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    • 2. 发明授权
    • Electronic coatings
    • 电子涂料
    • US5711987A
    • 1998-01-27
    • US725787
    • 1996-10-04
    • Clayton R. BearingerRobert C. CamillettiLoren A. HaluskaKeith W. Michael
    • Clayton R. BearingerRobert C. CamillettiLoren A. HaluskaKeith W. Michael
    • B05D7/00B05D7/24B32B9/00H01L21/312H01L23/29H01L23/31H01L23/58B05D5/12
    • H01L23/573H01L23/296H01L23/3192H01L2924/0002Y10S257/922
    • The instant invention pertains to a multi-layer tamper proof electronic coating wherein the first layer is a protecting layer produced from preceramic silicon containing material and at least one filler. The second layer is a resin sealer coat produced from a sealer resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, polyimide polymers, siloxane polyimides and parylenes. An optional third layer is a cap coating layer selected from SiO.sub.2 coating, SiO.sub.2 /ceramic oxide coating, silicon containing coatings, silicon carbon containing coatings, silicon nitrogen containing coatings, silicon oxygen nitrogen coatings, silicon nitrogen carbon containing coatings and/or diamond like coatings. An optional fourth layer is a resin overcoat produced from an overcoat resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, polyimide polymers, siloxane polyimides, parylenes, photoresist polymers, siloxane room temperature vulcanizable compositions, or other organic polymer. The use of the multi-layer coating on the electronic device results in an electronic device that is resistant to analytical techniques such as ozone, UV-ozone, gaseous free radicals and ions, vapor or liquid borne reactive species, plasma, abrasion, radiation, light, wet etching and others; moisture; chemicals and other environmental contaminants; shock and erosion, delamination and/or separation.
    • 本发明涉及多层防篡改电子涂层,其中第一层是由含陶瓷硅材料和至少一种填料制成的保护层。 第二层是由选自胶体无机基硅氧烷树脂,苯并环丁烯基树脂,聚酰亚胺聚合物,硅氧烷聚酰亚胺和对二甲苯基的密封树脂制成的树脂密封剂涂层。 可选的第三层是选自SiO 2涂层,SiO 2 /陶瓷氧化物涂层,含硅涂层,含硅碳涂层,含硅氮涂层,硅氧氮涂层,含氮氮碳涂层和/或金刚石类涂层的覆盖层 。 任选的第四层是由选自胶体无机基硅氧烷树脂,苯并环丁烯基树脂,聚酰亚胺聚合物,硅氧烷聚酰亚胺,对二甲苯基,光致抗蚀剂聚合物,硅氧烷室温可硫化组合物或其它有机物的外涂层树脂生产的树脂外涂层 聚合物。 在电子设备上使用多层涂层导致电子装置耐分析技术如臭氧,紫外线臭氧,气态自由基和离子,蒸汽或液体反应物质,等离子体,磨损,辐射, 光,湿蚀等; 湿气; 化学品和其他环境污染物; 冲击和侵蚀,分层和/或分离。