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    • 3. 发明授权
    • Light generating module
    • 发光模块
    • US06876682B2
    • 2005-04-05
    • US10079817
    • 2002-02-22
    • Takashi NakabayashiAtsushi Hamakawa
    • Takashi NakabayashiAtsushi Hamakawa
    • G02B6/42H01S5/022H01S5/026H01S5/042H01S3/04
    • H01S5/02284H01L2224/48091H01S5/02216H01S5/02248H01S5/0427H01S5/06226H01S5/0683H01L2924/00014
    • A light generating module 1 comprises a housing 2, a semiconductor light-emitting device 4, a driving element 6, and a monitoring light-receiving device 8. The monitoring light-receiving device 8 is optically coupled with the semiconductor light-emitting device 4. The driving element 6 drives the semiconductor light-emitting device 4. The housing 2 contains the semiconductor light-emitting device 4, the driving element 6, and the monitoring light-receiving device 8. These elements 4, 6, and 8 are disposed sequentially along a predetermined axis. The driving element 6 is disposed between the semiconductor light-emitting device 4 and the monitoring light-receiving device 8. This configuration makes it possible to dispose the driving element 6 close to the semiconductor light-emitting device 4 so as to achieve a transmission rate of 10 Gbps without degrading the optical coupling between the semiconductor light-receiving device 8 and the semiconductor light-emitting device 4.
    • 发光模块1包括壳体2,半导体发光装置4,驱动元件6和监视光接收装置8.监视光接收装置8与半导体发光装置4光学耦合 驱动元件6驱动半导体发光装置4.壳体2包含半导体发光装置4,驱动元件6和监视光接收装置8.这些元件4,6和8被设置 顺序地沿预定轴线。 驱动元件6设置在半导体发光装置4和监视光接收装置8之间。这种构造使得可以将驱动元件6配置在靠近半导体发光装置4以实现传输速率 10Gbps,而不会降低半导体光接收装置8和半导体发光装置4之间的光耦合。