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1. 发明申请

US20140027899A1 CONTROLLING THERMAL INTERFACE MATERIAL BLEED OUT 有权
标题翻译：控制热接口材料BLEED OUT
公开(公告)号：US20140027899A1
公开(公告)日：2014-01-30
申请号：US13991900
申请日：2012-05-31
申请人： Gopi Krishnan , Mingjie Xu , Edvin Cetegen , Sung-Won Moon
发明人： Gopi Krishnan , Mingjie Xu , Edvin Cetegen , Sung-Won Moon
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , H01L23/3737 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： An extended preform of a thermal interface material (TIM) is formed between a heat spreader and a die on a substrate. The preform has an extension beyond a footprint of the die. The preform is cured. A bleed out of the TIM is controlled by the extension upon curing of the preform.
摘要翻译：在散热器和基板上的管芯之间形成热界面材料（TIM）的延伸预制件。预成型件具有超出模具的覆盖区的延伸。预成型件固化。 TIM的渗出通过预成型件固化后的延伸来控制。

2. 发明授权

US08951846B2 Controlling thermal interface material bleed out 有权
标题翻译：控制热界面材料渗出
公开(公告)号：US08951846B2
公开(公告)日：2015-02-10
申请号：US13991900
申请日：2012-05-31
申请人： Gopi Krishnan , Mingjie Xu , Edvin Cetegen , Sung-Won Moon
发明人： Gopi Krishnan , Mingjie Xu , Edvin Cetegen , Sung-Won Moon
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/34 , H01L23/373 , H01L23/42
CPC分类号： H01L23/34 , H01L23/3737 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： An extended preform of a thermal interface material (TIM) is formed between a heat spreader and a die on a substrate. The preform has an extension beyond a footprint of the die. The preform is cured. A bleed out of the TIM is controlled by the extension upon curing of the preform.
摘要翻译：在散热器和基板上的管芯之间形成热界面材料（TIM）的延伸预制件。预成型件具有超出模具的覆盖区的延伸。预成型件固化。 TIM的渗出通过预成型件固化后的延伸来控制。

3. 发明授权

US09741692B2 Methods to form high density through-mold interconnections 有权
公开(公告)号：US09741692B2
公开(公告)日：2017-08-22
申请号：US14767471
申请日：2014-09-15
申请人： Omkar G. Karhade , Nitin A. Deshpande , Edvin Cetegen , Eric J. Li , Debendra Mallik , Bassam M. Ziadeh
发明人： Omkar G. Karhade , Nitin A. Deshpande , Edvin Cetegen , Eric J. Li , Debendra Mallik , Bassam M. Ziadeh
IPC分类号： H01L25/00 , H01L25/065 , H01L23/00 , H01L23/31 , H01L21/56 , H01L21/768 , H01L25/10 , H01L23/498
CPC分类号： H01L25/0657 , H01L21/565 , H01L21/76802 , H01L21/76877 , H01L23/3142 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/1329 , H01L2224/133 , H01L2224/16227 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81207 , H01L2224/81815 , H01L2224/83102 , H01L2224/92125 , H01L2225/06517 , H01L2225/06548 , H01L2225/1023 , H01L2225/1058 , H01L2924/01028 , H01L2924/01047 , H01L2924/01079 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/1433 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/1579 , H01L2924/1815 , H01L2924/01082 , H01L2924/0105 , H01L2924/00012 , H01L2924/01083 , H01L2924/01029 , H01L2924/00014 , H01L2924/0665
摘要： Methods of fabricating a microelectronic device comprising forming a microelectronic substrate having a plurality microelectronic device attachment bond pads and at least one interconnection bond pad formed in and/or on an active surface thereof, attaching a microelectronic device to the plurality of microelectronic device attachment bond pads, forming a mold chase having a mold body and at least one projection extending from the mold body, wherein the at least one projection includes at least one sidewall and a contact surface, contacting the mold chase projection contact surface to a respective microelectronic substrate interconnection bond pad, disposing a mold material between the microelectronic substrate and the mold chase, and removing the mold chase to form at least one interconnection via extending from a top surface of the mold material to a respective microelectronic substrate interconnection bond pad.

