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1. 发明授权

US07713771B2 Pressure sensor 有权
标题翻译：压力传感器
公开(公告)号：US07713771B2
公开(公告)日：2010-05-11
申请号：US11469511
申请日：2006-09-01
申请人： Gert Friis Eriksen , Karsten Dyrbye , Heins K. Pedersen , Robert M. Mehalso , Stephen F. Pond
发明人： Gert Friis Eriksen , Karsten Dyrbye , Heins K. Pedersen , Robert M. Mehalso , Stephen F. Pond
IPC分类号： H01L21/00
CPC分类号： H01L29/84 , G01L9/0042
摘要： A differential pressure sensor includes a micro-electromechanical sensor die fabricated as a plurality of sensor die sites on a semiconductor wafer, and then singularized, the sensor die having a top face surface including die electrical output pads exposed to a first test fluid source and a bottom side surface exposed to a second test fluid source. The differential pressure further has a sensor die support member having a die support member fluid access port with a support member port perimeter; wherein one of the top face surface or the bottom side surface is sealed fully around the support member port perimeter by a wafer scale seal formed on the plurality of sensor die sites before die singulation. Wafer scale seals may be formed by a photofabrication process, screen printing, stamp printing, or pressure transfer printing. Some embodiments may include a photofabricated seal formed by a photosensitive polydimethylsiloxane material, by a filled photofabricated mold, and by photopatterned glass frit.
摘要翻译：差压传感器包括在半导体晶片上制造为多个传感器模具位置的微机电传感器模具，然后被单数化，传感器模具具有顶表面，其包括暴露于第一测试流体源的模具电输出焊盘和底侧表面暴露于第二测试流体源。差压进一步具有传感器模具支撑构件，其具有具有支撑构件端口周边的模具支撑构件流体通路口; 其中，顶片表面或底侧表面之一通过在模切前形成在多个传感器模具部位上的晶片刻度密封件完全密封在支撑部件端口周边周围。可以通过光加工工艺，丝网印刷，印章印刷或压印转印来形成晶片刻度密封。一些实施例可以包括由光敏聚二甲基硅氧烷材料，填充的光制模和通过光图案化的玻璃料形成的光制密封。

2. 发明授权

US08026121B2 Method for producing electronic components and pressure sensor 有权
标题翻译：电子元件和压力传感器的制造方法
公开(公告)号：US08026121B2
公开(公告)日：2011-09-27
申请号：US12279370
申请日：2007-01-30
申请人： Jens Peter Krog , Gert Friis Eriksen , Karsten Dyrbye
发明人： Jens Peter Krog , Gert Friis Eriksen , Karsten Dyrbye
IPC分类号： H01L21/00
CPC分类号： G01L19/147 , G01L9/0042 , G01L19/146
摘要： A method produces electronic components in particular electronic sensors for pressure and differential pressure measurement. Firstly, the semiconductor structure of the electronic components is produced on a wafer. An insulating oxide layer is then applied. A protective metal layer is subsequently applied. The metal layer is applied in sections only in those regions of the wafer in which no splitting, for example by mechanical separation, occurs later. The electronic components thus formed in the wafer are then divided up into individual elements.
摘要翻译：一种方法产生电子部件，特别是用于压力和压差测量的电子传感器。首先，在晶片上制造电子部件的半导体结构。然后施加绝缘氧化物层。随后施加保护性金属层。金属层仅在晶片的那些区域中施加，其中例如通过机械分离不再发生分裂。然后将如此形成在晶片中的电子部件分成单个元件。

3. 发明申请

US20090004766A1 Method for Producing Electronic Components and Pressure Sensor 有权
标题翻译：电子元器件和压力传感器的生产方法
公开(公告)号：US20090004766A1
公开(公告)日：2009-01-01
申请号：US12279370
申请日：2007-01-30
申请人： Jens Peter Krog , Gert Friis Eriksen , Karsten Dyrbye
发明人： Jens Peter Krog , Gert Friis Eriksen , Karsten Dyrbye
IPC分类号： H01L21/50
CPC分类号： G01L19/147 , G01L9/0042 , G01L19/146
摘要： A method produces electronic components in particular electronic sensors for pressure and differential pressure measurement. Firstly, the semiconductor structure of the electronic components is produced on a wafer. An insulating oxide layer is then applied. A protective metal layer is subsequently applied. The metal layer is applied in sections only in those regions of the wafer in which no splitting, for example by mechanical separation, occurs later. The electronic components thus formed in the wafer are then divided up into individual elements.
摘要翻译：一种方法产生电子部件，特别是用于压力和压差测量的电子传感器。首先，在晶片上制造电子部件的半导体结构。然后施加绝缘氧化物层。随后施加保护性金属层。金属层仅在晶片的那些区域中施加，其中例如通过机械分离不再发生分裂。然后将如此形成在晶片中的电子部件分成单个元件。

