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1. 发明授权

US07012439B2 Multiple directional scans of test structures on semiconductor integrated circuits 有权
标题翻译：半导体集成电路测试结构的多方向扫描
公开(公告)号：US07012439B2
公开(公告)日：2006-03-14
申请号：US11058943
申请日：2005-02-15
申请人： Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V. S. Satya , Robert Thomas Long , David J. Walker
发明人： Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V. S. Satya , Robert Thomas Long , David J. Walker
IPC分类号： G01R31/304
CPC分类号： H01L22/34 , G01N21/66 , G01N21/956 , G01N23/04 , G01R31/2884 , G01R31/307 , H01J2237/2817 , Y10S977/849
摘要： Disclosed is a method of inspecting a sample. The sample is scanned in a first direction with at least one particle beam. The sample is scanned in a second direction with at least one particle beam. The second direction is at an angle to the first direction. The number of defects per an area of the sample are found as a result of the first scan, and the position of one or more of the found defects is determined from the second scan. In a specific embodiment, the sample includes a test structure having a plurality of test elements thereon. A first portion of the test elements is exposed to the beam during the first scan to identify test elements having defects, and a second portion of the test elements is exposed during the second scan to isolate and characterize the defect.
摘要翻译：公开了一种检查样品的方法。用至少一个粒子束沿第一方向扫描样品。用至少一个粒子束在第二个方向上扫描样品。第二方向与第一方向成一个角度。作为第一扫描的结果，发现样品的每个区域的缺陷数，并且从第二次扫描确定发现的一个或多个缺陷的位置。在具体实施例中，样本包括其上具有多个测试元件的测试结构。测试元件的第一部分在第一次扫描期间暴露于光束以识别具有缺陷的测试元件，并且第二部分测试元件在第二次扫描期间暴露以分离和表征缺陷。

2. 发明授权

US06566885B1 Multiple directional scans of test structures on semiconductor integrated circuits 有权
标题翻译：半导体集成电路测试结构的多方向扫描
公开(公告)号：US06566885B1
公开(公告)日：2003-05-20
申请号：US09648109
申请日：2000-08-25
申请人： Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V. S. Satya , Robert Thomas Long , David J. Walker
发明人： Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V. S. Satya , Robert Thomas Long , David J. Walker
IPC分类号： G01R3100
CPC分类号： H01L22/34 , G01N21/66 , G01N21/956 , G01N23/04 , G01R31/2884 , G01R31/307 , H01J2237/2817 , Y10S977/849
摘要： A sample is inspected. The sample is scanned in a first direction with at least one particle beam. The sample is scanned in a second direction with at least one particle beam. The second direction is at an angle to the first direction. The number of defects per an area of the sample are found as a result of the first scan, and the position of one or more of the found defects is determined from the second scan. In a specific embodiment, the sample includes a test structure having a plurality of test elements thereon. A first portion of the test elements is exposed to the beam during the first scan to identify test elements having defects, and a second portion of the test elements is exposed during the second scan to isolate and characterize the defect.
摘要翻译：检查样品。用至少一个粒子束沿第一方向扫描样品。用至少一个粒子束在第二个方向上扫描样品。第二方向与第一方向成一个角度。作为第一扫描的结果，发现样品的每个区域的缺陷数，并且从第二次扫描确定发现的一个或多个缺陷的位置。在具体实施例中，样本包括其上具有多个测试元件的测试结构。测试元件的第一部分在第一次扫描期间暴露于光束以识别具有缺陷的测试元件，并且第二部分测试元件在第二次扫描期间暴露以分离和表征缺陷。

3. 发明授权

US07656170B2 Multiple directional scans of test structures on semiconductor integrated circuits 有权
标题翻译：半导体集成电路测试结构的多方向扫描
公开(公告)号：US07656170B2
公开(公告)日：2010-02-02
申请号：US11675013
申请日：2007-02-14
申请人： Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V. S. Satya , Padma A. Satya, legal representative , Robert Thomas Long , David J. Walker
发明人： Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V. S. Satya , Robert Thomas Long , David J. Walker
IPC分类号： G01R31/02
CPC分类号： H01L23/5226 , H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a method of inspecting a sample. The sample is scanned in a first direction with at least one particle beam. The sample is scanned in a second direction with at least one particle beam. The second direction is at an angle to the first direction. The number of defects per an area of the sample are found as a result of the first scan, and the position of one or more of the found defects is determined from the second scan. In a specific embodiment, the sample includes a test structure having a plurality of test elements thereon. A first portion of the test elements is exposed to the beam during the first scan to identify test elements having defects, and a second portion of the test elements is exposed during the second scan to isolate and characterize the defect.
摘要翻译：公开了一种检查样品的方法。用至少一个粒子束沿第一方向扫描样品。用至少一个粒子束在第二个方向上扫描样品。第二方向与第一方向成一个角度。作为第一扫描的结果，发现样品的每个区域的缺陷数，并且从第二次扫描确定发现的一个或多个缺陷的位置。在具体实施例中，样本包括其上具有多个测试元件的测试结构。测试元件的第一部分在第一次扫描期间暴露于光束以识别具有缺陷的测试元件，并且第二部分测试元件在第二次扫描期间暴露以分离和表征缺陷。

