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    • 1. 发明申请
    • Electrically rewritable non-volatile memory element and method of manufacturing the same
    • 电可重写非易失性存储元件及其制造方法
    • US20070096074A1
    • 2007-05-03
    • US11264129
    • 2005-11-02
    • Isamu AsanoNatsuki SatoTyler LowreyGuy WickerWolodymyr CzubatyjStephen Hudgens
    • Isamu AsanoNatsuki SatoTyler LowreyGuy WickerWolodymyr CzubatyjStephen Hudgens
    • H01L47/00
    • H01L45/06H01L27/2436H01L45/1233H01L45/126H01L45/144H01L45/148
    • A non-volatile memory element includes a first interlayer insulation layer 11 having a first through-hole 11a, a second interlayer insulation layer 12 having a second through-hole 12a formed on the first interlayer insulation layer 11, a bottom electrode 13 provided in the first through-hole 11, recording layer 15 containing phase change material provided in the second through-hole 12, a top electrode 16 provided on the second interlayer insulation layer 12, and a thin-film insulation layer 14 formed between the bottom electrode 13 and the recording layer 15. In accordance with this invention, the diameter D1 of a bottom electrode 13 buried in a first through-hole 11a is smaller than the diameter D2 of a second through-hole 12a, thereby decreasing the thermal capacity of the bottom electrode 13. Therefore, when a pore 14a is formed by dielectric breakdown in a thin-film insulation layer 14 and the vicinity is used as a heating region, the amount of heat escaping to the bottom electrode 13 is decreased, resulting in higher heating efficiency.
    • 非易失性存储元件包括具有第一通孔11a的第一层间绝缘层11,具有形成在第一层间绝缘层11上的第二通孔12a的第二层间绝缘层12, 在第一通孔11中,设置在第二通孔12中的包含相变材料的记录层15,设置在第二层间绝缘层12上的顶部电极16和形成在第二通孔12的底部电极之间的薄膜绝缘层14 13和记录层15。 根据本发明,埋在第一通孔11a中的底部电极13的直径D 1小于第二通孔12a的直径D 2,从而降低底部电极13的热容量 。 因此,当通过薄膜绝缘层14中的电介质击穿形成孔14a并且将其附近用作加热区域时,逸出到底部电极13的热量减少,导致更高的加热效率。
    • 2. 发明授权
    • Chalcogenide devices exhibiting stable operation from the as-fabricated state
    • 表现出从制造状态稳定运行的硫族化物装置
    • US07786462B2
    • 2010-08-31
    • US11975615
    • 2007-10-19
    • Sergey A. KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • Sergey A. KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • H01L29/02H01L29/06G11C11/00
    • H01L45/06H01L45/1233H01L45/144H01L45/1625
    • A chalcogenide material and chalcogenide memory device having less stringent requirements for formation, improved thermal stability and/or faster operation. The chalcogenide materials include materials comprising Ge, Sb and Te in which the Ge and/or Te content is lean relative to the commonly used Ge2Sb2Te5 chalcogenide composition. Electrical devices containing the instant chalcogenide materials show a rapid convergence of the set resistance during cycles of setting and resetting the device from its as-fabricated state, thus leading to a reduced or eliminated need to subject the device to post-fabrication electrical formation prior to end-use operation. Improved thermal stability is manifested in terms of prolonged stability of the resistance of the device at elevated temperatures, which leads to an inhibition of thermally induced setting of the reset state in the device. Significant improvements in the 10 year data retention temperature are demonstrated. Faster device operation is achieved through an increased speed of crystallization, which acts to shorten the time required to transform the chalcogenide material from its reset state to its set state in an electrical memory device.
