专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060041064A1 Fluorocarbon elastomer silicone vulcanizates 失效
标题翻译：氟碳弹性硅胶硫化胶
公开(公告)号：US20060041064A1
公开(公告)日：2006-02-23
申请号：US10515869
申请日：2003-06-06
申请人： Gerald Gornowicz , Igor Chorvath , Lauren Tonge , Yung Kim , David Romenesko , Kermit Kwan , Warren Stephen
发明人： Gerald Gornowicz , Igor Chorvath , Lauren Tonge , Yung Kim , David Romenesko , Kermit Kwan , Warren Stephen
IPC分类号： C08L83/04 , C08L23/00 , B32B27/00
CPC分类号： C08L27/12 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08G77/26 , C08G77/28 , C08G77/70 , C08J3/005 , C08J3/243 , C08J2327/16 , C08J2383/04 , C08L27/16 , C08L83/04 , C08L2666/14 , C08L2666/04
摘要： A method is disclosed for preparing an elastomeric base composition comprising: (I) mixing (A) a fluorocarbon elastomer with (B) a compatibilizer, (C) an optional catalyst, (II) mixing the product of step (I) with (D) a silicone base comprising a curable organopolysiloxane, (E), an optional crosslinking agent, (F) a cure agent in an amount sufficient to cure said organopolysiloxane; and (III) dynamically vulcanizing the organopolysiloxane, wherein the weight ratio of fluorocarbon elastomer (A) to silicone base (B) in the elastomeric base composition ranges from 95:5 to 30:70. The cured rubber compositions obtained from the elastomeric base compositions herein have good fuel resistance properties.
摘要翻译：公开了一种制备弹性体基础组合物的方法，该方法包括：（I）将（A）氟碳弹性体与（B）增容剂混合，（C）任选的催化剂，（II）将步骤（I）的产物与（D ）包含可固化的有机聚硅氧烷的聚硅氧烷基，（E），任选的交联剂，（F）足以固化所述有机聚硅氧烷的量的固化剂; 和（III）动态硫化有机聚硅氧烷，其中弹性体基础组合物中氟碳弹性体弹性体（A）与硅酮基（B）的重量比为95:5至30:70。由本文的弹性体基础组合物获得的固化橡胶组合物具有良好的耐燃性。

2. 发明授权

US07173092B2 Fluorocarbon elastomer silicone vulcanizates 失效
标题翻译：氟碳弹性硅胶硫化胶
公开(公告)号：US07173092B2
公开(公告)日：2007-02-06
申请号：US10515869
申请日：2003-06-06
申请人： Gerald Gornowicz , Igor Chorvath , Lauren Tonge , Yung Kim , David Romenesko , Kermit Kwan , Stephen Warren
发明人： Gerald Gornowicz , Igor Chorvath , Lauren Tonge , Yung Kim , David Romenesko , Kermit Kwan , Stephen Warren
IPC分类号： C08L27/12 , C08L83/04
CPC分类号： C08L27/12 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08G77/26 , C08G77/28 , C08G77/70 , C08J3/005 , C08J3/243 , C08J2327/16 , C08J2383/04 , C08L27/16 , C08L83/04 , C08L2666/14 , C08L2666/04
摘要： A method is disclosed for preparing an elastomeric base composition comprising: (I) mixing (A) a fluorocarbon elastomer with (B) a compatibilizer, (C) an optional catalyst, (II) mixing the product of step (I) with (D) a silicone base comprising a curable organopolysiloxane, (E), an optional crosslinking agent, (F) a cure agent in an amount sufficient to cure said organopolysiloxane; and (III) dynamically vulcanizing the organopolysiloxane, wherein the weight ratio of fluorocarbon elastomer (A) to silicone base (B) in the elastomeric base composition ranges from 95:5 to 30:70. The cured rubber compositions obtained from the elastomeric base compositions herein have good fuel resistance properties.
摘要翻译：公开了一种制备弹性体基础组合物的方法，该方法包括：（I）将（A）氟碳弹性体与（B）增容剂混合，（C）任选的催化剂，（II）将步骤（I）的产物与（D ）包含可固化的有机聚硅氧烷的聚硅氧烷基，（E），任选的交联剂，（F）足以固化所述有机聚硅氧烷的量的固化剂; 和（III）动态硫化有机聚硅氧烷，其中弹性体基础组合物中氟碳弹性体弹性体（A）与硅酮基（B）的重量比为95:5至30:70。由本文的弹性体基础组合物获得的固化橡胶组合物具有良好的耐燃性。

