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1. 发明授权

US07775802B2 Electrical connector system 有权
公开(公告)号：US07775802B2
公开(公告)日：2010-08-17
申请号：US12474587
申请日：2009-05-29
申请人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
发明人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
IPC分类号： H01R12/00
CPC分类号： H01R13/514 , H01R12/58 , H01R13/6471 , H01R13/6586 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

2. 发明申请

US20100144201A1 ELECTRICAL CONNECTOR SYSTEM 有权
公开(公告)号：US20100144201A1
公开(公告)日：2010-06-10
申请号：US12474587
申请日：2009-05-29
申请人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
发明人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R12/58 , H01R13/6471 , H01R13/6586 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

3. 发明授权

US07976318B2 Electrical connector system 有权
标题翻译：电连接器系统
公开(公告)号：US07976318B2
公开(公告)日：2011-07-12
申请号：US12474568
申请日：2009-05-29
申请人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
发明人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
IPC分类号： H01R12/00
CPC分类号： H01R13/514 , H01R12/585 , H01R12/725 , H01R13/6477 , H01R13/6587 , H01R13/6599
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译：公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。高速连接器系统的实现可以提供接地屏蔽和/或接地结构，其基本上封装整个背板占用面积，背板连接器和子卡内部的三维方式的可能是差分电连接器对的电连接器对脚印。当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。

4. 发明申请

US20100144167A1 Electrical Connector System 有权
标题翻译：电气连接器系统
公开(公告)号：US20100144167A1
公开(公告)日：2010-06-10
申请号：US12474568
申请日：2009-05-29
申请人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
发明人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
IPC分类号： H01R12/14 , H01R12/30
CPC分类号： H01R13/514 , H01R12/585 , H01R12/725 , H01R13/6477 , H01R13/6587 , H01R13/6599
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译：公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。高速连接器系统的实现可以提供接地屏蔽和/或接地结构，其基本上封装整个背板占用面积，背板连接器和子卡内部的三维方式的可能是差分电连接器对的电连接器对脚印。当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。

5. 发明授权

US06663442B1 High speed interconnect using printed circuit board with plated bores 有权
标题翻译：使用带电镀孔的印刷电路板进行高速互连
公开(公告)号：US06663442B1
公开(公告)日：2003-12-16
申请号：US09491658
申请日：2000-01-27
申请人： David W. Helster , Scott K. Mickievicz , Howard W. Andrews , George R. Defibaugh , Lynn R. Sipe , John J. Consoli , James L. Fedder , Chad W. Morgan , Alexander M. Sharf , Matthew R. McAlonis
发明人： David W. Helster , Scott K. Mickievicz , Howard W. Andrews , George R. Defibaugh , Lynn R. Sipe , John J. Consoli , James L. Fedder , Chad W. Morgan , Alexander M. Sharf , Matthew R. McAlonis
IPC分类号： H05K111
CPC分类号： H01R12/58 , H05K1/115 , H05K3/0047 , H05K3/429 , H05K2201/09509 , H05K2201/09627 , H05K2201/09845 , H05K2201/10189 , H05K2203/0242
摘要： A printed circuit board includes a bore having a perimeter and a total depth. An electrically conductive barrel extends around at least a portion of the perimeter of the bore and along a predetermined depth of the bore, the predetermined depth being less than the total depth of the bore. The barrel has an end that terminates at a countersunk portion of the bore. A contact includes a body having first and second ends. The first end includes a compliant section that is positioned in the barrel, thereby forming a separable interface between the contact and the circuit board. The second end extends out of the barrel and interfaces with an electrical component. Protrusion of the first end out of the barrel is minimized. The above relationships are used to decrease capacitive loading.
摘要翻译：印刷电路板包括具有周长和总深度的孔。导电筒围绕孔的周边的至少一部分延伸并且沿着孔的预定深度延伸，预定深度小于孔的总深度。枪管的端部终止于孔的沉头部分。触点包括具有第一端和第二端的本体。第一端包括位于筒中的柔顺部分，从而在接触件和电路板之间形成可分离的界面。第二端延伸出筒体并与电气部件接合。桶的第一端突出最小化。上述关系用于降低电容负载。

