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1. 发明申请

US20080217049A1 EMBEDDED CAPACITIVE STACK 有权
公开(公告)号：US20080217049A1
公开(公告)日：2008-09-11
申请号：US12045660
申请日：2008-03-10
申请人： George Dudnikov
发明人： George Dudnikov
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H01G4/06 , H01G4/30 , H01G4/306 , H05K1/0216 , H05K1/0231 , H05K1/113 , H05K1/18 , H05K3/4602 , H05K3/4641 , H05K2201/0191 , H05K2201/0209 , H05K2201/0257 , H05K2201/0355 , H05K2201/093 , H05K2201/09309 , H05K2201/09518 , H05K2201/09663 , H05K2203/162 , Y10T29/43 , Y10T29/435 , Y10T29/49036 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： A novel method for manufacturing embedded a capacitive stack and a novel capacitive stack apparatus are provided having a capacitive core that serves as a structural substrate on which alternating thin conductive foils and nanopowder-loaded dielectric layers may be added and tested for reliability. This layering and testing allows early fault detection of the thin dielectric layers of the capacitive stack. The capacitive stack may be configured to supply multiple isolated capacitive elements that provide segregated, device-specific decoupling capacitance to one or more electrical components. The capacitive stack may serve as a core substrate on which a plurality of additional signaling layers of a multilayer circuit board may be coupled.

2. 发明授权

US07297896B2 Laser trimming of resistors 有权
标题翻译：激光微调电阻
公开(公告)号：US07297896B2
公开(公告)日：2007-11-20
申请号：US11254253
申请日：2005-10-19
申请人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
发明人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
IPC分类号： B23K26/38 , G06F19/00
CPC分类号： H01C17/242 , H05K1/167
摘要： Improved systems and methods for laser trimming resistors are provided. An exemplary embodiment measures a resistance value for each resistor and sorts the resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.
摘要翻译：提供了改进的激光微调电阻的系统和方法。一个示例性实施例测量每个电阻器的电阻值，并且基于测量的电阻值和与每个电阻器相关联的目标电阻值，将电阻器分类成一个或多个箱体。然后可以基于预测装饰公式将激光修剪文件分配给每个仓，其中每个激光修剪文件定义一组激光钻孔的配置参数，以使每个电阻器具有其各自的目标值。激光钻孔机使用激光修剪文件根据分配给该纸盒的激光修剪文件来修整每个纸槽内的电阻器。

3. 发明申请

US20080216298A1 EMBEDDED CAPACITIVE STACK 有权
标题翻译：嵌入式电容堆叠
公开(公告)号：US20080216298A1
公开(公告)日：2008-09-11
申请号：US12045656
申请日：2008-03-10
申请人： George Dudnikov
发明人： George Dudnikov
IPC分类号： H01G4/30 , H05K3/20
CPC分类号： H05K1/162 , H01G4/06 , H01G4/30 , H01G4/306 , H05K1/0216 , H05K1/0231 , H05K1/113 , H05K1/18 , H05K3/4602 , H05K3/4641 , H05K2201/0191 , H05K2201/0209 , H05K2201/0257 , H05K2201/0355 , H05K2201/093 , H05K2201/09309 , H05K2201/09518 , H05K2201/09663 , H05K2203/162 , Y10T29/43 , Y10T29/435 , Y10T29/49036 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： A novel method for manufacturing embedded a capacitive stack and a novel capacitive stack apparatus are provided having a capacitive core that serves as a structural substrate on which alternating thin conductive foils and nanopowder-loaded dielectric layers may be added and tested for reliability. This layering and testing allows early fault detection of the thin dielectric layers of the capacitive stack. The capacitive stack may be configured to supply multiple isolated capacitive elements that provide segregated, device-specific decoupling capacitance to one or more electrical components. The capacitive stack may serve as a core substrate on which a plurality of additional signaling layers of a multilayer circuit board may be coupled.
摘要翻译：提供了一种用于制造嵌入式电容堆叠的新方法和一种新颖的电容堆叠装置，其具有用作结构衬底的电容性芯，其上可以添加交替的薄导电箔和纳米粉末负载的电介质层并进行可靠性测试。这种分层和测试允许电容堆叠的薄介电层的早期故障检测。电容堆叠可以被配置为提供多个隔离的电容元件，其向一个或多个电气元件提供隔离的，器件特定的去耦电容。电容堆叠可以用作核心衬底，多层电路板的多个附加信号层可以耦合在其上。