3. 发明申请

US20050142851A1 Method of fabricating MIM capacitor 失效
标题翻译：制造MIM电容的方法
公开(公告)号：US20050142851A1
公开(公告)日：2005-06-30
申请号：US11027838
申请日：2004-12-29
申请人： Yung Kim
发明人： Yung Kim
IPC分类号： H01L27/108 , H01L21/02 , H01L23/522 , H01L21/4763 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L28/40 , H01L23/5223 , H01L2924/0002 , H01L2924/00
摘要： A method of fabricating an MIM capacitor is provided, by which higher capacitance can be secured per unit volume or area by forming a dual-stack type capacitor to increase an effective area of the capacitor. The method includes patterning a first metal layer, forming a planarized second insulating layer having a trench exposing a portion of the patterned first metal layer, forming a second metal layer within the trench, forming a first dielectric layer on the second metal layer, forming first via holes exposing the patterned first metal layer, forming first plugs filling the trench and first via holes, forming a third metal layer thereover, forming a second dielectric layer on the third metal layer, forming a patterned fourth metal layer on the second dielectric layer, patterning the second dielectric layer and the third metal layer, forming a planarized third insulating layer having second via holes therein, and forming a patterned fifth metal layer on the third insulating layer.
摘要翻译：提供了一种制造MIM电容器的方法，通过形成双堆叠型电容器来增加电容器的有效面积，通过该方法可以确保单位体积或面积上的较高电容。该方法包括图案化第一金属层，形成具有暴露图案化的第一金属层的一部分的沟槽的平坦化的第二绝缘层，在沟槽内形成第二金属层，在第二金属层上形成第一介电层，形成第一金属层通孔暴露图案化的第一金属层，形成填充沟槽的第一插塞和第一通孔，在其上形成第三金属层，在第三金属层上形成第二介电层，在第二介电层上形成图案化的第四金属层，图案化第二介电层和第三金属层，形成其中具有第二通孔的平坦化第三绝缘层，并在第三绝缘层上形成图案化的第五金属层。

4. 发明授权

US08922506B2 Mobile terminal 有权
标题翻译：移动终端
公开(公告)号：US08922506B2
公开(公告)日：2014-12-30
申请号：US13152925
申请日：2011-06-03
申请人： Hojae Jung , Yung Kim , Jumin Chi
发明人： Hojae Jung , Yung Kim , Jumin Chi
IPC分类号： G06F3/041 , H04M1/725 , G06F1/32 , G06F1/16
CPC分类号： H04M1/72577 , A45C2011/002 , G06F1/1626 , G06F1/1677 , G06F1/32 , G06F3/041 , G06F2200/1633 , H04B1/3888 , H04M1/72569 , H04M2250/12 , H04M2250/22
摘要： A mobile terminal and a control method of a mobile terminal are provided. The mobile terminal and control method provide a user interface allowing for a user to easily and effectively control the mobile terminal through an interaction between a case and the mobile terminal when the mobile terminal is accommodated in the case in a lock mode.
摘要翻译：提供移动终端和移动终端的控制方法。移动终端和控制方法提供用户接口，允许用户在移动终端以锁定模式容纳在案例中时通过外壳与移动终端之间的交互来容易且有效地控制移动终端。