6. 发明授权

US07927143B2 Electrical connector system 有权
标题翻译：电连接器系统
公开(公告)号：US07927143B2
公开(公告)日：2011-04-19
申请号：US12474674
申请日：2009-05-29
申请人： David W. Helster , John E. Knaub , Peter C. O'Donnell , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
发明人： David W. Helster , John E. Knaub , Peter C. O'Donnell , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R12/725 , H01R13/6471 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译：公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。高速连接器系统的实施方案可以提供接地屏蔽和/或其他接地结构，其基本上将电连接器对（其可以是差分电连接器对）以三维方式贯穿整个背板占用面积，背板连接器和子卡足迹。当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。

7. 发明申请

US20100144175A1 ELECTRICAL CONNECTOR SYSTEM 有权
公开(公告)号：US20100144175A1
公开(公告)日：2010-06-10
申请号：US12474674
申请日：2009-05-29
申请人： David W. Helster , John E. Knaub , Peter C. O'Donnell , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
发明人： David W. Helster , John E. Knaub , Peter C. O'Donnell , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
IPC分类号： H01R13/648 , H01R13/40
CPC分类号： H01R13/514 , H01R12/725 , H01R13/6471 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

8. 发明申请

US20100144174A1 Electrical Connector System 有权
公开(公告)号：US20100144174A1
公开(公告)日：2010-06-10
申请号：US12474605
申请日：2009-05-29
申请人： Douglas W. Glover , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
发明人： Douglas W. Glover , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
IPC分类号： H01R13/648 , H01R13/40
CPC分类号： H01R13/514 , H01R13/6471 , H01R13/6587 , H01R43/24
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

9. 发明授权

US07819697B2 Electrical connector system 有权
标题翻译：电连接器系统
公开(公告)号：US07819697B2
公开(公告)日：2010-10-26
申请号：US12474605
申请日：2009-05-29
申请人： Douglas W. Glover , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
发明人： Douglas W. Glover , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R13/6471 , H01R13/6587 , H01R43/24
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译：公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。高速连接器系统的实施方案可以提供接地屏蔽和/或其他接地结构，其基本上将电连接器对（其可以是差分电连接器对）以三维方式贯穿整个背板占用面积，背板连接器和子卡足迹。当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。

10. 发明授权

US5588844A Variable orientation, surface mounted connector 失效
标题翻译：可变方向，表面安装的连接器
公开(公告)号：US5588844A
公开(公告)日：1996-12-31
申请号：US615382
申请日：1996-03-14
申请人： Lynn R. Sipe
发明人： Lynn R. Sipe
IPC分类号： H01R12/50 , H01R12/55 , H01R12/70 , H01R13/28 , H01R13/73 , H01R24/84 , H01R35/04 , H01R23/72
CPC分类号： H01R35/04 , H01R12/7064 , H01R12/722 , H01R13/28 , H01R23/27 , Y10S439/907
摘要： The invention relates to a variable orientation, surface mountable connector assembly. Electrical connector 1 comprises an insulative housing 100, a plurality of electrical contacts 200, and a pair of variable orientation board mounts 300. The electrical contacts 200 are mounted in the insulative housing 100 so as to be surface mountable to a printed circuit board 3 regardless of whether the electrical connector 1 is surface mounted vertically or horizontally. Two board mounts 300 are located in corresponding lateral cavities 125 in the insulative housing 100. Each board mount 300 is adapted to be selectively oriented in either a first position corresponding to a vertically mounted electrical connector 1 or a second position corresponding to a horizontally mounted electrical connector 1.
摘要翻译：本发明涉及一种可变取向的，可表面安装的连接器组件。电连接器1包括绝缘壳体100，多个电触点200和一对可变方向板安装件300.电触头200安装在绝缘壳体100中，以便可表面安装到印刷电路板3上电连接器1是垂直还是水平地表面安装。两个板安装件300位于绝缘壳体100中的相应的侧向空腔125中。每个板安装件300适于被选择性地定位在对应于垂直安装的电连接器1的第一位置或对应于水平安装的电气连接器1。

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