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1. 发明授权

US06706519B1 Devices and methods for the performance of miniaturized in vitro amplification assays 失效
标题翻译：用于进行小型化体外扩增测定的装置和方法
公开(公告)号：US06706519B1
公开(公告)日：2004-03-16
申请号：US09602394
申请日：2000-06-22
申请人： Gregory J. Kellogg , Charles Able , Todd Arnold , Bruce L. Carvalho , Hsin-Chiang Lin , Stephen Kieffer-Higgins , Norman F. Sheppard , Mikayla Kob , Shari Ommert
发明人： Gregory J. Kellogg , Charles Able , Todd Arnold , Bruce L. Carvalho , Hsin-Chiang Lin , Stephen Kieffer-Higgins , Norman F. Sheppard , Mikayla Kob , Shari Ommert
IPC分类号： C12M134
CPC分类号： B01F13/0064 , B01F13/0094 , B01F15/0201 , B01F15/0233 , B01F2215/0431 , B01F2215/0477 , B01L3/50273 , B01L2200/0621 , B01L2300/0806 , B01L2300/0861 , B01L2300/1827 , B01L2400/0409 , B01L2400/0677 , G01N21/4795 , G01N35/00069 , G01N2035/00237
摘要： This invention relates to methods and apparatus for performing microanalytic and microsynthetic analyses and procedures. The invention provides a microsystem platform and a micromanipulation device for manipulating the platform that utilizes the centripetal force resulting from rotation of the platform to motivate fluid movement through microchannels. The invention specifically provides devices and methods for performing miniaturized in vitro amplification assays such as the polymerase chain reaction. Methods specific for the apparatus of the invention for performing PCR are provided.
摘要翻译：本发明涉及用于进行微量分析和微合成分析和方法的方法和装置。本发明提供一种用于操纵平台的微系统平台和显微操纵装置，所述平台利用由平台旋转产生的向心力，以激励通过微通道的流体运动。本发明特别提供了用于进行小型化的体外扩增测定（例如聚合酶链式反应）的装置和方法。提供了用于进行PCR的本发明装置专用的方法。

2. 发明授权

US08569791B2 LED and method for manufacturing the same 有权
标题翻译： LED及其制造方法
公开(公告)号：US08569791B2
公开(公告)日：2013-10-29
申请号：US13330704
申请日：2011-12-20
申请人： Pin-Chuan Chen , Hsin-Chiang Lin
发明人： Pin-Chuan Chen , Hsin-Chiang Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L33/486 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/181 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber.
摘要翻译： LED（发光二极管）包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。壳体限定了一个容纳芯片的腔体。空腔包括与上室连通的上室和下室。下室沿着LED的顶部到底部的方向逐渐扩大，并且上部腔室沿着LED的底部到顶部的方向逐渐扩大。密封剂基本上填充下腔室和上腔室。

3. 发明授权

US08735933B2 Light emitting diode package and method of manufacturing the same 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US08735933B2
公开(公告)日：2014-05-27
申请号：US13370316
申请日：2012-02-10
申请人： Hsin-Chiang Lin , Pin-Chuan Chen
发明人： Hsin-Chiang Lin , Pin-Chuan Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/16 , H01L2933/0033
摘要： An LED package includes a base, an LED chip, and an electrode layer. The base has thereon a first electrical connecting layer and a separated second electrical connecting layer. The LED chip is placed on the base and electrically connected with the first electrical connecting layer and the second electrical connecting layer by flip chip bonding. The electrode layer comprises a first electrode and a separated second electrode, and a receiving groove being defined between the first electrode and the second electrode. The base is received in the receiving groove of the electrode layer with the first electrical connecting layer being electrically connected to the first electrode, and the second electrical connecting layer being electrically connected to the second electrode.
摘要翻译： LED封装包括基底，LED芯片和电极层。底座上具有第一电连接层和分开的第二电连接层。 LED芯片放置在基座上，并通过倒装芯片接合与第一电连接层和第二电连接层电连接。电极层包括第一电极和分离的第二电极，以及限定在第一电极和第二电极之间的接收槽。基座被容纳在电极层的接收槽中，其中第一电连接层电连接到第一电极，并且第二电连接层电连接到第二电极。

4. 发明授权

US08633507B2 LED with versatile mounting ways 有权
标题翻译： LED多功能安装方式
公开(公告)号：US08633507B2
公开(公告)日：2014-01-21
申请号：US13596024
申请日：2012-08-27
申请人： Hsin-Chiang Lin , Pin-Chuan Chen
发明人： Hsin-Chiang Lin , Pin-Chuan Chen
IPC分类号： H01L33/00 , H01L23/48 , H01L21/00
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/00014 , H01L2924/00
摘要： An LED includes a base, a first lead and a second lead mounted to the base, a light emitting chip electrically connected to the first lead and the second lead, and an encapsulant sealing the chip. The first lead and the second lead each include a first beam and a second beam connected to each other. Each of the first beam and the second beam has two opposite ends protruding beyond two opposite lateral faces of the base, respectively, for electrically connecting with a circuit board.
摘要翻译： LED包括基座，安装到基座的第一引线和第二引线，与第一引线和第二引线电连接的发光芯片，以及密封芯片的密封剂。第一引线和第二引线各自包括彼此连接的第一光束和第二光束。第一光束和第二光束中的每一个分别具有两个相对的端部，该两个相对端分别突出到基板的两个相对的侧面，用于与电路板电连接。