4. 发明申请

US20150001717A1 UNDERFILL MATERIAL FLOW CONTROL FOR REDUCED DIE-TO-DIE SPACING IN SEMICONDUCTOR PACKAGES 审中-公开
标题翻译：用于半导体封装中减少的DIE-DI-DIE间隔的底部材料流量控制
公开(公告)号：US20150001717A1
公开(公告)日：2015-01-01
申请号：US13930082
申请日：2013-06-28
申请人： Omkar G. Karhade , Nitin A. Deshpande , Rajendra C. Dias , Edvin Cetegen , Lars D. Skoglund
发明人： Omkar G. Karhade , Nitin A. Deshpande , Rajendra C. Dias , Edvin Cetegen , Lars D. Skoglund
IPC分类号： H01L23/31 , H01L23/485
CPC分类号： H01L23/485 , H01L21/563 , H01L23/49838 , H01L24/17 , H01L25/0655 , H01L25/0657 , H01L25/18 , H01L2224/12105 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/17505 , H01L2224/26175 , H01L2224/2919 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81203 , H01L2225/06513 , H01L2225/06517 , H01L2225/06568 , H01L2924/12042 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L2924/0665
摘要： Underfill material flow control for reduced die-to-die spacing in semiconductor packages and the resulting semiconductor packages are described. In an example, a semiconductor apparatus includes first and second semiconductor dies, each having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a common semiconductor package substrate by a plurality of conductive contacts, the first and second semiconductor dies separated by a spacing. A barrier structure is disposed between the first semiconductor die and the common semiconductor package substrate and at least partially underneath the first semiconductor die. An underfill material layer is in contact with the second semiconductor die and with the barrier structure, but not in contact with the first semiconductor die.
摘要翻译：对半导体封装中的管芯间间距减小的底层填充材料流动控制以及所得到的半导体封装进行了描述。在一个示例中，半导体器件包括第一和第二半导体管芯，每个半导体管芯具有其上具有集成电路的表面，其上通过多个导电触点与公共半导体封装衬底的最上层金属化层的接触焊盘耦合，第一和第二半导体模具间隔开。阻挡结构设置在第一半导体管芯和公共半导体封装衬底之间并且至少部分地位于第一半导体管芯的下方。底部填充材料层与第二半导体管芯和阻挡结构接触，但不与第一半导体管芯接触。

5. 发明授权

US09477275B2 Thermal management solution for circuit products 有权
标题翻译：电路产品热管理解决方案
公开(公告)号：US09477275B2
公开(公告)日：2016-10-25
申请号：US13745553
申请日：2013-01-18
申请人： Arnab Choudhury , Je-Young Chang , David W. Song , Edvin Cetegen , Ashish Gupta
发明人： Arnab Choudhury , Je-Young Chang , David W. Song , Edvin Cetegen , Ashish Gupta
IPC分类号： H01L23/473 , H05K7/20 , G06F1/20 , H01L23/433
CPC分类号： G06F1/206 , F28F2260/02 , G06F2200/201 , H01L23/4336 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： An apparatus including a cold plate body; a channel module disposed within the cold plate body including a channel body and a plurality of channels projecting through the channel body; and a manifold disposed on the channel module, the manifold including an inlet and an outlet and a first plurality of apertures in fluid communication with the inlet and a second plurality of apertures are in fluid communication with the outlet. A method including introducing a fluid to an integrated cold plate disposed on an integrated circuit device, the integrated cold plate comprising a cold plate body extending about the device, the fluid being introduced into a manifold in fluid communication with a channel module disposed between the manifold and a base plate, the channel module, and including channels to direct the fluid toward the base plate, and collecting the fluid returned to the manifold.
摘要翻译：一种包括冷板体的设备; 设置在所述冷板主体内的通道模块，包括通道主体和穿过所述通道主体突出的多个通道; 以及歧管，其设置在所述通道模块上，所述歧管包括入口和出口以及与所述入口流体连通的第一多个孔，并且第二多个孔与所述出口流体连通。一种方法，包括将流体引入设置在集成电路装置上的集成冷板，所述集成冷板包括围绕所述装置延伸的冷板体，所述流体被引入歧管中，所述歧管与设置在所述歧管之间的通道模块流体连通和基板，通道模块，并且包括用于将流体引向基板的通道，以及收集返回到歧管的流体。