4. 发明申请

US20060181827A1 Selective deposition of embedded transient protection for printed circuit boards 有权
公开(公告)号：US20060181827A1
公开(公告)日：2006-08-17
申请号：US11357618
申请日：2006-02-16
申请人： George Dudnikov , Franz Gisin , Gregory Schroeder
发明人： George Dudnikov , Franz Gisin , Gregory Schroeder
IPC分类号： H02H9/00
CPC分类号： H05K1/0257 , H01L23/62 , H01L2924/0002 , H05K1/0259 , H05K1/0298 , H05K1/167 , H05K2201/0738 , H05K2201/09309 , H01L2924/00
摘要： Protection for sensitive components on a printed circuit board by selectively depositing transient protection material on one or more layers of the printed circuit board is disclosed.

5. 发明申请

US20060213882A1 Laser trimming of resistors 有权
标题翻译：激光微调电阻
公开(公告)号：US20060213882A1
公开(公告)日：2006-09-28
申请号：US11254253
申请日：2005-10-19
申请人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
发明人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
IPC分类号： B23K26/36
CPC分类号： H01C17/242 , H05K1/167
摘要： Improved systems and methods for laser trimming resistors are provided. An exemplary embodiment measures a resistance value for each resistor and sorts the resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.
摘要翻译：提供了改进的激光微调电阻的系统和方法。一个示例性实施例测量每个电阻器的电阻值，并且基于测量的电阻值和与每个电阻器相关联的目标电阻值，将电阻器分类成一个或多个箱体。然后可以基于预测装饰公式将激光修剪文件分配给每个仓，其中每个激光修剪文件定义一组激光钻孔的配置参数，以使每个电阻器具有其各自的目标值。激光钻孔机使用激光修剪文件根据分配给该纸盒的激光修剪文件来修整每个纸槽内的电阻。

6. 发明申请

US20060181826A1 Substantially continuous layer of embedded transient protection for printed circuit boards 有权
标题翻译：基本连续的印刷电路板瞬态保护层
公开(公告)号：US20060181826A1
公开(公告)日：2006-08-17
申请号：US11356562
申请日：2006-02-16
申请人： George Dudnikov , Franz Gisin , Gregory Schroeder
发明人： George Dudnikov , Franz Gisin , Gregory Schroeder
IPC分类号： H02H9/00
CPC分类号： H05K1/0257 , H01L23/62 , H01L2924/0002 , H05K1/0259 , H05K1/0298 , H05K1/167 , H05K2201/0738 , H05K2201/09309 , H01L2924/00
摘要： The protection of sensitive components on printed circuit boards by using planar transient protection material in one or more layers of a printed circuit board stackup is disclosed.
摘要翻译：公开了通过在印刷电路板叠层的一层或多层中使用平面瞬态保护材料来保护印刷电路板上的敏感部件。

7. 发明授权

US06940038B2 Laser trimming of resistors 有权
公开(公告)号：US06940038B2
公开(公告)日：2005-09-06
申请号：US10454253
申请日：2003-06-03
申请人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
发明人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
IPC分类号： H01C17/242 , H05K1/11 , H05K1/16 , H05K3/02 , B23K26/38
CPC分类号： H05K1/167 , H01C17/242 , H05K1/116 , H05K3/027 , H05K2203/171
摘要： Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.

8. 发明申请

US20050168318A1 Laser trimming of resistors 有权
标题翻译：激光微调电阻
公开(公告)号：US20050168318A1
公开(公告)日：2005-08-04
申请号：US11094003
申请日：2005-03-29
申请人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
发明人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
IPC分类号： H01C17/242 , H05K1/11 , H05K1/16 , H05K3/02 , H01C10/00
CPC分类号： H05K1/167 , B23K26/351 , H01C17/242 , H05K1/116 , H05K3/027 , H05K2203/171
摘要： Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.
摘要翻译：提供了改进的印刷在基底层上的激光微调电阻的系统和方法。示例性实施例测量每个环形电阻器的电阻值，并且基于所测量的电阻值和与每个电阻器相关联的目标电阻值，将环形电阻器分类成一个或多个箱体。然后可以基于预测装饰公式将激光修剪文件分配给每个仓，其中每个激光修剪文件定义一组激光钻孔的配置参数，以使每个电阻器具有其各自的目标值。激光钻孔机使用激光修剪文件根据分配给该纸盒的激光修剪文件来修整每个纸槽内的电阻器。

