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1. 发明授权

US4749614A Process for coating fibers, use thereof, and product 失效
标题翻译：涂布纤维，其用途和产品的方法
公开(公告)号：US4749614A
公开(公告)日：1988-06-07
申请号：US849976
申请日：1986-04-10
申请人： George L. Andrews , Anilkumar C. Bhatt , Donald E. Doran , Leo E. Hunsinger
发明人： George L. Andrews , Anilkumar C. Bhatt , Donald E. Doran , Leo E. Hunsinger
IPC分类号： B32B15/08 , C03C25/40 , C08J5/06 , C08J5/24 , D06M15/643 , D06M101/00 , H05K1/03 , B32B7/00
CPC分类号： H05K1/0366 , C03C25/40 , H05K2201/0239 , Y10S428/901 , Y10T428/31511 , Y10T428/31525 , Y10T428/31663 , Y10T442/2344 , Y10T442/3512 , Y10T442/3667
摘要： A fibrous substrate is coated with a hydrolyzed aminosilane. The aminosilane is hydrolyzed in an aqueous solution having a pH of 3.4 to 3.7. The substrate is useful for preparing fiber reinforced plastics such as prepreg polyepoxide substrates. Improved adhesion between the fibrous substrate and the polymer is obtained.
摘要翻译：用水解的氨基硅烷涂覆纤维底物。氨基硅烷在pH为3.4〜3.7的水溶液中水解。基材可用于制备纤维增强塑料如预浸料聚环氧化物基材。获得纤维基质和聚合物之间的粘合性提高。

2. 发明授权

US4563385A Hybrid glass cloth for printed circuit boards 失效
标题翻译：用于印刷电路板的混合玻璃布
公开(公告)号：US4563385A
公开(公告)日：1986-01-07
申请号：US622513
申请日：1984-06-20
申请人： Anilkumar C. Bhatt , Donald E. Doran , James W. Knight
发明人： Anilkumar C. Bhatt , Donald E. Doran , James W. Knight
IPC分类号： B32B15/08 , B32B5/08 , B32B15/14 , B32B17/04 , D03D1/00 , D03D15/00 , D03D15/12 , H05K1/03 , B32B7/00
CPC分类号： D03D1/0082 , D03D11/00 , D03D15/00 , D03D15/0011 , H05K1/0366 , D10B2101/06 , D10B2505/02 , H05K2201/029 , Y10S428/901 , Y10T442/322 , Y10T442/3528 , Y10T442/3569
摘要： Woven glass fiber cloth for printed circuit substrates in which the warp is of plied yarn and the fill is of unplied or twisted yarn to facilitate more thorough polymeric resin impregnation and achieve improved dimensional stability.
摘要翻译：用于印刷电路基板的编织玻璃纤维布，其中经线为合股纱线，填充物为未加捻或加捻纱线，以促进更彻底的聚合树脂浸渍并实现改进的尺寸稳定性。

3. 发明授权

US4579772A Glass cloth for printed circuits and method of manufacture wherein yarns have a substantially elliptical cross-section 失效
标题翻译：用于印刷电路的玻璃布及其制造方法，其中纱线具有大致椭圆形的横截面
公开(公告)号：US4579772A
公开(公告)日：1986-04-01
申请号：US562664
申请日：1983-12-19
申请人： Anilkumar C. Bhatt , Michael J. Cibulsky , Donald E. Doran , Lawrence J. Hugaboom , James W. Knight
发明人： Anilkumar C. Bhatt , Michael J. Cibulsky , Donald E. Doran , Lawrence J. Hugaboom , James W. Knight
IPC分类号： D03D1/00 , D03D15/00 , D03D15/12 , H05K1/03 , B32B17/02 , B32B17/04
CPC分类号： D03D1/0082 , D03D1/00 , D03D15/00 , D03D15/0011 , D03D15/0083 , H05K1/0366 , D10B2505/02 , H05K2201/029 , H05K2201/0296 , Y10S428/901 , Y10T428/2973 , Y10T442/2008 , Y10T442/2951 , Y10T442/3114
摘要： Woven glass cloth and method of its manufacture suitable for use as a resin-impregnated substrate for printed circuits in which the major dimension or transverse axis of the elliptical warp yarns exceeds a predetermined fraction of that dimension of the fill yarns of the woven cloth. Multi-filament warp yarns are typically subjected to tensile stress during weaving and firing such that the yarn compaction prevents the thorough impregnation by a resin. The result is that voids are maintained along the innermost filaments of the yarn. These voids, when filled with materials other than resin, such as plating solution, ultimately produce circuit failures.
摘要翻译：编织玻璃布及其制造方法适合用作印刷电路用树脂浸渍基材，其中椭圆经纱的主要尺寸或横轴超过织布的填充纱线的该尺寸的预定分数。多丝经纱通常在织造和烧制期间经受拉伸应力，使得纱线压实防止树脂的彻底浸渍。结果是沿着纱线的最内侧的细丝保持空隙。当填充树脂以外的材料（如电镀溶液）时，这些空隙最终会导致电路故障。