4. 发明授权

US06867606B2 Multiple directional scans of test structures on semiconductor integrated circuits 有权
公开(公告)号：US06867606B2
公开(公告)日：2005-03-15
申请号：US10390502
申请日：2003-03-13
申请人： Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V. S. Satya , Robert Thomas Long , David J. Walker
发明人： Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V. S. Satya , Robert Thomas Long , David J. Walker
IPC分类号： G01N21/66 , G01N21/95 , G01N21/956 , G01N23/04 , G01Q30/16 , G01Q60/44 , G01R31/28 , G01R31/307 , H01L23/544 , G01R31/304
CPC分类号： H01L22/34 , G01N21/66 , G01N21/956 , G01N23/04 , G01R31/2884 , G01R31/307 , H01J2237/2817 , Y10S977/849
摘要： Disclosed is a method of inspecting a sample. The sample is scanned in a first direction with at least one particle beam. The sample is scanned in a second direction with at least one particle beam. The second direction is at an angle to the first direction. The number of defects per an area of the sample are found as a result of the first scan, and the position of one or more of the found defects is determined from the second scan. In a specific embodiment, the sample includes a test structure having a plurality of test elements thereon. A first portion of the test elements is exposed to the beam during the first scan to identify test elements having defects, and a second portion of the test elements is exposed during the second scan to isolate and characterize the defect.

5. 发明授权

US06445199B1 Methods and apparatus for generating spatially resolved voltage contrast maps of semiconductor test structures 有权
标题翻译：用于生成半导体测试结构的空间分辨电压对比图的方法和装置
公开(公告)号：US06445199B1
公开(公告)日：2002-09-03
申请号：US09648379
申请日：2000-08-25
申请人： Akella V. S. Satya , Brian C. Leslie , Gustavo A. Pinto , Robert Thomas Long , Neil Richardson , Bin-Ming Benjamin Tsai
发明人： Akella V. S. Satya , Brian C. Leslie , Gustavo A. Pinto , Robert Thomas Long , Neil Richardson , Bin-Ming Benjamin Tsai
IPC分类号： G01R31308
CPC分类号： H01L22/34 , G01N21/66 , G01N21/956 , G01R31/2884 , G01R31/307 , H01J2237/2817
摘要： Disclosed is a method of inspecting a sample. The sample is illuminated with an incident beam, thereby causing voltage contrast within structures present on the sample. Voltage contrast is detected within the structures. Information from the detected voltage contrast is stored, and position data concerning the location of features corresponding to at least a portion of the stored voltage contrast information is also stored. In a specific embodiment, the features represent electrical defects present on the sample. In another embodiment, the stored position data is in the form of a two dimensional map. In another aspect, the sample is re-inspected and the stored position data is used in analyzing data resulting from the re-inspection.
摘要翻译：公开了一种检查样品的方法。样品用入射光照射，从而在样品中存在的结构内引起电压对比。在结构内检测到电压对比度。存储来自检测到的电压对比度的信息，并且还存储与存储的电压对比度信息的至少一部分相对应的特征位置的位置数据。在具体实施例中，特征表示样品上存在的电缺陷。在另一个实施例中，存储的位置数据是二维地图的形式。在另一方面，重新检查样本，并且将存储的位置数据用于分析由重新检查产生的数据。

