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1. 发明授权

US07615731B2 High fill-factor sensor with reduced coupling 有权
标题翻译：高填充因子传感器，减少耦合
公开(公告)号：US07615731B2
公开(公告)日：2009-11-10
申请号：US11531707
申请日：2006-09-14
申请人： Gregory N. Heiler , Timothy J. Tredwell , Mark D. Bedzyk , Roger S. Kerr , Yuriy Vygranenko , Denis Striakhilev , Yongtaek Hong , Jackson C. S. Lai , Arokia Nathan
发明人： Gregory N. Heiler , Timothy J. Tredwell , Mark D. Bedzyk , Roger S. Kerr , Yuriy Vygranenko , Denis Striakhilev , Yongtaek Hong , Jackson C. S. Lai , Arokia Nathan
IPC分类号： H01L31/00
CPC分类号： H01L27/14658
摘要： A photosensor array includes data and scan lines (124, 148), circuitry of each data line/scan line pair formed in a backplane (110) on a substrate (102). On a first electrode scan line (148) a switching element (112) responds to a scan signal, connecting a first terminal (106) to a second terminal (108). A front plane (120) has sensing elements (122) indicating a measure of a received stimulus and including a charge collection electrode (130). An insulating layer (140) disposed between the backplane (110) and the front plane (120) contains at least a first via (136) connecting the first terminal (108) of the switching element (112) in the backplane (110) to a charge collection electrode (130) of the sensing element (122) in the front plane (120). A second via (126) connects between the second terminal (108) of the switching element (112) and the data line (124).
摘要翻译：光电传感器阵列包括数据和扫描线（124,148），每个数据线/扫描线对的电路形成在衬底（102）上的背板（110）中。在第一电极扫描线（148）上，开关元件（112）响应扫描信号，将第一端子（106）连接到第二端子（108）。前平面（120）具有指示接收的刺激的测量并包括电荷收集电极（130）的感测元件（122）。设置在背板（110）和前平面（120）之间的绝缘层（140）至少包含将背板（110）中的开关元件（112）的第一端子（108）连接到第一通孔（136）至第在前平面（120）中的感测元件（122）的电荷收集电极（130）。第二通孔（126）连接在开关元件（112）的第二端子（108）和数据线（124）之间。

2. 发明申请

US20080067324A1 HIGH FILL-FACTOR SENSOR WITH REDUCED COUPLING 有权
标题翻译：具有减少耦合的高填充因子传感器
公开(公告)号：US20080067324A1
公开(公告)日：2008-03-20
申请号：US11531707
申请日：2006-09-14
申请人： Gregory N. Heiler , Timothy J. Tredwell , Mark D. Bedzyk , Roger S. Kerr , Yuriy Vygranenko , Denis Striakhilev , Yongtaek Hong , Jackson C. S. Lai , Arokia Nathan
发明人： Gregory N. Heiler , Timothy J. Tredwell , Mark D. Bedzyk , Roger S. Kerr , Yuriy Vygranenko , Denis Striakhilev , Yongtaek Hong , Jackson C. S. Lai , Arokia Nathan
IPC分类号： H01L27/00
CPC分类号： H01L27/14658
摘要： A photosensor array includes data and scan lines (124, 148), circuitry of each data line/scan line pair formed in a backplane (110) on a substrate (102). On a first electrode scan line (148) a switching element (112) responds to a scan signal, connecting a first terminal (106) to a second terminal (108). A front plane (120) has sensing elements (122) indicating a measure of a received stimulus and including a charge collection electrode (130). An insulating layer (140) disposed between the backplane (110) and the front plane (120) contains at least a first via (136) connecting the first terminal (108) of the switching element (112) in the backplane (110) to a charge collection electrode (130) of the sensing element (122) in the front plane (120). A second via (126) connects between the second terminal (108) of the switching element (112) and the data line (124).
摘要翻译：光电传感器阵列包括数据和扫描线（124,148），每个数据线/扫描线对的电路形成在衬底（102）上的背板（110）中。在第一电极扫描线（148）上，开关元件（112）响应扫描信号，将第一端子（106）连接到第二端子（108）。前平面（120）具有指示接收的刺激的测量并包括电荷收集电极（130）的感测元件（122）。设置在背板（110）和前平面（120）之间的绝缘层（140）至少包含将背板（110）中的开关元件（112）的第一端子（108）连接到第一通孔（136）至第在前平面（120）中的感测元件（122）的电荷收集电极（130）。第二通孔（126）连接在开关元件（112）的第二端子（108）和数据线（124）之间。