5. 发明申请

US20060138673A1 Semiconductor device and method for manufacturing the same 有权
公开(公告)号：US20060138673A1
公开(公告)日：2006-06-29
申请号：US11312595
申请日：2005-12-21
申请人： Yung Kim
发明人： Yung Kim
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L23/544 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L2223/54453 , H01L2224/02166 , H01L2224/05001 , H01L2224/05073 , H01L2224/05567 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/30105 , H01L2924/00014 , H01L2224/05552
摘要： A semiconductor device and a method manufacturing the same prevents copper from being exposed to a surface of a passivation film after a copper metal line formation, to avoid contamination of processing equipment and the process environment. The method includes providing a substrate with a scribe lane and a chip area in which metal wiring layers are formed, forming a dielectric film, forming a conductive film on the dielectric film in a chip area and an alignment mark on the dielectric film in a scribe lane, forming passivation films, exposing the conductive film by removing the passivation films in a bonding pad portion in a chip area, forming another conductive film in the bonding pad portion to electrically connect with the conductive film, forming another passivation film, and selectively removing the passivation films.

6. 发明申请

US20050013925A1 Immobilization methods for organic molecules telomers and polymers on solid substrates 审中-公开
标题翻译：固体底物上有机分子调聚物和聚合物的固定方法
公开(公告)号：US20050013925A1
公开(公告)日：2005-01-20
申请号：US10865708
申请日：2004-06-10
申请人： Melvin Cabey , Yung Kim
发明人： Melvin Cabey , Yung Kim
IPC分类号： B01D19/04 , B01J20/286 , B01J31/00 , B01J31/02 , B01J31/16 , B05D1/18 , C22B3/00 , B05D3/00 , C12M1/34
CPC分类号： B01J20/286 , B01D19/0404 , B01J31/003 , B01J31/0272 , B01J31/1633 , B05D1/185 , B82Y30/00 , B82Y40/00 , C22B3/0005 , Y02P10/234
摘要： The immobilization of organic molecules, telomers and polymers on solid substrates. Organic molecules, telomers and polymers are immobilized onto solid substrates, especially particulate materials via covalent bonds that provide greater thermal and organic stability than other methods of immobilization.
摘要翻译：有机分子，调聚物和聚合物固定在固体基质上。有机分子，调聚物和聚合物通过共价键固定在固体基质上，特别是颗粒材料上，其比其它固定方法提供更大的热稳定性和有机稳定性。

7. 发明申请

US20070161147A1 Method of manufacturing CMOS image sensor 审中-公开
标题翻译： CMOS图像传感器的制造方法
公开(公告)号：US20070161147A1
公开(公告)日：2007-07-12
申请号：US11644203
申请日：2006-12-21
申请人： Yung Kim
发明人： Yung Kim
IPC分类号： H01L21/00
CPC分类号： H01L27/14687 , H01L27/14627 , H01L27/14632 , H01L27/14643 , H01L27/14685
摘要： Disclosed is a method of manufacturing a CMOS image sensor. The method includes the steps of forming a dielectric layer on a semiconductor substrate having a photodiode therein; forming a color filter array having a plurality of color filters on the dielectric layer; forming a plurality of micro-lenses on the color filter array, each micro-lens corresponding to one of the color filters; and performing a plasma surface treatment on the micro-lens.
摘要翻译：公开了一种制造CMOS图像传感器的方法。该方法包括在其中具有光电二极管的半导体衬底上形成电介质层的步骤; 形成在所述电介质层上具有多个滤色器的滤色器阵列; 在所述滤色器阵列上形成多个微透镜，每个微透镜对应于所述滤色器之一; 并对微透镜进行等离子体表面处理。

