
公开(公告)号：US20190323871A1
公开(公告)日：2019-10-24
申请号：US16464867
申请日：2017-09-27
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Akira UENODAN , Masashi FUKAYA , Tomoaki SAITO , Shinobu TASHIRO , Tsubasa WATANABE
IPC分类号： G01F1/684 , G01F15/04 , G01K13/02 , G01F5/00 , F02D41/18
摘要： A thermal flowmeter includes a plurality of measuring units for stabilizing air flowing in a sub-passage, and improves noise performance or a pulsation characteristic of a flow rate sensor. The thermal flowmeter includes a flange fixed to an attachment part of a main passage, a sub-passage takes in a part of measured gas flowing in the main passage, a flow rate measuring unit measures a flow rate of the measured gas in the sub-passage, a circuit component controls the flow rate measuring unit, and the flow rate measuring unit and an electronic component are mounted on a circuit substrate. The sub-passage is formed in a substrate of the circuit substrate, the sub-passage on a surface side of the circuit substrate and a second space on a rear surface side are separated by the circuit substrate, and a pressure measuring unit and the circuit component are arranged in the second space.

6. 发明申请

US20180158743A1 Resin Molding and Sensor Device 审中-公开
公开(公告)号：US20180158743A1
公开(公告)日：2018-06-07
申请号：US15576356
申请日：2016-06-14
申请人： Hitachi Automotive Systems, Ltd.
发明人： Tsubasa WATANABE , Tsutomu KONO , Takayuki YOGO , Hiroaki HOSHIKA
IPC分类号： H01L23/10 , B29C45/14 , H01L23/31 , H01L23/00 , H01L23/538 , H01L21/48 , H01L23/13 , H01L25/16 , H01L23/04 , H01L21/56 , H01L21/52 , G01F1/692
CPC分类号： H01L23/10 , B29C45/14639 , F02D41/18 , G01F1/684 , G01F1/6845 , G01F1/692 , H01L21/4817 , H01L21/52 , H01L21/565 , H01L23/041 , H01L23/13 , H01L23/28 , H01L23/3121 , H01L23/3185 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/165 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/1432 , H01L2924/1434 , H01L2924/15153 , H01L2924/15192 , H01L2924/181 , H01L2924/19043 , H01L2924/19105 , H05K1/02 , H05K1/0298 , H05K1/0373 , H05K1/181 , H05K1/183 , H05K3/284 , H05K2201/0129 , H05K2203/1316 , H05K2203/1327 , H01L2924/00012 , H01L2924/00014
摘要： A resin molding includes a semiconductor element, a circuit board, and a resin. A conductor connected to the semiconductor element is formed on the circuit board. The resin is adhered and integrated with the circuit board. A resin leakage suppression layer including a material having a higher thermal conductivity than that of a material forming a surface layer of the circuit board is provided in an edge region extending along a portion adhered to the resin in the circuit board and extending along at least one-side side surface of the resin.

7. 发明申请

US20180023983A1 PHYSICAL QUANTITY DETECTION APPARATUS AND ELECTRONIC APPARATUS 审中-公开
公开(公告)号：US20180023983A1
公开(公告)日：2018-01-25
申请号：US15547270
申请日：2015-10-28
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Tsubasa WATANABE , Tsutomu KONO , Hiroaki HOSHIKA , Takahiro MIKI , Takayuki YOGO
IPC分类号： G01D11/24 , F02M35/10
CPC分类号： G01D11/245 , F02D35/02 , F02D37/02 , F02M35/1038 , F02M35/10386 , F02M35/10393 , G01F1/684 , G01F15/14 , G01K1/14 , G01L19/14 , G01N35/00 , G01N2035/00306
摘要： To obtain a physical quantity detection apparatus that can reduce the outer shape of a housing in size.A physical quantity detection apparatus 300 detects a plurality of physical quantities of gas 30 to be measured flowing in a main passage 124. The physical quantity detection apparatus 300 has a housing 302 disposed in the main passage 124, a circuit substrate 400 insert molded in the housing 302, and a plurality of detection sensors 452, 453, 454, 455, and 456 each mounted on each of one face and the other face of the circuit substrate 400.

8. 发明申请

US20190120675A1 PHYSICAL QUANTITY DETECTION DEVICE 审中-公开
公开(公告)号：US20190120675A1
公开(公告)日：2019-04-25
申请号：US16092633
申请日：2017-03-24
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Tsubasa WATANABE , Hiroaki HOSHIKA , Takayuki YOGO
IPC分类号： G01F1/684 , G01F15/14 , G01M15/04
摘要： A physical quantity detection device includes: a housing; a circuit board; a resin material which covers the circuit board; a cover which forms a circuit chamber in which the circuit board is disposed and a flow path through which a gas to be measured passes together with the housing; and a conductor which is disposed to be exposed to the flow path, in which the conductor and the circuit board are electrically connected to each other.

9. 发明申请

US20170115144A1 SENSOR AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20170115144A1
公开(公告)日：2017-04-27
申请号：US15316981
申请日：2015-06-15
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Tsubasa WATANABE , Tsutomu KONO , Hiroaki HOSHIKA , Takayuki YOGO , Takahiro MIKI
IPC分类号： G01F1/38 , H01L23/057 , H01L23/31 , H01L23/498 , H05K1/18 , H05K3/28
CPC分类号： G01F1/38 , G01F1/6845 , G01F1/692 , H01L21/565 , H01L23/057 , H01L23/3121 , H01L23/49838 , H01L23/562 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/4903 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/10158 , H01L2924/15153 , H01L2924/15192 , H01L2924/16195 , H01L2924/181 , H01L2924/19107 , H05K1/181 , H05K1/183 , H05K3/28 , H05K3/284 , H05K2201/10151 , H05K2201/10977 , H05K2203/1316 , H05K2203/1327 , Y02P70/611 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： In a module in which a circuit board is integrally insert molded with a housing while semiconductor parts mounted on the circuit board are exposed, deformation of the circuit board caused by pressure on the circuit board by a mold for blocking the molding resin is reduced. In the module in which the circuit board is integrally insert molded with the housing while the semiconductor parts mounted on the circuit board are exposed, the deformation of the circuit board is reduced by placing a material, which has an elastic modulus smaller than the elastic modulus of the printed circuit board, in the projection area of the mold holding portion on the circuit board.

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