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1. 发明申请

US20170322600A1 COMPOSITIONS HAVING A MATRIX AND A HYDRATED SALT OF AN ACID AND A GROUP I OR II ELMENT OF THE PERIODIC TABLE DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH 审中-公开
公开(公告)号：US20170322600A1
公开(公告)日：2017-11-09
申请号：US15588212
申请日：2017-05-05
申请人： Henkel IP & Holding GmbH , Henkel AG & Co. KGaA
发明人： My Nhu Nguyen , Qiaohong Huang , Uta Sundermeier
IPC分类号： G06F1/16 , H01L23/552 , H01L23/373 , H01M10/623 , H01M10/613 , C09K5/14 , C09D5/26 , C09D4/00 , H01M10/659 , G06F1/20 , H01L23/367
CPC分类号： G06F1/1656 , C09D4/00 , C09D5/26 , C09K5/063 , C09K5/14 , G06F1/1633 , G06F1/203 , H01L23/3675 , H01L23/373 , H01L23/3735 , H01L23/3736 , H01L23/3737 , H01L23/552 , H01L2924/0002 , H01M10/613 , H01M10/623 , H01M10/659 , H01M2220/30 , H01L2924/00
摘要： Provided herein are compositions made from a matrix and a hydrated salt of an acid and a Group I or II element of the Periodic Table, and electronic devices assembled therewith.

2. 发明申请

US20180226313A1 FORMULATIONS CONTAINING MIXED RESIN SYSTEMS AND THE USE THEREOF FOR WAFER-LEVEL UNDERFILL FOR 3D TSV PACKAGES 审中-公开
公开(公告)号：US20180226313A1
公开(公告)日：2018-08-09
申请号：US15945772
申请日：2018-04-05
申请人： HENKEL IP & HOLDING GMBH , HENKEL AG & CO. KGAA
发明人： Jie Bai , Qiaohong Huang , Hong Jiang , Youko Murata , Yusuke Horiguchi , YounSang Kim , Tadashi Takano
IPC分类号： H01L23/29 , H01L21/56 , C08L63/00 , C08L33/08 , C08L39/04
CPC分类号： H01L23/293 , C08F283/10 , C08G59/18 , C08K3/36 , C08K5/09 , C08L33/04 , C08L33/06 , C08L33/08 , C08L39/04 , C08L63/00 , C08L79/085 , C08L2203/20 , C09D4/06 , C09D163/00 , G01N25/4866 , H01L21/563 , C08F291/10 , C08F220/52 , C08F220/10
摘要： Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

3. 发明授权

US10242923B2 Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages 有权
公开(公告)号：US10242923B2
公开(公告)日：2019-03-26
申请号：US15945772
申请日：2018-04-05
申请人： HENKEL IP & HOLDING GMBH , HENKEL AG & CO. KGAA
发明人： Jie Bai , Qiaohong Huang , Hong Jiang , Youko Murata , Yusuke Horiguchi , YounSang Kim , Tadashi Takano
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/29 , C08G59/18 , C08K5/09 , C08L33/04 , C08L63/00 , C09D4/06 , C08F283/10 , H01L21/56 , C09D163/00 , C08K3/36 , C08L33/06 , C08L79/08 , C08L33/08 , C08L39/04 , G01N25/48
摘要： Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

4. 发明授权

US10519343B2 Pre-applied underfill film containing nano-particulate filler for 3DIC applications, compositions useful for the preparation thereof, and uses thereof 有权
公开(公告)号：US10519343B2
公开(公告)日：2019-12-31
申请号：US15198549
申请日：2016-06-30
申请人： Henkel IP & Holding GmbH
发明人： Qiaohong Huang
IPC分类号： C09J4/06 , C09J9/00 , C09J11/04 , H01L23/29 , H01L23/31
摘要： Provided herein are compositions having a good balance between the curing speed, transparency, tackiness and/or melt viscosity thereof. In one aspect, there are provided compositions containing nano-particulate filler and the use thereof in the preparation of a variety of electronic components, e.g., three-dimensional integrated circuits. In certain aspects, there are provided three-dimensional integrated circuits prepared employing invention compositions (i.e., compositions containing nano-particulate filler), as well as methods for preparing such compositions, and the resulting three-dimensional integrated circuits. In certain aspects, there are also provided methods for improving the curing speed, transparency, tackiness and/or melt viscosity of pre-applied underfill compositions. In certain aspects, there are also provided pre-applied underfill compositions with improved processability.

5. 发明申请

US20160312070A1 PRE-APPLIED UNDERFILL FILM CONTAINING NANO-PARTICULATE FILLER FOR 3DIC APPLICATIONS, COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF, AND USES THEREOF 审中-公开
标题翻译：包含用于3DIC应用的纳米颗粒填料的预应用底层膜，其制备有用的组合物及其用途
公开(公告)号：US20160312070A1
公开(公告)日：2016-10-27
申请号：US15198549
申请日：2016-06-30
申请人： Henkel IP & Holding GmbH
发明人： Qiaohong Huang
IPC分类号： C09J4/06 , H01L23/31 , H01L23/29 , C09J11/04 , C09J9/00
摘要： Provided herein are compositions having a good balance between the curing speed, transparency, tackiness and/or melt viscosity thereof. In one aspect, there are provided compositions containing nano-particulate filler and the use thereof in the preparation of a variety of electronic components, e.g., three-dimensional integrated circuits. In certain aspects, there are provided three-dimensional integrated circuits prepared employing invention compositions (i.e., compositions containing nano-particulate filler), as well as methods for preparing such compositions, and the resulting three-dimensional integrated circuits. In certain aspects, there are also provided methods for improving the curing speed, transparency, tackiness and/or melt viscosity of pre-applied underfill compositions. In certain aspects, there are also provided pre-applied underfill compositions with improved processability.
摘要翻译：本文提供了在固化速度，透明度，粘性和/或熔体粘度之间具有良好平衡的组合物。一方面，提供了含有纳米颗粒填料的组合物及其在制备各种电子部件（例如三维集成电路）中的用途。在某些方面，提供了使用本发明组合物（即含有纳米颗粒填料的组合物）制备的三维集成电路，以及制备这种组合物的方法以及所得到的三维集成电路。在某些方面，还提供了改进预先施加的底部填充组合物的固化速度，透明度，粘合性和/或熔体粘度的方法。在某些方面，还提供了具有改进的可加工性的预先施加的底部填充组合物。

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