6. 发明授权

US06433561B1 Methods and apparatus for optimizing semiconductor inspection tools 有权
标题翻译：优化半导体检测工具的方法和设备
公开(公告)号：US06433561B1
公开(公告)日：2002-08-13
申请号：US09648096
申请日：2000-08-25
申请人： Akella V. S. Satya , Gustavo A. Pinto , Robert Thomas Long , Bin-Ming Benjamin Tsai , Brian C. Leslie
发明人： Akella V. S. Satya , Gustavo A. Pinto , Robert Thomas Long , Bin-Ming Benjamin Tsai , Brian C. Leslie
IPC分类号： G01R31308
CPC分类号： H01L22/34 , G01N21/66 , G01N21/956 , G01R31/2884 , G01R31/307 , H01J2237/2817
摘要： Disclosed is a method of inspecting a sample. At least a portion of the sample is illuminated. Signals received from the illuminated portion are detected, and the detected signals are processed to find defects present on the sample. The processing of the detected signals is optimized, at least in part, based upon results obtained from voltage contrast testing. In one implementation, the illumination is an optical illumination. In another embodiment, the processing comprises automated defect classification, and setup of the automated classification is optimized using the results obtained from voltage contrast testing. In another implementation, the results relate to a probability that a feature present on the sample represents an electrical defect.
摘要翻译：公开了一种检查样品的方法。样品的至少一部分被照亮。检测从照明部分接收到的信号，并且处理检测到的信号以发现样品上存在的缺陷。检测到的信号的处理被优化，至少部分地基于从电压对比度测试获得的结果。在一个实施方案中，照明是光学照明。在另一个实施例中，处理包括自动化缺陷分类，并且使用从电压对比度测试获得的结果来优化自动化分类的建立。在另一实现中，结果涉及样品上存在的特征表示电缺陷的概率。

7. 发明申请

US20080237487A1 MULTIPLE DIRECTIONAL SCANS OF TEST STRUCTURES ON SEMICONDUCTOR INTEGRATED CIRCUITS 有权
标题翻译：半导体集成电路测试结构的多个方向扫描
公开(公告)号：US20080237487A1
公开(公告)日：2008-10-02
申请号：US11675013
申请日：2007-02-14
申请人： Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V.S. Satya , Robert Thomas Long , David J. Walker , Padma A. Satya
发明人： Gustavo A. Pinto , Brian C. Leslie , David L. Adler , Akella V.S. Satya , Robert Thomas Long , David J. Walker , Padma A. Satya
IPC分类号： G21G5/00
CPC分类号： H01L23/5226 , H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a method of inspecting a sample. The sample is scanned in a first direction with at least one particle beam. The sample is scanned in a second direction with at least one particle beam. The second direction is at an angle to the first direction. The number of defects per an area of the sample are found as a result of the first scan, and the position of one or more of the found defects is determined from the second scan. In a specific embodiment, the sample includes a test structure having a plurality of test elements thereon. A first portion of the test elements is exposed to the beam during the first scan to identify test elements having defects, and a second portion of the test elements is exposed during the second scan to isolate and characterize the defect.
摘要翻译：公开了一种检查样品的方法。用至少一个粒子束沿第一方向扫描样品。用至少一个粒子束在第二个方向上扫描样品。第二方向与第一方向成一个角度。作为第一扫描的结果，发现样品的每个区域的缺陷数，并且从第二次扫描确定发现的一个或多个缺陷的位置。在具体实施例中，样本包括其上具有多个测试元件的测试结构。测试元件的第一部分在第一次扫描期间暴露于光束以识别具有缺陷的测试元件，并且第二部分测试元件在第二次扫描期间暴露以分离和表征缺陷。

8. 发明授权

US07477372B2 Optical scanning system for surface inspection 失效
标题翻译：光学扫描系统进行表面检查
公开(公告)号：US07477372B2
公开(公告)日：2009-01-13
申请号：US11738989
申请日：2007-04-23
申请人： Brian C. Leslie , Mehrdad Nikoonahad , Keith B. Wells
发明人： Brian C. Leslie , Mehrdad Nikoonahad , Keith B. Wells
IPC分类号： G01N21/00
CPC分类号： G01N21/95607 , G01N21/94 , G01N21/9501
摘要： In an optical scanning system for detecting particles and pattern defects on a sample surface, a light beam is focused to an illuminated spot on the surface and the spot is scanned across the surface along a scan line. A detector is positioned adjacent to the surface to collect scattered light from the spot where the detector includes a one- or two-dimensional array of sensors. Light scattered from the illuminated spot at each of a plurality of positions along the scan line is focused onto a corresponding sensor in the array. A plurality of detectors symmetrically placed with respect to the illuminating beam detect laterally and forward scattered light from the spot. The spot is scanned over arrays of scan line segments shorter than the dimensions of the surface. A bright field channel enables the adjustment of the height of the sample surface to correct for errors caused by height variations of the surface. Different defect maps provided by the output of the detectors can be compared to identify and classify the defects. The imaging function of the array of sensors combines the advantages of a scanning system and an imaging system while improving signal/background ratio of the system.
摘要翻译：在用于检测样品表面上的颗粒和图案缺陷的光学扫描系统中，光束被聚焦到表面上的照明光斑上，并且沿着扫描线扫描光斑。检测器邻近表面定位以收集来自检测器包括传感器的一维或二维阵列的点的散射光。沿着扫描线的多个位置中的每一个处从照明点散射的光被聚焦到阵列中的对应的传感器上。相对于照明光束对称放置的多个检测器检测来自光斑的横向和前向散射光。在比表面尺寸短的扫描线段的阵列上扫描该点。亮场通道可以调整样品表面的高度，以校正由表面的高度变化引起的误差。可以比较由检测器输出提供的不同缺陷图，以识别和分类缺陷。传感器阵列的成像功能结合了扫描系统和成像系统的优点，同时提高了系统的信号/背景比。

