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    • 7. 发明授权
    • Apparatus for monitoring and detecting operational defects in the state
of vehicle lamps
    • 用于监测和检测车灯状态下的操作缺陷的装置
    • US4385283A
    • 1983-05-24
    • US163072
    • 1980-06-26
    • Gilles Delapierre
    • Gilles Delapierre
    • B60Q11/00G01R15/20G01R19/165G01R31/02G01R19/15
    • G01R19/16571B60Q11/00G01R15/205G01R31/026
    • Process for monitoring the instantaneous or momentary state of an electric circuit having to function in a range limited to two states, namely a normal state corresponding to the passage of a nominal intensity in a conductor and a critical or threshold state corresponding to a threshold intensity and in particular a zero intensity in the said conductor, using the detection of possible variations in the resistance of a magnetic layer or "magnetoresistor" of the influence of the magnetic field due to the intensity of the electric current circulating in a conductor and whereof part of the path is located in the vicinity of at least one oriented thin magnetic layer, wherein the said detection is carried out by means of a differential measurement of the magnetoresistance of at least two adjacent and separate magnetic layers, whereof one is subject to the field of the circuit to be monitored and the other is subject to the field of a reference current, the circuits and layers being arranged also in such a way as to be independent of the variations in the magnetoresistance due to ambient variations of temperature and/or magnetic field.The invention also relates to the application of the process to the monitoring of the possible breaking state of the supply circuits of electric lamps of a motor vehicle.
    • 用于监视电路的瞬时或瞬时状态的过程,该电路必须在限于两个状态的范围内起作用,即对应于导体中标称强度的通过的正常状态和对应于阈值强度的临界或阈值状态,以及 特别是所述导体中的零强度,通过检测磁性层或“磁敏电阻”的电阻的可能变化是由于在导体中循环的电流的强度而引起的磁场的影响, 该路径位于至少一个取向的薄磁层附近,其中所述检测是通过对至少两个相邻和分开的磁性层的磁阻的微分测量来进行的,其中一个受到 要监视的电路和另一个电路受参考电流的场影响,电路和层被布置 也可以独立于由于温度和/或磁场的环境变化引起的磁阻的变化。 本发明还涉及将该方法应用于监测机动车辆的电灯的供应回路的可能的断开状态。
    • 9. 发明授权
    • Encapsulation component for integrated micro electromechanical system comprising first and second covers
    • 包括第一和第二盖的集成微机电系统的封装部件
    • US07745891B2
    • 2010-06-29
    • US11208856
    • 2005-08-23
    • Gilles Delapierre
    • Gilles Delapierre
    • H01L23/28
    • B81B7/0041B81C2203/0136
    • The microsystems are integrated in a first cavity bounded by at least a substrate and by a top wall formed by at least a part of a first cover. The component has a second cavity bounded by at least the whole of the top wall of the first cavity and by a second cover formed by a thin layer. The second cover can be covered by a coating made of plastic material molded from a casting. The fabrication process of the component comprises deposition, on the whole of the top wall of the first cavity, of a layer of polymer material and annealing of the layer of polymer material. The layer of polymer material acts as sacrificial layer for deposition of the thin layer designed to form the second cover.
    • 微系统集成在由至少一个衬底界定的第一腔中,并由第一罩的至少一部分形成的顶壁。 该部件具有由第一腔的至少整个顶壁和由薄层形成的第二盖限定的第二腔。 第二个盖子可以由铸件成型的塑料制成的涂层覆盖。 组件的制造过程包括在第一腔的整个顶壁上沉积聚合物材料层和聚合物材料层的退火。 聚合物材料层作为用于沉积设计成形成第二盖的薄层的牺牲层。