3. 发明授权

US07198879B1 Laser resist transfer for microfabrication of electronic devices 有权
标题翻译：激光抗蚀剂转移用于电子设备的微细加工
公开(公告)号：US07198879B1
公开(公告)日：2007-04-03
申请号：US11240964
申请日：2005-09-30
申请人： Timothy J. Tredwell , Lee W. Tutt , David B. Kay , Yongtaek Hong , Glenn T. Pearce , Scott E. Phillips
发明人： Timothy J. Tredwell , Lee W. Tutt , David B. Kay , Yongtaek Hong , Glenn T. Pearce , Scott E. Phillips
IPC分类号： G03F7/34 , G03F7/38
CPC分类号： H05K3/0079 , B41M5/38207 , B41M5/398 , H05K2203/0528 , H05K2203/107
摘要： A method for forming a resist pattern on a substrate (18) places a donor element (12) having a layer of thermoresist material proximate the substrate. A gap is maintained such that the surface of the layer of thermoresist material is spaced apart from the surface of the substrate by a number of spacing elements. Thermal energy is directed toward the donor element (12) according to the resist pattern, whereby a portion of thermoresist material is transferred from the donor element (12) across the gap by ablative transfer and is deposited onto the substrate (18) forming the resist pattern.
摘要翻译：在衬底（18）上形成抗蚀剂图案的方法将具有靠近衬底的热敏材料层的施主元件（12）放置。保持间隙，使得热敏材料层的表面通过多个间隔元件与基板的表面间隔开。热能根据抗蚀剂图案被引向施主元件（12），由此一部分耐热材料通过消融转移从施主元件（12）转移穿过间隙并沉积到形成抗蚀剂的基板（18）上模式。

4. 发明申请

US20090199401A1 METHOD FOR FORMING CAST FLEXIBLE SUBSTRATE AND RESULTANT SUBSTRATE AND ELECTRONIC DEVICE 有权
标题翻译：形成柔性基板和结构基板和电子器件的方法
公开(公告)号：US20090199401A1
公开(公告)日：2009-08-13
申请号：US12028206
申请日：2008-02-08
申请人： Roger Stanley Kerr , Timothy John Tredwell , Yongtaek Hong
发明人： Roger Stanley Kerr , Timothy John Tredwell , Yongtaek Hong
IPC分类号： H05K3/00 , H05K1/00
CPC分类号： H05K3/0014 , H05K1/0346 , H05K1/0393 , H05K3/007 , H05K2201/09036 , H05K2201/09045 , H05K2203/0108 , H05K2203/016 , H05K2203/0759 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49158
摘要： A method for forming an electronic device provides a casting master having a casting surface, and deposits a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface. The flexible substrate sheet is released from the master and secured against a carrier, with the circuit-side surface facing outward. An electronic device is then formed on the circuit-side surface.
摘要翻译：一种形成电子器件的方法提供一种具有铸造表面的铸造母模，并将基底材料沉积到铸造表面上以形成预定厚度的柔性基片，其中柔性基片具有电路侧表面，铸造表面。柔性基板从主机释放并固定在载体上，电路侧表面朝外。然后在电路侧表面上形成电子器件。

5. 发明申请

US20070176538A1 Continuous conductor for OLED electrical drive circuitry 审中-公开
标题翻译：用于OLED电驱动电路的连续导体
公开(公告)号：US20070176538A1
公开(公告)日：2007-08-02
申请号：US11345735
申请日：2006-02-02
申请人： Dustin Winters , Yongtaek Hong
发明人： Dustin Winters , Yongtaek Hong
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L27/3276 , H01L27/3213
摘要： An OLED device comprising: an electrically insulating substrate; a plurality of light emitting pixels formed over the substrate wherein each pixel includes first and second spaced apart electrodes and organic electroluminescent media disposed between the first and second electrodes; a first thin film transistor associated with a first pixel and disposed above the substrate and having a gate electrode, a semiconductor region, a source terminal and a drain terminal; a continuously formed conductive layer positioned under the pixels and disposed above the substrate and disposed below the first thin film transistor and the organic electroluminescent media; an insulator layer disposed between the continuous conductor layer and the thin film transistor and having a first contact hole; and electrical connection is provided from the continuous conductor layer, through the first contact hole to either the source terminal or drain terminal of the first thin film transistor.
摘要翻译：一种OLED器件，包括：电绝缘衬底; 形成在所述基板上的多个发光像素，其中每个像素包括设置在所述第一和第二电极之间的第一和第二间隔开的电极和有机电致发光介质; 与第一像素相关并且设置在衬底上方并且具有栅电极，半导体区域，源极端子和漏极端子的第一薄膜晶体管; 位于所述像素下方并且设置在所述衬底上方且设置在所述第一薄膜晶体管和所述有机电致发光介质下方的连续形成的导电层; 设置在所述连续导体层和所述薄膜晶体管之间并具有第一接触孔的绝缘体层; 并且从连续导体层通过第一接触孔向第一薄膜晶体管的源极端子或漏极端子提供电连接。