5. 发明授权

US08513695B2 LED package and method for making the same 有权
标题翻译： LED封装及其制作方法
公开(公告)号：US08513695B2
公开(公告)日：2013-08-20
申请号：US13326341
申请日：2011-12-15
申请人： Hsin-Chiang Lin , Pin-Chuan Chen
发明人： Hsin-Chiang Lin , Pin-Chuan Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/52 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2924/01322 , H01L2924/00014 , H01L2924/00
摘要： An LED package includes a substrate, an LED die, electrodes, a reflective cup, a barrier portion and an encapsulation. The substrate includes a first surface and a second surface opposite to the first surface. The electrodes are formed on the substrate and spaced from each other. The barrier portion is formed on the electrodes and covered by the reflective cup, wherein a bonding force between the barrier portion and the electrodes is larger than that between the reflective cup and the electrodes. The LED die is mounted on one of the electrodes, received in the reflective cup and electrically connected to the electrodes via wire bonding. The disclosure also provides a method for making an LED package.
摘要翻译： LED封装包括基板，LED管芯，电极，反射杯，阻挡部分和封装。基板包括第一表面和与第一表面相对的第二表面。电极形成在基板上并且彼此间隔开。阻挡部分形成在电极上并被反射杯覆盖，其中阻挡部分和电极之间的结合力大于反射杯和电极之间的结合力。 LED管芯安装在一个电极上，容纳在反射杯中，并通过引线接合电连接到电极。本公开还提供了一种制造LED封装的方法。

6. 发明授权

US08455274B2 Method for manufacturing light emitting diode 有权
标题翻译：制造发光二极管的方法
公开(公告)号：US08455274B2
公开(公告)日：2013-06-04
申请号：US13286090
申请日：2011-10-31
申请人： Pin-Chuan Chen , Hsin-Chiang Lin , Wen-Liang Tseng
发明人： Pin-Chuan Chen , Hsin-Chiang Lin , Wen-Liang Tseng
IPC分类号： H01L33/48
CPC分类号： H01L33/486 , H01L24/97 , H01L33/0095 , H01L33/52 , H01L33/62 , H01L2224/48227 , H01L2224/97 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2933/0033 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2224/85
摘要： A method for manufacturing light emitting diodes includes steps: providing a substrate having an upper conductive layer and a lower conductive layer formed on a top face and bottom face thereof; dividing each of the upper conductive layer and the lower conductive layer into first areas and second areas; defining cavities in the substrate through the first areas of the upper conductive layer to expose the lower conductive layer; forming conductive posts within the substrate; forming an overlaying layer to connect the first areas of the upper and lower conductive layers; mounting chips on the overlaying layer within the cavities and electrically connecting each chip with an adjacent first area and post; forming an encapsulant on the substrate to cover the chips; and cutting the substrate into individual packages.
摘要翻译：一种制造发光二极管的方法，包括以下步骤：提供具有形成在其顶面和底面上的上导电层和下导电层的基板; 将上导电层和下导电层分别分成第一区和第二区; 通过上导电层的第一区域限定衬底中的空腔，以暴露下导电层; 在所述衬底内形成导电柱; 形成覆盖层以连接上和下导电层的第一区域; 将芯片安装在空腔内的覆盖层上，并将每个芯片与相邻的第一区域和柱子电连接; 在所述基板上形成密封剂以覆盖所述芯片; 并将基材切割成单独的包装。

7. 发明授权

US09123870B2 LED package structure 有权
标题翻译： LED封装结构
公开(公告)号：US09123870B2
公开(公告)日：2015-09-01
申请号：US13325010
申请日：2011-12-13
申请人： Hsin-Chiang Lin , Chieh-Ling Chang
发明人： Hsin-Chiang Lin , Chieh-Ling Chang
IPC分类号： H01L33/00 , H01L33/48 , H01L33/54 , H01L33/62
CPC分类号： H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48247 , H01L2924/01322 , H01L2924/00
摘要： An LED package structure includes a substrate, two electrodes engaged in the substrate, an LED chip, a reflective cup and an encapsulation. The substrate includes a first surface and a second surface opposite to the first surface. Each of the electrodes defines a groove. The grooves surrounding the LED chip. The LED chip is mounted on one of the electrodes and electrically connected to the two electrodes. The reflective cup is mounted on the substrate and surrounds the LED chip. The encapsulation covers the LED chip and extends in the grooves of the electrodes to prevent water/moisture from entering the LED chip.
摘要翻译： LED封装结构包括衬底，接合在衬底中的两个电极，LED芯片，反射杯和封装。基板包括第一表面和与第一表面相对的第二表面。每个电极限定一个凹槽。围绕LED芯片的凹槽。 LED芯片安装在一个电极上并电连接到两个电极。反射杯安装在基板上并围绕LED芯片。封装覆盖LED芯片，并在电极的沟槽中延伸，以防止水/水分进入LED芯片。

