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    • 4. 发明授权
    • Methods of forming patterns
    • 形成图案的方法
    • US08133664B2
    • 2012-03-13
    • US12397083
    • 2009-03-03
    • Scott SillsGurtej S. SandhuJohn SmytheMing Zhang
    • Scott SillsGurtej S. SandhuJohn SmytheMing Zhang
    • G03F7/26
    • H01L21/0274G03F7/20G03F7/40H01L21/0337H01L21/0338
    • Some embodiments include methods of forming patterns of openings. The methods may include forming spaced features over a substrate. The features may have tops and may have sidewalls extending downwardly from the tops. A first material may be formed along the tops and sidewalls of the features. The first material may be formed by spin-casting a conformal layer of the first material across the features, or by selective deposition along the features relative to the substrate. After the first material is formed, fill material may be provided between the features while leaving regions of the first material exposed. The exposed regions of the first material may then be selectively removed relative to both the fill material and the features to create the pattern of openings.
    • 一些实施例包括形成开口图案的方法。 所述方法可以包括在衬底上形成间隔的特征。 特征可以具有顶部并且可以具有从顶部向下延伸的侧壁。 第一材料可以沿着特征的顶部和侧壁形成。 第一材料可以通过将特征上的第一材料的共形层旋转浇铸而形成,或通过相对于基底的特征的选择性沉积来形成。 在形成第一材料之后,可以在特征之间提供填充材料,同时使第一材料的区域暴露。 然后可以相对于填充材料和特征来选择性地去除第一材料的暴露区域以产生开口图案。
    • 8. 发明授权
    • Silicon dioxide deposition methods using at least ozone and TEOS as deposition precursors
    • 至少使用臭氧和TEOS作为沉积前体的二氧化硅沉积方法
    • US07902084B2
    • 2011-03-08
    • US11773622
    • 2007-07-05
    • John SmytheGurtej S. Sandhu
    • John SmytheGurtej S. Sandhu
    • H01L21/31
    • H01L21/31612H01L21/02164H01L21/02304H01L21/02312H01L21/02315H01L21/3105
    • Embodiments disclosed herein pertain to silicon dioxide deposition methods using at least ozone and tetraethylorthosilicate (TEOS) as deposition precursors. In one embodiment, a silicon dioxide deposition method using at least ozone and TEOS as deposition precursors includes flowing precursors comprising ozone and TEOS to a substrate under subatmospheric pressure conditions effective to deposit silicon dioxide-comprising material having an outer surface onto the substrate. The outer surface is treated effective to one of add hydroxyl to or remove hydroxyl from the outer surface in comparison to any hydroxyl presence on the outer surface prior to said treating. After the treating, precursors comprising ozone and TEOS are flowed to the substrate under subatmospheric pressure conditions effective to deposit silicon dioxide-comprising material onto the treated outer surface of the substrate. Other embodiments are contemplated.
    • 本文公开的实施方案涉及至少使用臭氧和原硅酸四乙酯(TEOS)作为沉积前体的二氧化硅沉积方法。 在一个实施方案中,使用至少臭氧和TEOS作为沉积前体的二氧化硅沉积方法包括在低于大气压的压力条件下将包含臭氧和TEOS的前体流入基底,以有效地将具有外表面的含二氧化硅的材料沉积到基底上。 与所述处理之前的外表面上的任何羟基存在相比,外表面被有效地对从外表面添加羟基或除去羟基之一进行处理。 在处理之后,包含臭氧和TEOS的前体在有效将含二氧化硅的材料沉积到经处理的基底的外表面上的低于大气压的压力条件下流到基底。 预期其他实施例。