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    • 3. 发明授权
    • Semiconductor memory device and manufacturing method thereof
    • 半导体存储器件及其制造方法
    • US07982244B2
    • 2011-07-19
    • US12553496
    • 2009-09-03
    • Atsuhiro SatoHiroyuki NittaFumitaka Arai
    • Atsuhiro SatoHiroyuki NittaFumitaka Arai
    • H01L29/68H01L29/417H01L27/105
    • H01L27/11524H01L21/76816H01L27/11521
    • A semiconductor memory device includes a first block having first memory cells and first select transistors, a second block having second memory cells and second select transistors, and arranged adjacent to the first block in a first direction, the second select transistor being arranged to face the first select transistor and commonly having a diffusion region with the first select transistor, a first interconnection layer provided on the diffusion region between the first and second blocks and extending in a second direction, and a second interconnection layer having a first portion provided in contact with an upper portion of the first interconnection layer and extending to a portion outside the first interconnection layer, and a second portion extending in the second direction and connected to the first portion in a portion outside a portion on the first interconnection layer.
    • 半导体存储器件包括具有第一存储器单元和第一选择晶体管的第一块,具有第二存储单元和第二选择晶体管的第二块,并且沿第一方向布置成与第一块相邻,第二选择晶体管被布置为面对 第一选择晶体管,并且通常具有与第一选择晶体管的扩散区,第一互连层,设置在第一和第二块之间的扩散区上并沿第二方向延伸;第二互连层,具有设置成与第一选择晶体管接触的第一部分 第一互连层的上部并且延伸到第一互连层外部的部分,以及第二部分,其在第二方向上延伸并且在第一互连层上的部分外部的部分连接到第一部分。
    • 4. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    • 半导体存储器件及其制造方法
    • US20110250744A1
    • 2011-10-13
    • US13164931
    • 2011-06-21
    • Atsuhiro SATOHiroyuki NittaFumitaka Arai
    • Atsuhiro SATOHiroyuki NittaFumitaka Arai
    • H01L21/28
    • H01L27/11524H01L21/76816H01L27/11521
    • A semiconductor memory device includes a first block having first memory cells and first select transistors, a second block having second memory cells and second select transistors, and arranged adjacent to the first block in a first direction, the second select transistor being arranged to face the first select transistor and commonly having a diffusion region with the first select transistor, a first interconnection layer provided on the diffusion region between the first and second blocks and extending in a second direction, and a second interconnection layer having a first portion provided in contact with an upper portion of the first interconnection layer and extending to a portion outside the first interconnection layer, and a second portion extending in the second direction and connected to the first portion in a portion outside a portion on the first interconnection layer.
    • 半导体存储器件包括具有第一存储器单元和第一选择晶体管的第一块,具有第二存储单元和第二选择晶体管的第二块,并且沿第一方向布置成与第一块相邻,第二选择晶体管被布置为面对 第一选择晶体管,并且通常具有与第一选择晶体管的扩散区,第一互连层,设置在第一和第二块之间的扩散区上并沿第二方向延伸;第二互连层,具有设置成与第一选择晶体管接触的第一部分 第一互连层的上部并且延伸到第一互连层外部的部分,以及第二部分,其在第二方向上延伸并且在第一互连层上的部分外部的部分连接到第一部分。
    • 5. 发明授权
    • Semiconductor memory device and manufacturing method thereof
    • 半导体存储器件及其制造方法
    • US08377814B2
    • 2013-02-19
    • US13164931
    • 2011-06-21
    • Atsuhiro SatoHiroyuki NittaFumitaka Arai
    • Atsuhiro SatoHiroyuki NittaFumitaka Arai
    • H01L21/28
    • H01L27/11524H01L21/76816H01L27/11521
    • A semiconductor memory device includes a first block having first memory cells and first select transistors, a second block having second memory cells and second select transistors, and arranged adjacent to the first block in a first direction, the second select transistor being arranged to face the first select transistor and commonly having a diffusion region with the first select transistor, a first interconnection layer provided on the diffusion region between the first and second blocks and extending in a second direction, and a second interconnection layer having a first portion provided in contact with an upper portion of the first interconnection layer and extending to a portion outside the first interconnection layer, and a second portion extending in the second direction and connected to the first portion in a portion outside a portion on the first interconnection layer.
    • 半导体存储器件包括具有第一存储器单元和第一选择晶体管的第一块,具有第二存储单元和第二选择晶体管的第二块,并且沿第一方向布置成与第一块相邻,第二选择晶体管被布置为面对 第一选择晶体管,并且通常具有与第一选择晶体管的扩散区,第一互连层,设置在第一和第二块之间的扩散区上并沿第二方向延伸;第二互连层,具有设置成与第一选择晶体管接触的第一部分 第一互连层的上部并且延伸到第一互连层外部的部分,以及第二部分,其在第二方向上延伸并且在第一互连层上的部分外部的部分连接到第一部分。
    • 6. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    • 半导体存储器件及其制造方法
    • US20100052017A1
    • 2010-03-04
    • US12553496
    • 2009-09-03
    • Atsuhiro SATOHiroyuki NittaFumitaka Arai
    • Atsuhiro SATOHiroyuki NittaFumitaka Arai
    • H01L29/66H01L21/4763
    • H01L27/11524H01L21/76816H01L27/11521
    • A semiconductor memory device includes a first block having first memory cells and first select transistors, a second block having second memory cells and second select transistors, and arranged adjacent to the first block in a first direction, the second select transistor being arranged to face the first select transistor and commonly having a diffusion region with the first select transistor, a first interconnection layer provided on the diffusion region between the first and second blocks and extending in a second direction, and a second interconnection layer having a first portion provided in contact with an upper portion of the first interconnection layer and extending to a portion outside the first interconnection layer, and a second portion extending in the second direction and connected to the first portion in a portion outside a portion on the first interconnection layer.
