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1. 发明授权

US4785527A Method for manufacturing an inductive chip 失效
标题翻译：感应芯片的制造方法
公开(公告)号：US4785527A
公开(公告)日：1988-11-22
申请号：US4397
申请日：1987-01-20
申请人： Gilles Bernard , Jean L. Zatarra
发明人： Gilles Bernard , Jean L. Zatarra
IPC分类号： H01F41/04 , H01F27/29 , H01F41/10 , H01F7/06
CPC分类号： H01F27/292 , H01F41/10 , Y10T29/49071 , Y10T29/49171
摘要： A method for the manufacture of an inductive chip of the type with a wire coiled around a core comprises the following steps:(a) Fixing the core to a connecting strip made of a metallic material, the strip being provided with slots by which electrical connections can be obtained on either side of the component,(b) Winding a wire around the fixed core,(c) Soldering each end of the wire to each part of the strip designed to form the electrical connections,(d) Coating the wound core, with the connecting strip acting as a mould joint for the moulding process,(e) Cutting out the connecting strip to set off the limits of each component and the parts intended to form the external electrical connections,(f) Folding and fixing the parts delimited in the previous step of the component.
摘要翻译：用于制造具有围绕芯线缠绕的线的类型的感应芯片的方法包括以下步骤：（a）将芯固定到由金属材料制成的连接条上，条带设置有槽，通过该槽连接电连接可以在组件的任一侧获得，（b）绕固定芯线缠绕导线，（c）将导线的每个端部焊接到设计成形成电连接的条带的每个部分，（d）涂覆卷绕芯，连接条作为模制过程的模具接头，（e）切割连接条，以排除每个部件和用于形成外部电气连接的部件的限制，（f）折叠和固定零件在组件的上一步中分隔。

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