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1. 发明申请

US20200064218A1 PRESSURE DETECTING DEVICE 审中-公开
公开(公告)号：US20200064218A1
公开(公告)日：2020-02-27
申请号：US16466160
申请日：2017-10-25
申请人： Hitachi Automotive Systems, Ltd.
发明人： Hiroshi ONUKI , Daisuke TERADA , Takuya AOYAGI
IPC分类号： G01L19/00 , G01D11/24 , G01L7/08
摘要： There is provided a pressure detecting device whose number of connection points and number of parts are small.A pressure detecting device 100 includes a sensor unit 30 which includes a strain detecting element which detects a strain amount of a pressure receiving surface 11p strained when receiving a pressure, and a processing circuit which processes a signal from the strain detecting element, and includes a housing 10 which houses the sensor unit 30, and terminals 20a and 20c which are connected to the sensor unit 30 and part of which is exposed retractably from the housing 10, and the terminals 20a and 20c include spring mechanisms 22a and 22c which are provided in the housing 10 and can elastically deform.

2. 发明申请

US20190219529A1 Humidity Measuring Apparatus 审中-公开
公开(公告)号：US20190219529A1
公开(公告)日：2019-07-18
申请号：US16301537
申请日：2017-04-11
申请人： Hitachi Automotive Systems, Ltd.
发明人： Masayuki HIO , Ryo ANDO , Takeo HOSOKAWA , Shigenobu KOMATSU , Hiroshi ONUKI
IPC分类号： G01N25/56
CPC分类号： G01N25/56 , G01N27/18
摘要： Provided is a humidity measuring apparatus that can measure a humidity of gas with high accuracy even in an environment with pulsation of gas to be measured, in measuring a humidity of gas with a humidity measuring apparatus using a thermal humidity detecting element. The humidity detecting element is disposed in a space offset from an extension line of a pressure introduction passage in a storage chamber, or a space formed on a depth side of a member provided on an extension line of the pressure introduction passage in the storage chamber such that gas introduced from a pressure introduction port into the pressure introduction passage is bent at least once before reaching the humidity detecting element.

3. 发明申请

US20180202883A1 SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEMICONDUCTOR DEVICE FABRICATING METHOD 审中-公开
公开(公告)号：US20180202883A1
公开(公告)日：2018-07-19
申请号：US15742809
申请日：2016-06-30
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Hanae SHIMOKAWA , Shosaku ISHIHARA , Atsuo SOMA , Junji ONOZUKA , Hiroshi ONUKI , Daisuke TERADA , Mizuki SHIBATA
IPC分类号： G01L9/00 , G01B7/16 , H01L23/00
CPC分类号： G01L9/0055 , G01B7/16 , G01B7/18 , G01L9/00 , H01L24/29 , H01L24/83 , H01L29/84 , H01L2224/29019 , H01L2224/29288 , H01L2224/29387 , H01L2224/29552 , H01L2224/2957 , H01L2224/29575 , H01L2224/29688 , H01L2224/83192 , H01L2224/8389
摘要： A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.

4. 发明申请

US20210123394A1 HUMIDITY MEASUREMENT DEVICE 有权
公开(公告)号：US20210123394A1
公开(公告)日：2021-04-29
申请号：US16494067
申请日：2018-03-08
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Ryo ANDO , Hiroshi ONUKI , Yoshiyuki AKIYAMA , Shigenobu KOMATSU , Takeo HOSOKAWA
IPC分类号： F02D41/30 , G01N25/58 , F02M35/10
摘要： According to the conventional knowledge, a thermal humidity measurement device has problems in which the direction of air flow is limited to one direction is too hard to handle in securing the humidity responsiveness because there are limitations on the mounting direction of the thermal humidity measurement device and the state of air flow.
An introduction guide protrudes from an air introduction surface to the outside of a measurement chamber, is parallel to a humidity introduction port surface, and has a portion not in contact with an inlet surface of a humidity introduction tube as seen from any direction to guide the flow of air to the humidity introduction tube from any direction of 360°.

