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    • 1. 发明申请
    • Avalanche quantum intersubband transition semiconductor laser
    • 雪崩量子子带内过渡半导体激光器
    • US20070064757A1
    • 2007-03-22
    • US11492920
    • 2006-07-26
    • Gyung Ock KimIn Gyoo KimKi Joong LeeCheol Kyun Lee
    • Gyung Ock KimIn Gyoo KimKi Joong LeeCheol Kyun Lee
    • H01S5/00
    • H01S5/3402B82Y20/00
    • Provided is an avalanche quantum intersubband transition semiconductor laser. The laser includes: a first cladding layer, a first wave guide layer, an active region, a second wave guide layer, and a second cladding layer formed on a semiconductor substrate, wherein the active region consists of multiple stacks (periods) of a unit-cell structure, which is comprised of a carrier-multiplication layer structure for multiplying carriers, a carrier guide layer structure, and an QW active region to which carriers are injected, wherein intersubband optical radiative transitions of the carriers occur. Here, the carriers multiplied while passing though the carrier-multiplication layer structure, and injected into a optical transition level of the QW active region can achieve the high population inversion effectively, thereby high laser output power can be obtained with less stacked compact structure.
    • 提供了一种雪崩量子子带内过渡半导体激光器。 激光器包括:形成在半导体衬底上的第一覆层,第一波导层,有源区,第二波导层和第二覆层,其中有源区由单元的多个堆叠(周期)组成 - 单元结构,其由用于乘法器的载波倍增层结构,载波引导层结构和注入载流子的QW有源区组成,其中载波的子带间光辐射跃迁发生。 这里,载波在通过载波倍增层结构的同时相乘,并且注入到QW有源区的光跃迁电平中可以有效地实现高群体反转,从而可以获得较小的堆叠紧凑结构的高激光输出功率。
    • 7. 发明授权
    • Semiconductor devices and methods of forming the same
    • 半导体器件及其形成方法
    • US08288185B2
    • 2012-10-16
    • US12788542
    • 2010-05-27
    • In Gyoo KimDae Seo ParkJun Taek HongGyungock Kim
    • In Gyoo KimDae Seo ParkJun Taek HongGyungock Kim
    • H01L21/00
    • H01L21/7624H01L21/76243H01L21/76264H01L29/0657
    • Provided are a semiconductor device and a method of forming the same. According to the method, a first buried oxide layer is locally formed in a semiconductor substrate and a core semiconductor pattern of a line form, a pair of anchor-semiconductor patterns and a support-semiconductor pattern are formed by patterning a semiconductor layer on the first buried oxide layer to expose the first buried oxide layer. The pair of anchor-semiconductor patterns contact both ends of the core semiconductor pattern, respectively, and the support-semiconductor pattern contacts one sidewall of the core semiconductor pattern, the first buried oxide layer below the core semiconductor pattern is removed. At this time, a portion of the first buried oxide layer below each of the anchor-semiconductor patterns and a portion of the first buried oxide layer below the support-semiconductor pattern remain. A second buried oxide layer is formed to fill a region where the first buried oxide layer below the core semiconductor pattern.
    • 提供半导体器件及其形成方法。 根据该方法,在半导体衬底中局部地形成第一掩埋氧化物层,并且通过在第一衬底上图案化半导体层来形成线形式的芯半导体图案,一对锚半导体图案和支撑半导体图案 埋入氧化物层以暴露第一掩埋氧化物层。 一对锚半导体图案分别接触芯半导体图案的两端,并且支撑半导体图案接触芯半导体图案的一个侧壁,去除芯半导体图案下方的第一掩埋氧化物层。 此时,保留在半导体图案的每一个下面的第一掩埋氧化物层的一部分和位于载体半导体图案之下的第一掩埋氧化物层的一部分。 形成第二掩埋氧化物层以填充在芯半导体图案之下的第一掩埋氧化物层的区域。