9. 发明授权

US09161447B2 Embedded capacitive stack 有权
标题翻译：嵌入式电容堆栈
公开(公告)号：US09161447B2
公开(公告)日：2015-10-13
申请号：US12045660
申请日：2008-03-10
申请人： George Dudnikov
发明人： George Dudnikov
IPC分类号： H05K1/16 , H05K1/02 , H05K1/18 , H01G4/06 , H01G4/30 , H05K1/11 , H05K3/46
CPC分类号： H05K1/162 , H01G4/06 , H01G4/30 , H01G4/306 , H05K1/0216 , H05K1/0231 , H05K1/113 , H05K1/18 , H05K3/4602 , H05K3/4641 , H05K2201/0191 , H05K2201/0209 , H05K2201/0257 , H05K2201/0355 , H05K2201/093 , H05K2201/09309 , H05K2201/09518 , H05K2201/09663 , H05K2203/162 , Y10T29/43 , Y10T29/435 , Y10T29/49036 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： A novel method for manufacturing embedded a capacitive stack and a novel capacitive stack apparatus are provided having a capacitive core that serves as a structural substrate on which alternating thin conductive foils and nanopowder-loaded dielectric layers may be added and tested for reliability. This layering and testing allows early fault detection of the thin dielectric layers of the capacitive stack. The capacitive stack may be configured to supply multiple isolated capacitive elements that provide segregated, device-specific decoupling capacitance to one or more electrical components. The capacitive stack may serve as a core substrate on which a plurality of additional signaling layers of a multilayer circuit board may be coupled.
摘要翻译：提供了一种用于制造嵌入式电容堆叠的新方法和一种新颖的电容堆叠装置，其具有用作结构衬底的电容性芯，其上可以添加交替的薄导电箔和纳米粉末负载的电介质层并进行可靠性测试。这种分层和测试允许电容堆叠的薄介电层的早期故障检测。电容堆叠可以被配置为提供多个隔离的电容元件，其向一个或多个电气元件提供隔离的，器件特定的去耦电容。电容堆叠可以用作核心衬底，多层电路板的多个附加信号层可以耦合在其上。

10. 发明授权

US08713769B2 Embedded capacitive stack 有权
标题翻译：嵌入式电容堆栈
公开(公告)号：US08713769B2
公开(公告)日：2014-05-06
申请号：US12045656
申请日：2008-03-10
申请人： George Dudnikov
发明人： George Dudnikov
IPC分类号： H01G7/00
CPC分类号： H05K1/162 , H01G4/06 , H01G4/30 , H01G4/306 , H05K1/0216 , H05K1/0231 , H05K1/113 , H05K1/18 , H05K3/4602 , H05K3/4641 , H05K2201/0191 , H05K2201/0209 , H05K2201/0257 , H05K2201/0355 , H05K2201/093 , H05K2201/09309 , H05K2201/09518 , H05K2201/09663 , H05K2203/162 , Y10T29/43 , Y10T29/435 , Y10T29/49036 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： A novel method for manufacturing embedded a capacitive stack and a novel capacitive stack apparatus are provided having a capacitive core that serves as a structural substrate on which alternating thin conductive foils and nanopowder-loaded dielectric layers may be added and tested for reliability. This layering and testing allows early fault detection of the thin dielectric layers of the capacitive stack. The capacitive stack may be configured to supply multiple isolated capacitive elements that provide segregated, device-specific decoupling capacitance to one or more electrical components. The capacitive stack may serve as a core substrate on which a plurality of additional signaling layers of a multilayer circuit board may be coupled.
摘要翻译：提供了一种用于制造嵌入式电容堆叠的新方法和一种新颖的电容堆叠装置，其具有用作结构衬底的电容性芯，其上可以添加交替的薄导电箔和纳米粉末负载的电介质层并进行可靠性测试。这种分层和测试允许电容堆叠的薄介电层的早期故障检测。电容堆叠可以被配置为提供多个隔离的电容元件，其向一个或多个电气元件提供隔离的，器件特定的去耦电容。电容堆叠可以用作核心衬底，多层电路板的多个附加信号层可以耦合在其上。

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