4. 发明授权

US06781064B1 Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same 失效
标题翻译：具有无玻璃非导电层的电子器件封装的印刷电路板及其形成方法
公开(公告)号：US06781064B1
公开(公告)日：2004-08-24
申请号：US09342584
申请日：1999-06-29
申请人： Bernd K. Appelt , Anilkumar C. Bhatt , James W. Fuller, Jr. , John M. Lauffer , Voya R. Markovich , William J. Rudik , William E. Wilson
发明人： Bernd K. Appelt , Anilkumar C. Bhatt , James W. Fuller, Jr. , John M. Lauffer , Voya R. Markovich , William J. Rudik , William E. Wilson
IPC分类号： H05K103
CPC分类号： H01L23/564 , H01L21/481 , H01L23/498 , H01L23/49894 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/181 , H05K1/036 , H05K1/0366 , H05K3/429 , H05K3/4626 , H05K3/4641 , H05K2201/0195 , H05K2201/0769 , H05K2201/09718 , H05K2201/09881 , H01L2924/00014 , H01L2924/00012
摘要： A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package. This printed circuit board includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.
摘要翻译：一种用于诸如球栅阵列封装或有机芯片载体封装的电子器件封装中的印刷电路板。该印刷电路板包括一个无玻璃的电介质，用于分离和绝缘电源芯，电路或电镀通孔，以防止导电材料沿玻璃基预浸料衬底迁移引起的短路。

5. 发明授权

US06495239B1 Dielectric structure and method of formation 失效
标题翻译：介电结构和形成方法
公开(公告)号：US06495239B1
公开(公告)日：2002-12-17
申请号：US09458291
申请日：1999-12-10
申请人： Anilkumar C. Bhatt , Stephen J. Fuerniss , Roy H. Magnuson , Voya R. Markovich
发明人： Anilkumar C. Bhatt , Stephen J. Fuerniss , Roy H. Magnuson , Voya R. Markovich
IPC分类号： B32B310
CPC分类号： B32B7/04 , B32B27/26 , B32B27/32 , B32B2250/40 , B32B2305/72 , H05K3/0023 , H05K3/4602 , H05K3/4623 , H05K3/4626 , H05K3/4641 , H05K2201/09509 , H05K2201/09536 , Y10S428/901 , Y10T428/24273 , Y10T428/28 , Y10T428/31511
摘要： A dielectric structure, wherein two fully cured photoimageable dielectric (PID) layers of the structure are nonadhesively interfaced by a partially cured PID layer. The partially cured PID layer includes a power plane sandwiched between a first partially cured PID sheet and a second partially cured PID sheet. The fully cured PID layers each include an internal power plane, a plated via having a blind end conductively coupled to the internal power plane, and a plated via passing through the fully cured PID layer. The dielectric structure may further include a first PID film partially cured and nonadhesively coupled to one of the fully cured PID layers. The dialectric structure may further include a second PID film partially cured and nonadhesively coupled to the other fully cured PID layer.
摘要翻译：一种电介质结构，其中该结构的两个完全固化的可光成像电介质（PID）层通过部分固化的PID层非粘性地接合。部分固化的PID层包括夹在第一部分固化的PID片和第二部分固化的PID片之间的动力平面。完全固化的PID层各自包括内部电源平面，具有导电耦合到内部电源平面的盲端的电镀通孔以及穿过完全固化的PID层的电镀通孔。电介质结构还可以包括部分固化并非粘性地耦合到完全固化的PID层之一的第一PID膜。所述方程式结构还可以包括部分固化并非粘性地耦合到另一完全固化的PID层的第二PID膜。

