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    • 9. 发明授权
    • Trilayer/bilayer solder bumps and fabrication methods therefor
    • 三层/双层焊料凸块及其制造方法
    • US06492197B1
    • 2002-12-10
    • US09576477
    • 2000-05-23
    • Glenn A. Rinne
    • Glenn A. Rinne
    • H01L2144
    • H01L24/12H01L21/4853H01L24/11H01L2224/05001H01L2224/05022H01L2224/05027H01L2224/0508H01L2224/05572H01L2224/11462H01L2224/1147H01L2224/11472H01L2224/11502H01L2224/11849H01L2224/11901H01L2224/13017H01L2224/1308H01L2224/131H01L2924/00013H01L2924/01005H01L2924/01006H01L2924/01013H01L2924/01022H01L2924/01024H01L2924/01029H01L2924/01033H01L2924/01078H01L2924/01082H01L2924/01322H01L2924/01327H01L2924/014H01L2924/09701H01L2924/14H01L2924/15787H05K3/3463H05K3/3473H05K2201/10992H01L2224/13099H01L2924/00
    • Solder bumps are fabricated by plating a first solder layer on an underbump metallurgy, plating a second solder layer having higher melting point than the first solder layer on the first solder layer and plating a third solder layer having lower melting point than the second solder layer on the second solder layer. The structure then is heated to below the melting point of the second solder layer but above the melting point of the first solder layer and the third solder layer, to alloy at least some of the first solder layer with at least some of the underbump metallurgy and to round the third solder layer. Accordingly, a trilayer solder bump may be fabricated wherein the first and third layers melt at lower temperatures than the second solder layer, to thereby round the outer surface of the solder bump and alloy the base of the solder bump to the underbump metallurgy, while allowing the structure of the intermediate layer to be preserved. Solder bump fabrication as described above may be particularly useful with lead-tin solder wherein the first solder layer is eutectic lead-tin solder, the second solder layer is lead-tin solder having higher lead content than eutectic lead-tin solder and the third solder layer is eutectic lead-tin solder. In yet other embodiments, the thickness and/or composition of the outer underbump metallurgy layer and/or of the first solder layer may be selected so that upon heating, sufficient tin from the first solder layer is alloyed with at least some of the outer underbump metallurgy layer, such that the first solder layer is converted to a fourth solder layer having the same lead content as the second solder layer. Bilayer solder bumps thereby may be provided.
    • 通过在下焊管冶金上电镀第一焊料层,在第一焊料层上电镀具有比第一焊料层更高的熔点的第二焊料层并且将具有比第二焊料层低的熔点的第三焊料层电镀到第二焊料层上来制造焊料凸块 第二焊料层。 然后将该结构加热到低于第二焊料层的熔点但高于第一焊料层和第三焊料层的熔点,以使第一焊料层中的至少一些与至少一些下焊管冶金和 绕第三个焊料层。 因此,可以制造三层焊料凸块,其中第一和第三层在比第二焊料层更低的温度下熔化,从而使焊料凸块的外表面圆周化,并将焊料凸块的底部合金到底部焊接冶金,同时允许 待保存的中间层的结构。 如上所述的焊料凸块制造对于铅锡焊料尤其有用,其中第一焊料层是共晶铅锡焊料,第二焊料层是比共晶铅锡焊料具有更高铅含量的铅锡焊料,而第三焊料 层是共晶铅锡焊料。 在另外的其它实施例中,可以选择外部底部基质金属层和/或第一焊料层的厚度和/或组成,使得在加热时,来自第一焊料层的足够的锡与至少一些外部底部基底 使得第一焊料层被转换成具有与第二焊料层相同的铅含量的第四焊料层。 可以提供双层焊料凸块。