5. 发明申请

US20190323915A1 Pressure Sensor 审中-公开
公开(公告)号：US20190323915A1
公开(公告)日：2019-10-24
申请号：US16304026
申请日：2017-04-26
申请人： Hitachi Automotive Systems, Ltd.
发明人： Yusuke KAGA , Tomonari MISAWA , Kousaku MORITA , Hiroshi ONUKI
IPC分类号： G01L23/32 , G01L9/00 , G01L19/00 , G01L19/04 , G01L19/14 , G01M15/05
摘要： A pressure sensor includes a connection portion provided with a screw portion configured to fix the pressure sensor to a combustion chamber of a vehicle engine; a hollow liquid-enclosing container fixed to one end of the connection portion; a pressure transmission fluid enclosed inside the liquid-enclosing container; a diaphragm fixed to one end of the liquid-enclosing container and elastically deformed when receiving pressure to transmit the pressure to the pressure transmission fluid; a pressure detection element fixed to the other end of the liquid-enclosing container and detecting the pressure transmitted to the pressure transmission fluid and converts the detected pressure into an electric signal; and a heat-dissipating rod provided inside the liquid-enclosing container. The connection portion and the liquid-enclosing container, and the connection portion and the diaphragm are mechanically connected to each other by welding or the like.

6. 发明申请

US20190310212A1 THERMAL HUMIDITY MEASURING DEVICE 审中-公开
公开(公告)号：US20190310212A1
公开(公告)日：2019-10-10
申请号：US16315424
申请日：2017-07-04
申请人： Hitachi Automotive Systems, Ltd.
发明人： Ryo ANDO , Hiroshi ONUKI , Hiroshi NAKANO , Takeo HOSOKAWA , Masayuki HIO , Shigenobu KOMATSU
IPC分类号： G01N25/56 , G01L19/00 , G01F1/86 , G01K7/00
摘要： It is an object of the present invention to provide a thermal humidity measuring device that has a configuration including a first heating element and a second heating element and that is capable of obtaining a plurality of measurement values (measured values) including humidity measured by the first heating element, by effectively utilizing each of the heating elements.A thermal humidity measuring device 1 includes a first bridge circuit 2 that includes a first heating element 4 that senses humidity, and a second bridge circuit 3 that includes a second heating element 10 that heats air around the first heating element 4. In the thermal humidity measuring device 1, a first output signal Va5 is extracted from the first bridge circuit 2, and the humidity is sensed. A second output signal Va15 is extracted from the second bridge circuit 3, and the second output signal Va15 includes information relating to at least any one of pressure, an air flow rate, and air temperature.

7. 发明申请

US20210190617A1 SENSOR ELEMENT AND METHOD FOR MANUFACTURING SAME, AND SENSOR DEVICE 有权
公开(公告)号：US20210190617A1
公开(公告)日：2021-06-24
申请号：US16754792
申请日：2018-10-10
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Takuya AOYAGI , Ryo ANDO , Kazuhiro OHTA , Kengo SUZUKI , Hiroshi ONUKI , Yasuo ONOSE , Hiroshi NAKANO
IPC分类号： G01L9/04 , G01N27/18 , G01N25/18 , G01L9/00 , G01L19/00
摘要： Provided is a sensor element that can be manufactured without using hydrofluoric acid or hot phosphoric acid solution. A sensor element 100 includes a base material 10 and a semiconductor chip 20 bonded to the base material 10. The semiconductor chip 20 includes a semiconductor substrate 21, a support film 22 provided on a surface 21a of the semiconductor substrate 21, and a substrate chamber 23 provided in a concave shape on the semiconductor substrate 21 to form a cavity facing an element region 22A of the support film 22, an insulating layer 24 provided on a rear surface 21b of the semiconductor substrate 21, and a bonding layer 25 provided between the insulating layer 14 and the base material 10. The insulating layer 24 includes at least one of a silicon oxynitride film and a silicon oxide film. The bonding layer 25 includes a low-melting point glass.

