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1. 发明授权

US08697828B2 Hydrosilicone resin and preparation process thereof 失效
标题翻译：氢硅氧烷树脂及其制备方法
公开(公告)号：US08697828B2
公开(公告)日：2014-04-15
申请号：US13803538
申请日：2013-03-14
申请人： Henkel China Co. Ltd. , Henkel AG & Co. KGAA
发明人： Zhiming Li , Wentao Xing , Wenjuan Tan , Liwei Zhang , Yong Zhang , Thomas Plantenberg , Leticia Borque
IPC分类号： C08G77/00 , C08G77/04 , C08G77/06 , C08G77/12
CPC分类号： C08G77/06 , C08G77/04 , C08G77/12 , C08L83/04
摘要： The present invention relates to a liquid hydrosilicone resin and a preparation process thereof. The average composition of the liquid hydrosilicone resin is represented by the following formula: (R1R2R3SiO1/2)M.(R4R5SiO2/2)D. (R6SiO3/2)T.(SiO4/2)Q wherein R1 to R6 are identical or different radicals independently selected from the group consisting of organic groups and a hydrogen atom, with the proviso that at least one of R1to R6 is a hydrogen atom bonded directly to a silicon atom.The liquid hydrosilicone resin is obtained by dispersing a hydrosilicone oil, a hydroxyl silicone resin and a dehydrogenation catalyst in a solvent to form a dispersion, allowing the dispersion to react, and then removing the solvent and the catalyst.
摘要翻译：本发明涉及一种液体氢硅树脂及其制备方法。液体氢硅氧烷树脂的平均组成由下式表示：（R1R2R3SiO1 / 2）M（R4R5SiO2 / 2）D。（R6SiO3 / 2）T.（SiO4 / 2）Q其中R1至R6是独立地选自有机基团和氢原子的相同或不同的基团，条件是至少一个R 1至R 6是氢原子直接与硅原子键合。通过将氢硅油，羟基硅氧烷树脂和脱氢催化剂分散在溶剂中来形成分散体，使分散体反应，然后除去溶剂和催化剂，得到液体氢硅树脂。

2. 发明申请

US20130197254A1 HYDROSILICONE RESIN AND PREPARATION PROCESS THEREOF 失效
标题翻译：氢化硅树脂及其制备方法
公开(公告)号：US20130197254A1
公开(公告)日：2013-08-01
申请号：US13803538
申请日：2013-03-14
申请人： HENKEL CHINA CO., LTD. , HENKEL AG & CO. KGAA
发明人： Zhiming Li , Wentao Xing , Wenjuan Tan , Liwei Zhang , Yong Zhang , Thomas Plantenberg , Leticia Borque
IPC分类号： C08G77/06 , C08G77/04
CPC分类号： C08G77/06 , C08G77/04 , C08G77/12 , C08L83/04
摘要： The present invention relates to a liquid hydrosilicone resin and a preparation process thereof. The average composition of the liquid hydrosilicone resin is represented by the following formula: (R1R2R3SiO1/2)M·(R4R6SiO2/2)D·(R6SiO3/2)T·(SiO4/2)Q wherein R1 to R6 are identical or different radicals independently selected from the group consisting of organic groups and a hydrogen atom, with the proviso that at least one of R1to R6 is a hydrogen atom bonded directly to a silicon atom.The liquid hydrosilicone resin is obtained by dispersing a hydrosilicone oil, a hydroxyl silicone resin and a dehydrogenation catalyst in a solvent to form a dispersion, allowing the dispersion to react, and then removing the solvent and the catalyst.
摘要翻译：本发明涉及一种液体氢硅树脂及其制备方法。液体氢硅氧烷树脂的平均组成由下式表示：（R1R2R3SiO1 / 2）M·（R4R6SiO2 / 2）D·（R6SiO3 / 2）T·（SiO4 / 2）Q其中R1〜R6相同或不同独立地选自有机基团和氢原子的基团，条件是R 1至R 6中的至少一个是直接键合到硅原子上的氢原子。通过将氢硅油，羟基硅氧烷树脂和脱氢催化剂分散在溶剂中来形成分散体，使分散体反应，然后除去溶剂和催化剂，得到液体氢硅树脂。

3. 发明申请

US20220025181A1 Thermally Conductive Silicone Potting Composition 有权
公开(公告)号：US20220025181A1
公开(公告)日：2022-01-27
申请号：US17496895
申请日：2021-10-08
申请人： Henkel AG & Co. KGaA
发明人： Wentao Xing , Yizhen Wang , Hao Wu , Xueyu Qiu , Xinyu Zhang , Xingyu Zhu
IPC分类号： C08L83/04 , C08K3/22 , C08G77/08 , C08G77/12 , C08G77/20 , C08G77/00 , C09J183/04
摘要： The present invention provides a thermally conductive silicone potting composition. In one embodiment the thermally conductive silicone potting composition comprises: a first part comprising: (a) a vinyl organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 μm and less than 3 μm, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 μm and less than 15 μm, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 μm and less than or equal to 100 μm, (f) a catalyst, and a second part comprising: (b) a hydride organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 μm and less than 3 μm, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 μm and less than 15 μm, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 μm and less than or equal to 100 μm. The present invention also provides a thermal potting adhesive containing the thermally conductive silicone potting composition, a use of the thermally conductive silicone potting composition in an electronic component, and an electronic component, which is potted using the thermally conductive silicone potting composition.

4. 发明授权

US09994681B2 Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same 有权
公开(公告)号：US09994681B2
公开(公告)日：2018-06-12
申请号：US15647648
申请日：2017-07-12
申请人： Henkel AG & Co. KGaA
发明人： Hao Wu , Wenjuan Tan , Wentao Xing , Yong Zhang , Mieko Sano , Aya Hikita , Tadashi Takano , Liwei Zhang , Carol Yang , Zhiming Li , Juan Du
IPC分类号： C08G77/20 , C08G77/12 , C08K5/3477 , C08G77/08
CPC分类号： C08G77/20 , C08G77/08 , C08G77/12 , C08G77/388 , C08K5/3477 , C08L83/04 , C08L83/08 , H01L33/56 , C08K5/34924 , C08K5/56 , C08L83/00
摘要： The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.

5. 发明申请

US20170306100A1 Organopolysiloxane Prepolymer and a Curable Organopolysiloxane Composition Comprising the Same 有权
公开(公告)号：US20170306100A1
公开(公告)日：2017-10-26
申请号：US15647648
申请日：2017-07-12
申请人： Henkel AG & Co. KGaA
发明人： Hao Wu , Wenjuan Tan , Wentao Xing , Yong Zhang , Mieko Sano , Aya Hikita , Tadashi Takano , Liwei Zhang , Carol Yang , Zhiming Li , Juan Du
IPC分类号： C08G77/20 , C08G77/08 , C08G77/12 , C08K5/3477
CPC分类号： C08G77/20 , C08G77/08 , C08G77/12 , C08G77/388 , C08K5/3477 , C08L83/04 , C08L83/08 , H01L33/56 , C08K5/34924 , C08K5/56 , C08L83/00
摘要： The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.

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