6. 发明授权

US06221694B1 Method of making a circuitized substrate with an aperture 失效
标题翻译：制造具有孔径的电路化基板的方法
公开(公告)号：US06221694B1
公开(公告)日：2001-04-24
申请号：US09343080
申请日：1999-06-29
申请人： Anilkumar C. Bhatt , Michael J. Cummings , Thomas R. Miller , Kristen A. Stauffer , Michael Wozniak
发明人： Anilkumar C. Bhatt , Michael J. Cummings , Thomas R. Miller , Kristen A. Stauffer , Michael Wozniak
IPC分类号： H01L2144
CPC分类号： H01L21/4803 , H01L21/4846 , H01L21/486 , H01L23/13 , H01L23/49805 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H05K1/021 , H05K1/182 , H05K3/0061 , H05K3/427 , H05K2201/09554 , H05K2201/09981 , H05K2203/049 , H01L2224/05599 , H01L2924/00
摘要： A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and routing out a preselected portion of the base member to form an aperture. Metallization of the dielectric member and the walls of the aperture then occurs, followed by circuitization of the surfaces of the dielectric member. Direct metallization of the aperture walls eliminates many manufacturing steps previously required to metallize the aperture walls.
摘要翻译：制造可用作芯片载体结构的电路化衬底的方法。该方法包括以下步骤：提供电介质构件并布置出基底构件的预选部分以形成孔。然后发生电介质构件和孔的壁的金属化，随后电介质构件的表面被电路化。孔壁的直接金属化消除了先前为孔壁金属化所需的许多制造步骤。

7. 发明授权

US06187965B1 Process for recovering high boiling solvents from a photolithographic waste stream comprising at least 10 percent by weight of monomeric units 失效
标题翻译：从包含至少10重量％单体单元的光刻废料流中回收高沸点溶剂的方法
公开(公告)号：US06187965B1
公开(公告)日：2001-02-13
申请号：US09188007
申请日：1998-11-06
申请人： Anilkumar C. Bhatt , Jerome J. Wagner
发明人： Anilkumar C. Bhatt , Jerome J. Wagner
IPC分类号： C07C2980
CPC分类号： C07D307/33 , C07C29/80 , C07C33/20 , C07C33/22 , C07C33/24
摘要： A method of recovering benzyl alcohol, gamma butyrolactone, or propylene carbonate from an impure effluent stream of an industrial process is provided. The effluent waste stream contains greater than about 10 percent by weight of monomeric units that are reacted to form larger oligomers and polymers. The first step in the recovery process involves polymerizing the monomeric units present in the effluent waste stream under conditions effective to reduce the concentration of monomeric units in the waste stream to less than about 10 weight percent. The waste stream then is fed to a first separation stage where it is separated into (i) a gaseous stream of water, soluble gases, and volatile contaminants and (ii) a suspension comprising the high boiling solvent, semi-volatile materials, and non-volatile contaminants and materials. Then the dewatered, low vapor pressure, high boiling solvent-containing suspension is either distilled or evaporated to separate the high boiling solvent from non-volatile materials. In this second separation stage, the solvent-containing suspension is separated into (i) a solvent-containing fraction, and (ii) a sludge fraction. The sludge fraction contains non-volatile materials in the high boiling solvent.
摘要翻译：提供了从工业过程不纯的流出物流中回收苄醇，γ-丁内酯或碳酸亚丙酯的方法。流出物废物流含有大于约10重量％的单体单元，其被反应以形成较大的低聚物和聚合物。回收过程中的第一步包括在有效降低废物流中的单体单元浓度至小于约10重量％的条件下聚合存在于流出物废物流中的单体单元。然后将废物流送入第一分离阶段，在该分离阶段将其分离为（i）气态的水流，可溶性气体和挥发性污染物，和（ii）包含高沸点溶剂，半挥发性物质和非挥发性物质的悬浮液挥发性污染物和材料。然后将脱水，低蒸气压，高沸点溶剂的悬浮液蒸馏或蒸发，以将高沸点溶剂与非挥发性物质分离。在该第二分离阶段，将含溶剂的悬浮液分离成（i）含溶剂的级分，和（ii）污泥馏分。污泥级分在高沸点溶剂中含有非挥发性物质。

