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1. 发明授权

US07332805B2 Electronic package with improved current carrying capability and method of forming the same 有权
标题翻译：具有改善载流能力的电子封装及其形成方法
公开(公告)号：US07332805B2
公开(公告)日：2008-02-19
申请号：US10752176
申请日：2004-01-06
申请人： Govindarajan Natarajan , Raschid J Bezama
发明人： Govindarajan Natarajan , Raschid J Bezama
IPC分类号： H01L23/053 , H01L23/12
CPC分类号： H05K1/0265 , H01L21/4857 , H01L23/49822 , H01L23/49838 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K2201/09881 , H01L2924/00
摘要： An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing feature tolerances. The methods and structures include electrical wirings having regions of larger wire cross-sectional areas in locations where the package must supply higher current distribution to the electronic devices and/or where signal lines need lower electrical resistance. These larger wire cross-sectional areas are vertically extended conductors applied to either the entire conductor or portions of the conductor.
摘要翻译：一种用于形成这种封装的电子封装和方法，其在放宽特征容差的同时，扩展线的电流能力和/或降低具有给定特征尺寸的封装的线路电阻。所述方法和结构包括具有较大导线截面面积的区域的电线，该区域在封装必须向电子器件提供较高电流分布的位置和/或信号线需要较低电阻的位置。这些较大的导线横截面积是垂直延伸的导体，其应用于导体的整个导体或部分。

2. 发明授权

US07407883B2 Electronic package with improved current carrying capability and method of forming the same 有权
公开(公告)号：US07407883B2
公开(公告)日：2008-08-05
申请号：US11529027
申请日：2006-09-28
申请人： Govindarajan Natarajan , Raschid J Bezama
发明人： Govindarajan Natarajan , Raschid J Bezama
IPC分类号： H01L21/44
CPC分类号： H05K1/0265 , H01L21/4857 , H01L23/49822 , H01L23/49838 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K2201/09881 , H01L2924/00
摘要： An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing feature tolerances. The methods and structures include electrical wirings having regions of larger wire cross-sectional areas in locations where the package must supply higher current distribution to the electronic devices and/or where signal lines need lower electrical resistance. These larger wire cross-sectional areas are vertically extended conductors applied to either the entire conductor or portions of the conductor.

3. 发明授权

US07107901B2 Method and apparatus for rapid cooling of metal screening masks 失效
标题翻译：用于快速冷却金属掩模掩模的方法和装置
公开(公告)号：US07107901B2
公开(公告)日：2006-09-19
申请号：US10685202
申请日：2003-10-14
申请人： Raschid J Bezama , William W Harkins , David C Long , Jason S Miller , Christopher E Pepe , Ronald M Rothkranz , John A Rudy , Benjamin P Tongue
发明人： Raschid J Bezama , William W Harkins , David C Long , Jason S Miller , Christopher E Pepe , Ronald M Rothkranz , John A Rudy , Benjamin P Tongue
IPC分类号： B41L13/00
CPC分类号： B41F15/12 , B41P2235/00 , H05K3/1225 , H05K2203/1121
摘要： A method and apparatus for the rapid cooling of screen masks used in the fabrication of semiconductor components is provided. The method and apparatus use a specially designed cooling plate which is contacted with a mask frame holding the screening mask. After a heated cleaning step which cleans the mask frame and screening mask of metal paste used in the screening operation, the cooling plate having one or more concave lower surfaces contacts the upper surfaces of the mask frame and bends the mask frame in the shape of the concave surfaces. This ensures intimate contact between the cooling plate and mask frame and enhances the thermal efficiency of the cooling step.
摘要翻译：提供了用于半导体部件制造中使用的屏蔽掩模的快速冷却的方法和装置。该方法和装置使用专门设计的冷却板，该冷却板与保持屏蔽罩的面罩框架相接触。在清洗掩模框架并筛选用于筛选操作的金属膏的掩模的加热清洁步骤之后，具有一个或多个凹下表面的冷却板接触荫罩框架的上表面，并将面罩框架弯曲成凹面。这确保了冷却板和掩模框架之间的紧密接触，并提高了冷却步骤的热效率。

4. 发明授权

US07258537B2 Fast firing flattening apparatus for sintered multilayer ceramic electronic substrates 失效
标题翻译：烧结多层陶瓷电子基板快速平整装置
公开(公告)号：US07258537B2
公开(公告)日：2007-08-21
申请号：US10942559
申请日：2004-09-16
申请人： Raschid J Bezama , Renee L Weisman
发明人： Raschid J Bezama , Renee L Weisman
IPC分类号： B29C43/18 , B22F3/14
CPC分类号： H01L21/4807
摘要： An apparatus for flattening sintered ceramic electronic packaging substrates having opposing faces with undesired camber interleaves the substrates with spacers. At least one heating zone includes a heat transfer medium movable toward and away from the stack of interleaved ceramic substrates and spacers to apply a desired rate of heat by direct contact with or close proximity to sides of the stack. A plunger applies pressure to the stack in a direction normal to the faces of the substrates. At least one cooling zone includes a heat transfer medium movable toward and away from the stack to remove heat introduced in the heating zone by direct contact with or close proximity to sides of the stack. A reducing gas supply is operatively connected to the at least one heating zone and at least one cooling zone to supply gas to maintain a controlled reducing atmosphere within the apparatus.
摘要翻译：用于使具有不希望的弯曲面的相对面的烧结陶瓷电子封装基板平坦化的装置用衬垫交织基板。至少一个加热区域包括能够朝向和远离堆叠的交错的陶瓷基板和间隔件移动的传热介质，以通过与堆叠的侧面直接接触或紧邻堆叠来施加期望的热量。柱塞在与基板的表面垂直的方向上对堆叠施加压力。至少一个冷却区域包括能够朝向和远离堆叠移动的传热介质，以通过与堆叠的侧面直接接触或靠近堆叠来移除在加热区域中引入的热量。还原气体供应可操作地连接到所述至少一个加热区域和至少一个冷却区域以供应气体以在该设备内保持受控的还原气氛。

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