6. 发明授权

US07743492B2 Method for forming cast flexible substrate and resultant substrate and electronic device 有权
标题翻译：用于形成铸塑柔性基板和所得基板和电子装置的方法
公开(公告)号：US07743492B2
公开(公告)日：2010-06-29
申请号：US12028206
申请日：2008-02-08
申请人： Roger Stanley Kerr , Timothy John Tredwell , Yongtaek Hong
发明人： Roger Stanley Kerr , Timothy John Tredwell , Yongtaek Hong
IPC分类号： H05K3/30
CPC分类号： H05K3/0014 , H05K1/0346 , H05K1/0393 , H05K3/007 , H05K2201/09036 , H05K2201/09045 , H05K2203/0108 , H05K2203/016 , H05K2203/0759 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49158
摘要： A method for forming an electronic device provides a casting master having a casting surface, and deposits a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface. The flexible substrate sheet is released from the master and secured against a carrier, with the circuit-side surface facing outward. An electronic device is then formed on the circuit-side surface.
摘要翻译：一种形成电子器件的方法提供一种具有铸造表面的铸造母模，并将基底材料沉积到铸造表面上以形成预定厚度的柔性基片，其中柔性基片具有电路侧表面，铸造表面。柔性基板从主机释放并固定在载体上，电路侧表面朝外。然后在电路侧表面上形成电子器件。

7. 发明申请

US20060127817A1 In-line fabrication of curved surface transistors 审中-公开
标题翻译：曲面晶体管的在线制造
公开(公告)号：US20060127817A1
公开(公告)日：2006-06-15
申请号：US11009801
申请日：2004-12-10
申请人： Sujatha Ramanujan , Yongtaek Hong
发明人： Sujatha Ramanujan , Yongtaek Hong
IPC分类号： G03F7/00
CPC分类号： H01L29/78603 , H01L27/1292 , H01L29/66765
摘要： A method for in-line fabrication of curved surface transistors (10) forms a flexible substrate (12) into a predetermined shape. A first passivation layer (14) is deposited. A first metal layer (16) in a first pattern is deposited. An insulator layer (18) in a second pattern is deposited. A first semiconductor (20) in a third pattern and a second semiconductor (22) in a fourth pattern are deposited. A second metal layer (24) in a fifth pattern is deposited. A second passivation layer (28) in a sixth pattern is deposited.
摘要翻译：用于在线制造弯曲表面晶体管（10）的方法形成预定形状的柔性基板（12）。沉积第一钝化层（14）。沉积第一图案的第一金属层（16）。沉积第二图案的绝缘体层（18）。沉积第三图案的第一半导体（20）和第四图案的第二半导体（22）。沉积第五图案的第二金属层（24）。沉积第六图案中的第二钝化层（28）。

8. 发明申请

US20070077511A1 LASER RESIST TRANSFER FOR MICROFABRICATION OF ELECTRONIC DEVICES 有权
标题翻译：用于微电子设备的激光电阻传输
公开(公告)号：US20070077511A1
公开(公告)日：2007-04-05
申请号：US11240964
申请日：2005-09-30
申请人： Timothy Tredwell , Lee Tutt , David Kay , Yongtaek Hong , Glenn Pearce , Scott Phillips
发明人： Timothy Tredwell , Lee Tutt , David Kay , Yongtaek Hong , Glenn Pearce , Scott Phillips
IPC分类号： G03C8/00
CPC分类号： H05K3/0079 , B41M5/38207 , B41M5/398 , H05K2203/0528 , H05K2203/107
摘要： A method for forming a resist pattern on a substrate (18) places a donor element (12) having a layer of thermoresist material proximate the substrate. A gap is maintained such that the surface of the layer of thermoresist material is spaced apart from the surface of the substrate by a number of spacing elements. Thermal energy is directed toward the donor element (12) according to the resist pattern, whereby a portion of thermoresist material is transferred from the donor element (12) across the gap by ablative transfer and is deposited onto the substrate (18) forming the resist pattern.
摘要翻译：在衬底（18）上形成抗蚀剂图案的方法将具有靠近衬底的热敏材料层的施主元件（12）放置。保持间隙，使得热敏材料层的表面通过多个间隔元件与基板的表面间隔开。热能根据抗蚀剂图案被引向施主元件（12），由此一部分耐热材料通过消融转移从施主元件（12）转移穿过间隙并沉积到形成抗蚀剂的基板（18）上模式。

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