8. 发明申请

US20070077431A1 Multi-layered macromolecules and methods for their use 失效
标题翻译：多层大分子及其使用方法
公开(公告)号：US20070077431A1
公开(公告)日：2007-04-05
申请号：US11598360
申请日：2006-11-13
申请人： Charles Skinner , William Campbell , Yung Kim
发明人： Charles Skinner , William Campbell , Yung Kim
IPC分类号： B32B1/00
CPC分类号： C08G83/003 , B01J20/3204 , B01J20/3219 , B01J20/3257 , B01J20/3272 , B01J20/328 , B01J20/3289 , C07K1/22 , C08L101/005 , Y10T428/2991 , Y10T428/2995 , Y10T428/2998
摘要： Multi-layered macromolecules wherein the layers are covalently bonded together and wherein the macromolecules are covalently bonded to solid particulate substrates, methods for the preparation of such compositions, and methods for their uses in a multitude of end use applications ranging from the purification of waste chemical and metal process streams to the separation and identification of proteins, peptides, and oligionucleotides.
摘要翻译：多层大分子，其中这些层共价键合在一起，并且其中大分子共价键合到固体颗粒基质上，制备这种组合物的方法，以及用于多种终端应用的方法，从废化学品的纯化和金属工艺流分离和鉴定蛋白质，肽和寡聚核苷酸。

9. 发明申请

US20060237365A1 Silicone derivatized macromolecules 审中-公开
公开(公告)号：US20060237365A1
公开(公告)日：2006-10-26
申请号：US11475316
申请日：2006-06-27
申请人： Yung Kim , David Karpovich , William Campbell , Ling Yang
发明人： Yung Kim , David Karpovich , William Campbell , Ling Yang
IPC分类号： C02F1/42
CPC分类号： C08G83/005 , A61K8/84 , A61Q19/00 , B01J20/26 , B01J20/28033 , B01J20/285 , B01J20/286 , B01J20/3242 , B01J20/3265 , B01J20/3268 , B01J20/328 , B01J45/00 , C08G83/002 , C09D201/005
摘要： The present invention provides a silicone derivatized macromolecule that is supported on a particulate support or a separation membrane and method for making that composition. The silicon-derivatized macromolecule can also be combined with chiral ligands or chelated metals. The applications for the silicone derivatized macromolecule variety including use in HPLC separations, in purification process and in personal care formulations.

10. 发明申请

US20060141773A1 Method of forming metal line in semiconductor device 审中-公开
标题翻译：在半导体器件中形成金属线的方法
公开(公告)号：US20060141773A1
公开(公告)日：2006-06-29
申请号：US11321119
申请日：2005-12-28
申请人： Yung Kim
发明人： Yung Kim
IPC分类号： H01L21/4763
CPC分类号： H01L21/76807 , H01L21/31144 , H01L2221/1021
摘要： A method of forming a metal line in a semiconductor device reduces production costs through a simplified fabricating process. The method includes steps of forming a first metal line on a semiconductor substrate; forming an insulating layer over the semiconductor substrate including the first metal line; coating a photoresist on the insulating layer; aligning a diffraction mask having regions or patterns differing from each other in transmittance over the photoresist; patterning the photoresist by exposure and development using the diffraction mask to form a patterned photoresist having regions that differ in thickness; forming a via hole and a trench by etching the patterned photoresist and the insulating layer simultaneously to expose a prescribed portion of the first metal line; removing the remaining photoresist; and forming a second metal line and a contact in the trench and the via hole.
摘要翻译：在半导体器件中形成金属线的方法通过简化的制造工艺降低了生产成本。该方法包括以下步骤：在半导体衬底上形成第一金属线; 在包括第一金属线的半导体衬底上形成绝缘层; 在绝缘层上涂覆光致抗蚀剂; 对准具有在光致抗蚀剂上的透射率彼此不同的区域或图案的衍射掩模; 通过使用衍射掩模的曝光和显影来图案化光致抗蚀剂以形成具有不同厚度区域的图案化光致抗蚀剂; 通过同时蚀刻图案化的光致抗蚀剂和绝缘层来形成通孔和沟槽，以暴露第一金属线的规定部分; 去除剩余的光致抗蚀剂; 以及在沟槽和通孔中形成第二金属线和接触件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式