6. 发明申请

US20140204534A1 THERMAL MANAGEMENT SOLUTION FOR CIRCUIT PRODUCTS 有权
标题翻译：电路产品的热管理解决方案
公开(公告)号：US20140204534A1
公开(公告)日：2014-07-24
申请号：US13745553
申请日：2013-01-18
申请人： Arnab Choudhury , Je-Young Chang , David W. Song , Edvin Cetegen , Ashish Gupta
发明人： Arnab Choudhury , Je-Young Chang , David W. Song , Edvin Cetegen , Ashish Gupta
IPC分类号： H05K7/20
CPC分类号： G06F1/206 , F28F2260/02 , G06F2200/201 , H01L23/4336 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： An apparatus including a cold plate body; a channel module disposed within the cold plate body including a channel body and a plurality of channels projecting through the channel body; and a manifold disposed on the channel module, the manifold including an inlet and an outlet and a first plurality of apertures in fluid communication with the inlet and a second plurality of apertures are in fluid communication with the outlet. A method including introducing a fluid to an integrated cold plate disposed on an integrated circuit device, the integrated cold plate comprising a cold plate body extending about the device, the fluid being introduced into a manifold in fluid communication with a channel module disposed between the manifold and a base plate, the channel module, and including channels to direct the fluid toward the base plate, and collecting the fluid returned to the manifold.
摘要翻译：一种包括冷板体的设备; 设置在所述冷板主体内的通道模块，包括通道主体和穿过所述通道主体突出的多个通道; 以及歧管，其设置在所述通道模块上，所述歧管包括入口和出口以及与所述入口流体连通的第一多个孔，并且第二多个孔与所述出口流体连通。一种方法，包括将流体引入设置在集成电路装置上的集成冷板，所述集成冷板包括围绕所述装置延伸的冷板体，所述流体被引入歧管中，所述歧管与设置在所述歧管之间的通道模块流体连通和基板，通道模块，并且包括用于将流体引向基板的通道，以及收集返回到歧管的流体。

7. 发明申请

US20220199536A1 MICROELECTRONIC STRUCTURES INCLUDING BRIDGES 有权
公开(公告)号：US20220199536A1
公开(公告)日：2022-06-23
申请号：US17126636
申请日：2020-12-18
申请人： Omkar G. Karhade , Edvin Cetegen , Anurag Tripathi , Nitin A. Deshpande
发明人： Omkar G. Karhade , Edvin Cetegen , Anurag Tripathi , Nitin A. Deshpande
IPC分类号： H01L23/538 , H01L23/00 , H01L23/31 , H01L21/48 , H01L21/56
摘要： Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

8. 发明申请

US20160268231A1 METHODS TO FORM HIGH DENSITY THROUGH-MOLD INTERCONNECTIONS 有权
标题翻译：形成高密度通过模具互连的方法
公开(公告)号：US20160268231A1
公开(公告)日：2016-09-15
申请号：US14767471
申请日：2014-09-15
申请人： Omkar G. Karhade , Nitin A. Deshpande , Edvin Cetegen , Eric J. Li , Debendra Mallik , Bassam M. Ziadeh
发明人： Omkar G. Karhade , Nitin A. Deshpande , Edvin Cetegen , Eric J. Li , Debendra Mallik , Bassam M. Ziadeh
IPC分类号： H01L25/065 , H01L23/31 , H01L25/00 , H01L23/00 , H01L21/56 , H01L21/768
CPC分类号： H01L25/0657 , H01L21/565 , H01L21/76802 , H01L21/76877 , H01L23/3142 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/1329 , H01L2224/133 , H01L2224/16227 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81207 , H01L2224/81815 , H01L2224/83102 , H01L2224/92125 , H01L2225/06517 , H01L2225/06548 , H01L2225/1023 , H01L2225/1058 , H01L2924/01028 , H01L2924/01047 , H01L2924/01079 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/1433 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/1579 , H01L2924/1815 , H01L2924/01082 , H01L2924/0105 , H01L2924/00012 , H01L2924/01083 , H01L2924/01029 , H01L2924/00014 , H01L2924/0665
摘要： Methods of fabricating a microelectronic device comprising forming a microelectronic substrate having a plurality microelectronic device attachment bond pads and at least one interconnection bond pad formed in and/or on an active surface thereof, attaching a microelectronic device to the plurality of microelectronic device attachment bond pads, forming a mold chase having a mold body and at least one projection extending from the mold body, wherein the at least one projection includes at least one sidewall and a contact surface, contacting the mold chase projection contact surface to a respective microelectronic substrate interconnection bond pad, disposing a mold material between the microelectronic substrate and the mold chase, and removing the mold chase to form at least one interconnection via extending from a top surface of the mold material to a respective microelectronic substrate interconnection bond pad.
摘要翻译：制造微电子器件的方法包括形成具有多个微电子器件附着接合焊盘的微电子衬底和在其有效表面上和/或其有效表面上形成的至少一个互连接合焊盘，将微电子器件连接到多个微电子器件附接接合焊盘形成具有模具主体和至少一个从所述模具主体延伸的突起的模具追踪器，其中所述至少一个突出部包括至少一个侧壁和接触表面，所述至少一个突出部将所述模具追踪投影接触表面接触到相应的微电子衬底互连接合在微电子基板和模具追逐之间设置模具材料，并且通过从模具材料的顶表面延伸到相应的微电子衬底互连接合垫，去除模具追逐以形成至少一个互连。

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