8. 发明授权

US5557844A Method of preparing a printed circuit board 失效
标题翻译：印刷电路板的制备方法
公开(公告)号：US5557844A
公开(公告)日：1996-09-24
申请号：US463344
申请日：1995-06-05
申请人： Anilkumar C. Bhatt , Roy H. Magnuson , Voya R. Markovich , Konstantinos I. Papathomas , Douglas O. Powell
发明人： Anilkumar C. Bhatt , Roy H. Magnuson , Voya R. Markovich , Konstantinos I. Papathomas , Douglas O. Powell
IPC分类号： H01L23/538 , H05K1/11 , H05K3/00 , H05K3/42 , H05K3/46 , H01K3/10
CPC分类号： H05K3/0094 , H01L23/5384 , H05K1/112 , H05K3/4602 , H01L2224/16 , H01L2224/16225 , H01L2924/01004 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K2201/092 , H05K2201/09472 , H05K2201/09509 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H05K2203/0191 , H05K2203/0278 , H05K3/0023 , H05K3/429 , Y10T29/49126 , Y10T29/49165
摘要： Disclosed is a printed circuit board and a method of preparing the printed circuit board, The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.
摘要翻译：公开了印刷电路板和制备印刷电路板的方法。印刷电路板具有两种类型的电镀通孔。第一类型的电镀通孔延伸到印刷电路板的外表面并通过印刷电路板的外表面，用于接收针式通孔模块或部件销。第二种类型的电镀通孔用于表面贴装技术，并终止在印刷电路板的外表面之下。这些电镀通孔包含填充组合物。

9. 发明授权

US5487218A Method for making printed circuit boards with selectivity filled plated through holes 失效
标题翻译：制造具有选择性填充电镀通孔的印刷电路板的方法
公开(公告)号：US5487218A
公开(公告)日：1996-01-30
申请号：US342533
申请日：1994-11-21
申请人： Anilkumar C. Bhatt , Roy H. Magnuson , Voya R. Markovich , Konstantinos I. Papathomas , Douglas O. Powell
发明人： Anilkumar C. Bhatt , Roy H. Magnuson , Voya R. Markovich , Konstantinos I. Papathomas , Douglas O. Powell
IPC分类号： H01L23/538 , H05K1/11 , H05K3/00 , H05K3/42 , H05K3/46 , H01K3/10
CPC分类号： H05K3/0094 , H01L23/5384 , H05K1/112 , H05K3/4602 , H01L2224/16 , H01L2224/16225 , H01L2924/01004 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K2201/092 , H05K2201/09472 , H05K2201/09509 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H05K2203/0191 , H05K2203/0278 , H05K3/0023 , H05K3/429 , Y10T29/49126 , Y10T29/49165
摘要： Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.
摘要翻译：公开了印刷电路板和制备印刷电路板的方法。印刷电路板有两种电镀通孔。第一类型的电镀通孔延伸到印刷电路板的外表面并通过印刷电路板的外表面，用于接收针式通孔模块或部件销。第二种类型的电镀通孔用于表面贴装技术，并终止在印刷电路板的外表面之下。这些电镀通孔包含填充组合物。

10. 发明授权

US06418616B2 Full additive process with filled plated through holes 失效
标题翻译：完全添加过程，填充电镀通孔
公开(公告)号：US06418616B2
公开(公告)日：2002-07-16
申请号：US09795852
申请日：2001-02-28
申请人： Anilkumar C. Bhatt , Voya R. Markovich , Irving Memis , William E. Wilson
发明人： Anilkumar C. Bhatt , Voya R. Markovich , Irving Memis , William E. Wilson
IPC分类号： H01K310
CPC分类号： H05K3/0094 , B32B7/04 , H05K1/0306 , H05K1/113 , H05K3/0023 , H05K3/045 , H05K3/184 , H05K3/4053 , H05K3/4069 , H05K3/426 , H05K3/427 , H05K3/4605 , H05K2201/0154 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/10734 , H05K2203/0191 , H05K2203/025 , H05K2203/0278 , H05K2203/0338 , H05K2203/0353 , H05K2203/1152 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method provides for additive plating on a subcomposite having filled plated through holes. Fine-line circuitry is achieved via electroless deposition onto a dielectric substrate after the through hole is plated and filled. Fine-line circuitry may be routed over landless, plated through holes thereby increasing the aspect ratio and the available surface area for additional components and wiring.
摘要翻译：一种方法提供在具有填充的电镀通孔的子复合材料上的添加电镀。在电穿孔和填充通孔之后，通过无电沉积实现细线电路。精细线路电路可以通过无地电镀通孔，从而增加纵横比和用于附加部件和布线的可用表面积。

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