    • 一种硫族化物材料和硫族化物记忆装置,其对形成,改进的热稳定性和/或更快的操作要求不太严格。 硫属化物材料包括Ge,Sb和Te的材料,其中Ge和/或Te含量相对于通常使用的Ge 2 Sb 2 Te 5硫族化物组合物是稀的。 包含瞬时硫族化物材料的电气装置显示设定循环期间的设定电阻的快速收敛以及将器件从其制造状态复位,从而导致减少或消除了将器件置于后制造电形成之前 最终使用操作。 改进的热稳定性表现在器件在升高的温度下的电阻的延长的稳定性,这导致抑制器件中复位状态的热诱导设置。 展示了10年数据保存温度的显着改进。 通过提高结晶速度实现更快的器件操作,其用于缩短将硫族化物材料从其复位状态转换到其在电存储器件中的设定状态所需的时间。
    • 4. 发明申请
    • Chalcogenide devices and materials having reduced germanium or telluruim content
    • 硫族化物装置和具有降低的锗或碲化物含量的材料
    • US20070034851A1
    • 2007-02-15
    • US11301211
    • 2005-12-12
    • Sergey KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • Sergey KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • H01L47/00
    • H01L45/06H01L45/1233H01L45/144H01L45/1625
    • A chalcogenide material and chalcogenide memory device exhibiting fast operation (short set pulse times) over an extended range of reset state resistances. Electrical devices containing the instant chalcogenide materials permit rapid transformations from the reset state to the set state for reset and set states having a high resistance ratio. The instant devices thus provide for high resistance contrast and improved readability of memory states while preserving fast operational speeds for the device. The chalcogenide materials include materials comprising Ge, Sb and Te in which the Ge and/or Te content is lean relative to the commonly used Ge2Sb2Te5 chalcogenide composition. In one embodiment, the atomic concentration of Ge is between 11% and 22%, the atomic concentration of Sb is between 22% and 65%, and the atomic concentration of Te is between 28% and 55%. In a preferred embodiment, the atomic concentration of Ge is between 15% and 18%, the atomic concentration of Sb is between 32% and 35%, and the atomic concentration of Te is between 48% and 51%.
    • 硫化物材料和硫族化物存储器件在复位状态电阻的延长范围内表现出快速操作(短脉冲时间)。 包含瞬时硫族化物材料的电气装置允许从复位状态到设定状态的快速转换以及具有高电阻比的置位状态。 因此,即时设备提供高电阻对比度和改善存储器状态的可读性,同时保持设备的快速操作速度。 硫属化物材料包括Ge,Sb和Te的材料,其中Ge和/或Te含量相对于通常使用的Ge 2 Sb 2 Te 5是稀的 硫族化合物组合物。 在一个实施方案中,Ge的原子浓度为11%至22%,Sb的原子浓度为22%至65%,Te的原子浓度为28%至55%。 在优选的实施方式中,Ge的原子浓度为15%〜18%,Sb的原子浓度为32%〜35%,Te的原子浓度为48%〜51%。
    • 5. 发明申请
    • Chalcogenide Devices Exhibiting Stable Operation from the As-Fabricated State
    • 从制造国展示稳定运行的硫族化物装置
    • US20100321991A1
    • 2010-12-23
    • US12871975
    • 2010-08-31
    • Sergey A. KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • Sergey A. KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • G11C11/00
    • H01L45/06H01L45/1233H01L45/144H01L45/1625
    • A chalcogenide material and chalcogenide memory device having less stringent requirements for formation, improved thermal stability and/or faster operation. The chalcogenide materials include materials comprising Ge, Sb and Te in which the Ge and/or Te content is lean relative to the commonly used Ge2Sb2Te5 chalcogenide composition. Electrical devices containing the instant chalcogenide materials show a rapid convergence of the set resistance during cycles of setting and resetting the device from its as-fabricated state, thus leading to a reduced or eliminated need to subject the device to post-fabrication electrical formation prior to end-use operation. Improved thermal stability is manifested in terms of prolonged stability of the resistance of the device at elevated temperatures, which leads to an inhibition of thermally induced setting of the reset state in the device. Significant improvements in the 10 year data retention temperature are demonstrated. Faster device operation is achieved through an increased speed of crystallization, which acts to shorten the time required to transform the chalcogenide material from its reset state to its set state in an electrical memory device.