    • 半导体存储器件包括具有第一存储器单元和第一选择晶体管的第一块,具有第二存储单元和第二选择晶体管的第二块,并且沿第一方向布置成与第一块相邻,第二选择晶体管被布置为面对 第一选择晶体管,并且通常具有与第一选择晶体管的扩散区,第一互连层,设置在第一和第二块之间的扩散区上并沿第二方向延伸;第二互连层,具有设置成与第一选择晶体管接触的第一部分 第一互连层的上部并且延伸到第一互连层外部的部分,以及第二部分,其在第二方向上延伸并且在第一互连层上的部分外部的部分连接到第一部分。
    • 8. 发明授权
    • Display drive circuit
    • 显示驱动电路
    • US08154560B2
    • 2012-04-10
    • US12468345
    • 2009-05-19
    • Yoshiki KurokawaYasuyuki KudoHiroyuki NittaKazuki HommaJunya Takeda
    • Yoshiki KurokawaYasuyuki KudoHiroyuki NittaKazuki HommaJunya Takeda
    • G09G5/00G09G5/02H04N1/46H04N1/60G06T1/00G06K9/00G06K9/40
    • G09G1/002G09G3/3655G09G5/04G09G5/06G09G2320/0242G09G2340/145
    • A display drive circuit of the invention has: an initial-color-gamut-apex-coordinate-storing unit capable of storing initial color gamut apex coordinates; a user-target-color-gamut-apex-coordinate-storing unit capable of storing user target color gamut apex coordinates; a saturation-expansion-coefficient-deciding unit for deciding expansion coefficients of saturation data based on the initial and user target color gamut apex coordinates; and an expansion unit for expanding saturations of display data based on the saturation expansion coefficients. The expansion coefficients of saturation data are decided based on the initial and user target color gamut apex coordinates, and saturations of display data are expanded according to the expansion coefficients. Thus, the degree of expanding the saturations can be controlled for each color gamut or each of R, G and B color properties of an LC display panel.
    • 本发明的显示驱动电路具有:能够存储初始色域顶点坐标的初始色域 - 顶点坐标存储单元; 能够存储用户目标色域顶点坐标的用户对象色彩 - 顶点坐标存储单元; 饱和扩张系数决定单元,用于基于初始和用户目标色域顶点坐标来确定饱和度数据的扩展系数; 以及用于基于饱和度膨胀系数扩大显示数据的饱和度的扩展单元。 基于初始和用户目标色域顶点坐标来确定饱和度数据的扩展系数,根据扩展系数扩展显示数据的饱和度。 因此,可以对于每个色域或LC显示面板的R,G和B颜色属性中的每一个来控制饱和度的扩大程度。
    • 9. 发明授权
    • Nonvolatile semiconductor memory device and method of manufacturing the same
    • 非易失性半导体存储器件及其制造方法
    • US08008704B2
    • 2011-08-30
    • US12372505
    • 2009-02-17
    • Hiroyuki Nitta
    • Hiroyuki Nitta
    • H01L21/00
    • H01L27/11524H01L21/764H01L23/5222H01L27/11521H01L2924/0002H01L2924/00
    • To reduce capacitance between each adjacent two word lines in a semiconductor memory device, a first insulating film is formed, with a first gate insulating film thereunder, in an interstice between gates respectively of each adjacent two memory transistors, and in an interstice between a gate of a selective transistor and a gate of a memory transistor adjacent thereto. Additionally, a second insulating film is formed on the first insulating film, sides of the gate of each memory transistor, and a side, facing the memory transistor, of the gate of the selective transistor. A third insulating film is formed parallel to a semiconductor substrate so as to cover a metal silicide film, the first and second insulating films and fourth and fifth insulating films. A void part is provided in the interstice between each adjacent two gates of the memory transistors, and in the interstice between the gate of the selective transistor and the gate of the memory transistor adjacent thereto. A bottom and two sides of each void part are shielded by the second insulating film, and a top of each void part is shielded by the third insulating film.
    • 为了减小半导体存储器件中每个相邻两个字线之间的电容,在每个相邻的两个存储晶体管的栅极之间的间隙中形成第一绝缘膜,其间具有第一栅极绝缘膜,并且在栅极 的选择晶体管和与其相邻的存储晶体管的栅极。 此外,第二绝缘膜形成在第一绝缘膜上,每个存储晶体管的栅极的侧面和面向存储晶体管的选择性晶体管的栅极的一侧。 第三绝缘膜平行于半导体衬底形成以覆盖金属硅化物膜,第一和第二绝缘膜以及第四和第五绝缘膜。 在存储晶体管的每个相邻的两个栅极之间的间隙中以及与选择晶体管的栅极和与其相邻的存储晶体管的栅极之间的空隙中设置空隙部分。 每个空隙部分的底部和两侧被第二绝缘膜屏蔽,并且每个空隙部分的顶部被第三绝缘膜屏蔽。