4. 发明授权

US6085596A Pressure sensor having an insulating layer and fluid tight amorphous metal layer 失效
标题翻译：压力传感器具有绝缘层和流体密封的非晶态金属层
公开(公告)号：US6085596A
公开(公告)日：2000-07-11
申请号：US827751
申请日：1997-04-11
申请人： Niels Due Jensen , Tina Romedahl Brown , Karsten Dyrbye , Per Ellemose Andersen
发明人： Niels Due Jensen , Tina Romedahl Brown , Karsten Dyrbye , Per Ellemose Andersen
IPC分类号： G01L9/00 , G01L9/16
CPC分类号： G01L19/147 , G01L19/0038 , G01L9/0054 , H01L2224/48091 , H01L2224/48137 , H01L2224/48464
摘要： The invention relates to a pressure or differential pressure sensor comprising a membrane with at least one measuring element located thereon, as well evaluation electronics for measuring the membrane deflection. The membrane is covered against environmental influences with a protective layer and is gripped within a mounting in a pressure tight manner. The protective layer is composed of a fluid tight amorphous metal layer, a so called metal glass layer which with the interposing of an electrically insulating layer, is directly deposited onto the membrane, the measuring element located thereon and where appropriate, onto further electronic components located thereon. In this manner, on the one hand, the membrane is protected but on the other hand it may be deflected sensitively since the amorphous metal layer is fluid and gas tight even with layer thicknesses in the .mu.m region.
摘要翻译：本发明涉及一种压力或差压传感器，其包括具有位于其上的至少一个测量元件的膜以及用于测量膜偏转的评估电子装置。膜被保护层覆盖在环境影响之下，并以紧压的方式夹在安装件内。保护层由流体密封的非晶金属层组成，所谓的金属玻璃层，其中插有电绝缘层，直接沉积在膜上，测量元件位于其上，并且适当地位于另外的电子部件上上。以这种方式，一方面，膜被保护，但另一方面，其可以被敏感地偏转，因为非晶金属层即使在μm区域中的层厚度是流体和气密的。

5. 发明授权

US6030709A Electronic component 失效
标题翻译：电子元器件
公开(公告)号：US6030709A
公开(公告)日：2000-02-29
申请号：US837265
申请日：1997-04-11
申请人： Niels Due Jensen , Tina Romedahl Brown , Karsten Dyrbye , Per Ellemose Andersen
发明人： Niels Due Jensen , Tina Romedahl Brown , Karsten Dyrbye , Per Ellemose Andersen
IPC分类号： C23C28/00 , C23C30/00 , G01D5/14 , G01F1/684 , G01K7/01 , G01L9/00 , G01L19/06 , B32B9/04 , B32B15/00 , H01C3/04 , H01L29/12
CPC分类号： G01L19/147 , C23C30/00 , G01D5/14 , G01F1/6845 , G01K7/01 , G01L19/0076 , G01L19/0627 , G01L9/0054 , H01L2224/48091 , H01L2224/48464 , H01L2924/3025 , Y10T428/12528 , Y10T428/12674
摘要： The invention relates to an electronic component manufactured in thick film technology, thin film technology or silicon technology and then provided with an electrically insulating layer which is covered by an amorphous metal layer. The amorphous metal layer protects the component, even with the smallest of layer thicknesses, from external influences and directly transmits heating and force effects.
摘要翻译：本发明涉及以厚膜技术，薄膜技术或硅技术制造的电子部件，然后设置有由非晶金属层覆盖的电绝缘层。非晶金属层即使以最小的层厚度保护元件免受外部影响，并直接传递加热和力的作用。

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