    • 一种硫族化物材料和硫族化物记忆装置,其对形成,改进的热稳定性和/或更快的操作要求不太严格。 硫属化物材料包括Ge,Sb和Te的材料,其中Ge和/或Te含量相对于通常使用的Ge 2 Sb 2 Te 5硫族化物组合物是稀的。 包含瞬时硫族化物材料的电气装置显示设定循环期间的设定电阻的快速收敛以及将器件从其制造状态复位,从而导致减少或消除了将器件置于后制造电形成之前 最终使用操作。 改进的热稳定性表现在器件在升高的温度下的电阻的延长的稳定性,这导致抑制器件中复位状态的热诱导设置。 展示了10年数据保存温度的显着改进。 通过提高结晶速度实现更快的器件操作,其用于缩短将硫族化物材料从其复位状态转换到其在电存储器件中的设定状态所需的时间。
    • 8. 发明授权
    • Chalcogenide devices and materials having reduced germanium or telluruim content
    • 硫族化物装置和具有降低的锗或碲化物含量的材料
    • US07525117B2
    • 2009-04-28
    • US11301211
    • 2005-12-12
    • Sergey A. KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • Sergey A. KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • H01L29/02
    • H01L45/06H01L45/1233H01L45/144H01L45/1625
    • A chalcogenide material and memory device exhibiting fast operation over an extended range of reset state resistances. Electrical devices containing the chalcogenide materials permit rapid transformations from the reset state to the set state for reset and set states having a high resistance ratio. The devices provide for high resistance contrast of memory states while preserving fast operational speeds. The chalcogenide materials include Ge, Sb and Te where the Ge and/or Te content is lean relative to Ge2Sb2Te5. In one embodiment, the concentration of Ge is between 11% and 22%, the concentration of Sb is between 22% and 65%, and the concentration of Te is between 28% and 55%. In a preferred embodiment, the concentration of Ge is between 15% and 18%, the concentration of Sb is between 32% and 35%, and the concentration of Te is between 48% and 51%.
    • 在扩展的复位状态电阻范围内呈现快速操作的硫族化物材料和存储器件。 含有硫族化物材料的电气装置允许从复位状态到设定状态的快速转换以及具有高电阻比的设定状态。 这些器件提供高电阻对比度的存储器状态,同时保持快速的操作速度。 硫族化物材料包括Ge,Sb和Te,其中Ge和/或Te含量相对于Ge 2 Sb 2 Te 5是贫的。 在一个实施方案中,Ge的浓度为11%至22%,Sb的浓度为22%至65%,Te的浓度为28%至55%。 在优选的实施方案中,Ge的浓度为15%至18%,Sb的浓度为32%至35%,Te的浓度为48%至51%。
    • 9. 发明申请
    • Chalcogenide devices incorporating chalcogenide materials having reduced germanium or telluruim content
    • 含有具有降低的锗或碲化物含量的硫族化物材料的硫族化物装置
    • US20070034850A1
    • 2007-02-15
    • US11200466
    • 2005-08-09
    • Sergey KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • Sergey KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • H01L47/00
    • H01L45/06H01L45/1233H01L45/144H01L45/1625
    • A chalcogenide material and chalcogenide memory device having less stringent requirements for formation, improved thermal stability and/or faster operation. The chalcogenide materials include materials comprising Ge, Sb and Te in which the Ge and/or Te content is lean relative to the commonly used Ge2Sb2Te5 chalcogenide composition. Electrical devices containing the instant chalcogenide materials show a rapid convergence of the set resistance during cycles of setting and resetting the device from its as-fabricated state, thus leading to a reduced or eliminated need to subject the device to post-fabrication electrical formation prior to end-use operation. Improved thermal stability is manifested in terms of prolonged stability of the resistance of the device at elevated temperatures, which leads to an inhibition of thermally induced setting of the reset state in the device. Significant improvements in the 10 year data retention temperature are demonstrated. Faster device operation is achieved through an increased speed of crystallization, which acts to shorten the time required to transform the chalcogenide material from its reset state to its set state in an electrical memory device.
    • 一种硫族化物材料和硫族化物记忆装置,其对形成,改进的热稳定性和/或更快的操作要求不太严格。 硫属化物材料包括Ge,Sb和Te的材料,其中Ge和/或Te含量相对于通常使用的Ge 2 Sb 2 Te 5是稀的 硫族化合物组合物。 包含瞬时硫族化物材料的电气装置显示设定循环期间的设定电阻的快速收敛以及将器件从其制造状态复位,从而导致减少或消除了将器件置于后制造电形成之前 最终使用操作。 改进的热稳定性表现在器件在升高的温度下的电阻的延长的稳定性,这导致抑制器件中复位状态的热诱导设置。 展示了10年数据保存温度的显着改进。 通过提高结晶速度实现更快的器件操作,其用于缩短将硫族化物材料从其复位状态转换到其在电存储器件中的设定状态所需的时间。