8. 发明授权

US08569080B2 Method for packaging light emitting diode 有权
标题翻译：封装发光二极管的方法
公开(公告)号：US08569080B2
公开(公告)日：2013-10-29
申请号：US13523878
申请日：2012-06-14
申请人： Li-Hsiang Chen , Hsin-Chiang Lin , Pin-Chuan Chen
发明人： Li-Hsiang Chen , Hsin-Chiang Lin , Pin-Chuan Chen
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/62 , H01L2224/48091 , H05K1/189 , H05K3/0014 , H05K2201/09036 , H05K2201/10106 , H05K2203/0278 , H01L2924/00014
摘要： A method of packaging a light emitting diode comprising: providing a flexible substrate with a heat-conducting layer, an insulating layer covering on a surface of the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap in the conductive layer and expose a part of the insulating layer, the conductive layer being separated by the gap into a first electrode and a second electrode isolated from each other; stamping the flexible substrate with a mold at the position of the gap to form a recess in the flexible substrate; positioning a light emitting element on the conductive layer and electrically connecting the light emitting element to the conductive layer; and forming an encapsulation to cover the light emitting element.
摘要翻译：一种封装发光二极管的方法，包括：提供具有导热层的柔性衬底，覆盖在导热层的表面上的绝缘层和位于绝缘层上的导电层; 蚀刻所述导电层以在所述导电层中形成间隙并暴露所述绝缘层的一部分，所述导电层被所述间隙分隔成彼此隔离的第一电极和第二电极; 在间隙的位置用模具冲压柔性基板以在柔性基板中形成凹部; 将发光元件定位在所述导电层上并将所述发光元件电连接到所述导电层; 并形成封装以覆盖发光元件。

9. 发明授权

US08476664B2 Light emitting diode package having multiple luminescent conversion layers 有权
标题翻译：具有多个发光转换层的发光二极管封装
公开(公告)号：US08476664B2
公开(公告)日：2013-07-02
申请号：US13288038
申请日：2011-11-03
申请人： Hsin-Chiang Lin , Wen-Liang Tseng , Chieh-Ling Chang
发明人： Hsin-Chiang Lin , Wen-Liang Tseng , Chieh-Ling Chang
IPC分类号： H01L33/00 , H01L27/15
CPC分类号： H01L33/504 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2933/0041 , H01L2924/00014
摘要： A light emitting diode package comprises a light emitting diode chip, a first luminescent conversion layer and a separate second luminescent conversion layer on the first luminescent conversion layer. The first luminescent conversion layer has a first luminescent conversion element surrounding the light emitting diode chip. The second luminescent conversion layer has a second luminescent conversion element located above the light emitting diode chip. An excitation efficiency of the first luminescent conversion element is higher than that of the second luminescent conversion element.
摘要翻译：一种发光二极管封装，包括在第一发光转换层上的发光二极管芯片，第一发光转换层和单独的第二发光转换层。第一发光转换层具有围绕发光二极管芯片的第一发光转换元件。第二发光转换层具有位于发光二极管芯片上方的第二发光转换元件。第一发光转换元件的激发效率高于第二发光转换元件的激发效率。

10. 发明授权

US08883533B2 Method for manufacturing light emitting diode package 有权
标题翻译：制造发光二极管封装的方法
公开(公告)号：US08883533B2
公开(公告)日：2014-11-11
申请号：US13571361
申请日：2012-08-10
申请人： Hsin-Chiang Lin , Pin-Chuan Chen , Lung-Hsin Chen
发明人： Hsin-Chiang Lin , Pin-Chuan Chen , Lung-Hsin Chen
IPC分类号： H01L21/00
CPC分类号： H01L33/60 , H01L24/97 , H01L33/486 , H01L2224/16245 , H01L2924/12041 , H01L2924/181 , H01L2933/0058 , H01L2924/00
摘要： A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages.
摘要翻译：一种制造LED封装的方法，包括以下步骤：提供衬底并在衬底上形成间隔开的电极结构; 在基板的顶表面上提供模具，其中模具限定间隔开的环形槽，其与基板的顶表面配合以限定空腔; 用金属材料填充空腔; 去除模具并硬化金属材料以形成反射杯，其中每个反射杯围绕对应的电极结构并限定凹部; 抛光反射杯和电极结构的表面; 将LED芯片布置在凹陷中，每个LED芯片电连接到电极结构; 在所述凹部中注入密封层以密封所述LED芯片; 并切割基板以获得单独的LED封装。

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