9. 发明授权

US07075637B2 Optical scanning system for surface inspection 有权
公开(公告)号：US07075637B2
公开(公告)日：2006-07-11
申请号：US10412458
申请日：2003-04-10
申请人： Brian C. Leslie , Mehrdad Nikoonahad , Keith B. Wells
发明人： Brian C. Leslie , Mehrdad Nikoonahad , Keith B. Wells
IPC分类号： G01N21/00
CPC分类号： G01N21/95607 , G01N21/94 , G01N21/9501
摘要： In an optical scanning system for detecting particles and pattern defects on a sample surface, a light beam is focused to an illuminated spot on the surface and the spot is scanned across the surface along a scan line. A detector is positioned adjacent to the surface to collect scattered light from the spot where the detector includes a one- or two-dimensional array of sensors. Light scattered from the illuminated spot at each of a plurality of positions along the scan line is focused onto a corresponding sensor in the array. A plurality of detectors symmetrically placed with respect to the illuminating beam detect laterally and forward scattered light from the spot. The spot is scanned over arrays of scan line segments shorter than the dimensions of the surface. A bright field channel enables the adjustment of the height of the sample surface to correct for errors caused by height variations of the surface. Different defect maps provided by the output of the detectors can be compared to identify and classify the defects. The imaging function of the array of sensors combines the advantages of a scanning system and an imaging system while improving signal/background ratio of the system.

10. 发明授权

US06888627B2 Optical scanning system for surface inspection 失效
标题翻译：光学扫描系统进行表面检查
公开(公告)号：US06888627B2
公开(公告)日：2005-05-03
申请号：US10411646
申请日：2003-04-10
申请人： Brian C. Leslie , Mehrdad Nikoonahad , Keith B. Wells
发明人： Brian C. Leslie , Mehrdad Nikoonahad , Keith B. Wells
IPC分类号： G01N21/956 , G01N21/94 , G01N21/88
CPC分类号： G01N21/95607 , G01N21/94 , G01N21/9501
摘要： In an optical scanning system for detecting particles and pattern defects on a sample surface, a light beam is focused to an illuminated spot on the surface and the spot is scanned across the surface along a scan line. A detector is positioned adjacent to the surface to collect scattered light from the spot where the detector includes a one- or two-dimensional array of sensors. Light scattered from the illuminated spot at each of a plurality of positions along the scan line is focused onto a corresponding sensor in the array. A plurality of detectors symmetrically placed with respect to the illuminating beam detect laterally and forward scattered light from the spot. The spot is scanned over arrays of scan line segments shorter than the dimensions of the surface. A bright field channel enables the adjustment of the height of the sample surface to correct for errors caused by height variations of the surface. Different defect maps provided by the output of the detectors can be compared to identify and classify the defects. The imaging function of the array of sensors combines the advantages of a scanning system and an imaging system while improving signal/background ratio of the system.
摘要翻译：在用于检测样品表面上的颗粒和图案缺陷的光学扫描系统中，光束被聚焦到表面上的照明光斑上，并且沿着扫描线扫描光斑。检测器邻近表面定位以收集来自检测器包括传感器的一维或二维阵列的点的散射光。沿着扫描线的多个位置中的每一个处从照明点散射的光被聚焦到阵列中的对应的传感器上。相对于照明光束对称放置的多个检测器检测来自光斑的横向和前向散射光。在比表面尺寸短的扫描线段的阵列上扫描该点。亮场通道可以调整样品表面的高度，以校正由表面的高度变化引起的误差。可以比较由检测器输出提供的不同缺陷图，以识别和分类缺陷。传感器阵列的成像功能结合了扫描系统和成像系统的优点，同时提高了系统的信号/背景比。

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