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1. 发明授权

US4482673A Aqueous coating composition comprising self-emulsifiable ester of epoxy and acid containing addition polymer and method of its preparation 失效
标题翻译：包含环氧树脂的自乳化酯和含酸加成聚合物的水性涂料组合物及其制备方法
公开(公告)号：US4482673A
公开(公告)日：1984-11-13
申请号：US378314
申请日：1982-05-14
申请人： George L. Brown , Miksa de Sorgo , Arthur T. Spencer
发明人： George L. Brown , Miksa de Sorgo , Arthur T. Spencer
IPC分类号： C09D163/02 , C08G59/00
CPC分类号： C09D163/00
摘要： Non-gelled compositions containing hydroxy ester copolymer having carboxyl groups and substantially free of oxirane groups and the method of making them are disclosed which are the esterification reaction product of(A) acidic addition copolymer; and(B) epoxy resin including aromatic polyether containing oxirane groups in which the epoxy resin comprises at least 40% of the total resin solids and contains insufficient oxirane groups to react with all of the carboxyl groups in the copolymer; in which esterification is conducted in the presence of higher than the normal amount of amine catalyst, i.e., 1.5% or more. The resulting composition is neutralized with amine, is self-emulsifiable in water and is useful for coatings, e.g., for cans.
摘要翻译：公开了含有羧基并基本上不含环氧乙烷基团的羟基酯共聚物的非凝胶组合物及其制备方法，它们是（A）酸性加成共聚物的酯化反应产物; 和（B）环氧树脂，包括含有环氧乙烷基团的芳族聚醚，其中环氧树脂占总树脂固体的至少40％，并且含有不足的环氧乙烷基团以与共聚物中的所有羧基反应; 其中在高于正常量的胺催化剂的存在下进行酯化，即1.5％以上。所得组合物用胺中和，在水中是可自乳化的，并且可用于涂料，例如罐。

2. 发明授权

US4585813A Aqueous coating composition comprising self-emulsifiable ester of epoxy and acid containing addition polymer and method of its preparation 失效
标题翻译：包含环氧树脂的自乳化酯和含酸加成聚合物的水性涂料组合物及其制备方法
公开(公告)号：US4585813A
公开(公告)日：1986-04-29
申请号：US472206
申请日：1983-03-10
申请人： George L. Brown , Miksa de Sorgo , Arthur T. Spencer
发明人： George L. Brown , Miksa de Sorgo , Arthur T. Spencer
IPC分类号： C09D163/02 , C08K3/20 , C08G59/00
CPC分类号： C09D163/00
摘要： Non-gelled compositions containing hydroxy ester copolymer having carboxyl groups and substantially free of oxirane groups and the method of making them are disclosed which are the esterification reaction product of(A) acidic addition copolymer; and(B) epoxy resin including aromatic polyether containing oxirane groups in which the epoxy resin comprises at least 50% of the total resin solids and contains insufficient oxirane groups to react with all of the carboxyl groups in the copolymer; in which esterification is conducted after treatment of the addition copolymer with amine in an amount sufficient to neutralize at least 5% of the carboxyl group in the copolymer. The resulting composition is neutralized with amine, is self-emulsifiable in water and is useful for coatings, e.g., for cans.
摘要翻译：公开了含有羧基并基本上不含环氧乙烷基团的羟基酯共聚物的非凝胶组合物及其制备方法，它们是（A）酸性加成共聚物的酯化反应产物; 和（B）环氧树脂，包括含有环氧乙烷基团的芳族聚醚，其中环氧树脂占总树脂固体的至少50％，并且含有不足以与共聚物中所有羧基反应的环氧乙烷基团; 其中在胺加成处理之后进行酯化，其量足以中和共聚物中至少5％的羧基。所得组合物用胺中和，在水中是可自乳化的，并且可用于涂料，例如罐。

3. 发明授权

US06705388B1 Non-electrically conductive thermal dissipator for electronic components 有权
标题翻译：用于电子元件的非导电散热器
公开(公告)号：US06705388B1
公开(公告)日：2004-03-16
申请号：US09151886
申请日：1998-09-11
申请人： Miksa de Sorgo
发明人： Miksa de Sorgo
IPC分类号： H05K720
CPC分类号： H01L23/3735 , H01L23/3731 , H01L2924/0002 , H01L2924/3011 , Y10S165/905 , H01L2924/00
摘要： A thermal dissipator disposable in a heat transfer relationship with a heat-generating source, such as an electronic component, which is mounted on a substrate, such as a printed circuit board. The dissipator includes a thermal dissipation member having a top and bottom surface, and a pressure sensitive adhesive layer disposed on the thermal dissipation member to cover at-least a portion of the bottom surface thereof. The dissipation member is formed of a thermally-conductive, electrically-nonconductive ceramic material. The pressure sensitive adhesive layer has an inner surface adhered to the bottom surface of the thermal dissipation member, and an outer surface bondable to a heat transfer surface of the source for attaching the dissipator to the source in a heat transfer relationship therewith.
摘要翻译：一种与发热源（例如电子部件）传热关系的散热器，其安装在诸如印刷电路板的基板上。散热器包括具有顶表面和底表面的散热构件，以及设置在散热构件上以覆盖其底表面的至少一部分的压敏粘合剂层。散热构件由导热的非导电陶瓷材料形成。压敏粘合剂层具有粘附到散热构件的底表面的内表面和可与源的传热表面结合的外表面，用于将散热器以与其传热关系的方式附接到源。