8. 发明申请

US20190128758A1 Physical Quantity Measurement Device, Method for Manufacturing Same, and Physical Quantity Measurement Element 审中-公开
公开(公告)号：US20190128758A1
公开(公告)日：2019-05-02
申请号：US16094001
申请日：2017-04-13
申请人： Hitachi Automotive Systems, Ltd.
发明人： Takuya AOYAGI , Takashi NAITOU , Tatsuya MIYAKE , Mizuki SHIBATA , Hiroshi ONUKI , Daisuke TERADA , Shigenobu KOMATSU
IPC分类号： G01L9/00 , H01L23/00
CPC分类号： G01L9/0048 , G01D21/00 , G01L9/00 , H01L24/29 , H01L24/30 , H01L24/33 , H01L24/83 , H01L29/84 , H01L2224/29188 , H01L2224/30505 , H01L2224/8389
摘要： Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass. A thermal expansion coefficient of the first bonding layer is equal to or lower than a thermal expansion coefficient of the second bonding layer, a softening point of the second bonding layer is equal to or lower than a heat resistant temperature of the semiconductor chip, and a softening point of the first bonding layer is equal to or lower than the softening point of the second bonding layer.

9. 发明申请

US20180241388A1 Semiconductor Device 审中-公开
公开(公告)号：US20180241388A1
公开(公告)日：2018-08-23
申请号：US15518189
申请日：2015-09-18
申请人： Hitachi Automotive Systems, Ltd.
发明人： Shigenobu KOMATSU , Kentarou MIYAJIMA , Hiroshi ONUKI , Junji ONOZUKA
IPC分类号： H03K17/22 , G06F1/30
摘要： The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.

10. 发明申请

US20160313199A1 Pressure Sensor 审中-公开
标题翻译：压力传感器
公开(公告)号：US20160313199A1
公开(公告)日：2016-10-27
申请号：US15035838
申请日：2014-11-12
申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.
发明人： Atsushi KAZAMA , Junji ONOZUKA , Hiroshi ONUKI , Miho TOBITA , Masayuki HIO
IPC分类号： G01L9/00
CPC分类号： G01L9/0055 , G01L9/0044 , G01L19/0038 , G01L19/0084 , G01L19/04
摘要： In a pressure sensor having a configuration in which strain gauges are provided on a diaphragm, a change in sensor characteristic caused by a positional shift of the strain gauges is suppressed, and a change in sensor output in response to a change in temperature is suppressed. The pressure sensor is a pressure sensor obtained by arranging, on a diaphragm having a long side and a short side, a sensor chip in which four strain gauges having the same characteristic and constituting a bridge circuit are provided, the pressure sensor being for detecting, in the bridge circuit, voltage output that is in proportion to a pressure applied to the diaphragm, and the pressure sensor is configured as follows: the four strain gauges are arranged to be adjacent to one another in the vicinity of the center of the diaphragm so that two strain gauges are arranged along the short side and the other two strain gauges are arranged along the long side; and the diaphragm has a thin portion in a long-side direction seen from the sensor chip.
摘要翻译：在具有应变仪设置在隔膜上的结构的压力传感器中，抑制了由应变计的位置偏移引起的传感器特性的变化，并且抑制了响应于温度变化的传感器输出的变化。压力传感器是通过在具有长边和短边的隔膜上布置传感器芯片而获得的压力传感器，其中设置有具有相同特性并构成桥接电路的四个应变计，所述压力传感器用于检测，在桥式电路中，与施加到隔膜的压力成比例的电压输出，并且压力传感器的构造如下：四个应变片布置成在隔膜中心附近彼此相邻，两个应变计沿着短边排列，另外两个应变计沿长边排列; 并且隔膜在从传感器芯片观察的长边方向上具有薄的部分。

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