4. 发明授权

US5781412A Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size 失效
标题翻译：使用具有受控粒径的填料的固化就地导热中间层对发热电子部件进行导电冷却
公开(公告)号：US5781412A
公开(公告)日：1998-07-14
申请号：US755081
申请日：1996-11-22
申请人： Miksa de Sorgo
发明人： Miksa de Sorgo
IPC分类号： H01L23/42 , H01L23/433 , H05K1/02 , H05K3/30 , H05K7/20
CPC分类号： H05K1/0203 , H01L23/42 , H01L23/433 , H01L2924/0002 , H05K2201/0209 , H05K3/305
摘要： Conductive cooling of a heat-generating electronic component disposable in spaced-apart adjacency with a surface of a thermal dissipation member to define a gap of predetermined width therebetween. A curable composition is provided as formed of an electrically-insulating polymeric binder having thermally-conductive, electrically-insulating filler particles dispersed therein. At least a portion of the filler particles is of a maximum average diameter about equal to the predetermined width of the gap. A layer of the composition is disposable in conductive heat transfer contact with the electronic component and the surface of the thermal dissipation member, and is cured to form an interlayer within the gap. At least a portion of the filler particles of the specified maximum average diameter each substantially directly contact the electronic component and the surface of the thermal dissipation member to establish thermally-conductive pathways effective to transfer heat from the electronic component to the heat dissipation member.
摘要翻译：将发热电子部件的导电冷却与散热构件的表面间隔开地间隔开以限定其间具有预定宽度的间隙。提供由可绝缘的聚合物粘合剂形成的可固化组合物，其具有分散在其中的导热，电绝缘的填料颗粒。填料颗粒的至少一部分具有大约等于间隙的预定宽度的最大平均直径。组合物的一层是与电子部件和散热构件的表面的导电传热接触一次性的，并且被固化以在间隙内形成中间层。规定的最大平均直径的填料颗粒的至少一部分基本上直接接触电子部件和散热构件的表面，以建立有效地将热量从电子部件传递到散热构件的导热路径。

5. 发明授权

US07208192B2 Thermally or electrically-conductive form-in-place gap filter 有权
标题翻译：热或导电形成的间隙过滤器
公开(公告)号：US07208192B2
公开(公告)日：2007-04-24
申请号：US10346346
申请日：2003-01-16
申请人： Michael H. Bunyan , Miksa de Sorgo
发明人： Michael H. Bunyan , Miksa de Sorgo
IPC分类号： B05D5/00 , B05D5/12
CPC分类号： H01L23/3737 , H01L23/552 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T428/263 , Y10T428/31663 , H01L2924/00
摘要： Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An of the compound is dispensed from a nozzle or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound.
摘要翻译：施加热和/或导电化合物以填充第一和第二表面之间的热和/或EMI屏蔽间隙。作为固化的聚合物凝胶组分和颗粒状填充剂组分的混合物，提供流动的形式稳定化合物的供给。一种化合物在施加的压力下从喷嘴或其他孔口分配到一个表面上，当相反时，形成间隙，或者形成在表面之间形成的间隙中。间隙至少部分地被分配化合物的至少一部分填充。

6. 发明授权

US06965071B2 Thermal-sprayed metallic conformal coatings used as heat spreaders 有权
标题翻译：用作散热器的热喷涂金属保形涂层
公开(公告)号：US06965071B2
公开(公告)日：2005-11-15
申请号：US10287490
申请日：2002-11-01
申请人： George R. Watchko , Matthew T. Gagnon , Peter W. Liu , Miksa de Sorgo , Christian V. Rodriguez , William G. Lionetta , Scott M. Oppenheim
发明人： George R. Watchko , Matthew T. Gagnon , Peter W. Liu , Miksa de Sorgo , Christian V. Rodriguez , William G. Lionetta , Scott M. Oppenheim
IPC分类号： C23C4/00 , C23C4/06 , C23C4/12 , C23C30/00 , H05K7/20 , H05K9/00
CPC分类号： H05K9/0086 , C23C4/00 , C23C4/06 , C23C4/08 , C23C4/12 , C23C4/131 , C23C30/00 , H01L2924/0002 , H05K7/20454 , H05K9/0015 , H05K9/0045 , H01L2924/00
摘要： Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.
摘要翻译：具有外壳的电子设备的散热和电磁干扰（EMI）屏蔽。外壳的内表面被保形金属层覆盖，该层与热封闭的一个或多个发热电子部件或其中包含在外壳内的其他源相邻配置，可以为器件提供散热和EMI屏蔽。该层可以以熔融状态喷涂到内表面上并固化以形成自粘附涂层。

7. 发明授权

US6054198A Conformal thermal interface material for electronic components 失效
公开(公告)号：US6054198A
公开(公告)日：2000-04-25
申请号：US801047
申请日：1997-02-14
申请人： Michael H. Bunyan , Miksa de Sorgo
发明人： Michael H. Bunyan , Miksa de Sorgo
IPC分类号： H01L23/36 , C09K5/00 , C09K5/06 , H01L23/373
CPC分类号： H01L23/3737 , C09K5/06 , H01L2224/32245 , H01L2924/3011 , Y10T428/1419 , Y10T428/1452 , Y10T428/1476 , Y10T428/2822 , Y10T428/2826 , Y10T428/31909
摘要： A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.

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