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1. 发明申请

US20150131328A1 SYSTEM AND METHOD FOR POWER CONVERSION 审中-公开
标题翻译：用于功率转换的系统和方法
公开(公告)号：US20150131328A1
公开(公告)日：2015-05-14
申请号：US14074778
申请日：2013-11-08
申请人： General Electric Company
发明人： Fengfeng Tao , Michael Joseph Schutten , Eladio Clemente Delgado , Luis Jose Garces , Rui Zhou , Xinhui Wu , Maja Harfman Todorovic , Lei Wang
IPC分类号： H02M3/335
CPC分类号： H02M3/3376 , H02M2001/0058 , H02M2001/0093 , Y02B70/1433 , Y02B70/1491
摘要： A power conversion system is presented. The system includes a power source coupled to a power converter and a controller. The controller is configured to determine a value of at least one parameter corresponding to the power source. Additionally, the controller is configured to provide a first portion of the at least one parameter to the power converter and modify an operating frequency of the power converter, duty ratio of the power converter, or a combination thereof. Furthermore, the controller is configured to obtain an electrical quantity at an output of the power converter based on the modified operating frequency, the modified duty ratio, or a combination thereof. Also, the controller is configured to deliver a combination of the electrical quantity obtained at the output of the power converter and a second portion of the at least one parameter to a load. Method for converting power is also presented.
摘要翻译：介绍了电力转换系统。该系统包括耦合到功率转换器和控制器的电源。控制器被配置为确定与电源对应的至少一个参数的值。此外，控制器被配置为向功率转换器提供至少一个参数的第一部分，并修改功率转换器的工作频率，功率转换器的占空比或其组合。此外，控制器被配置为基于修改的操作频率，修改的占空比或其组合来获得功率转换器的输出处的电量。此外，控制器被配置为将在功率转换器的输出处获得的电量和至少一个参数的第二部分的组合传递给负载。还介绍了转换功率的方法。

2. 发明申请

US20140167248A1 POWER MODULE PACKAGE 有权
标题翻译：电源模块封装
公开(公告)号：US20140167248A1
公开(公告)日：2014-06-19
申请号：US13720351
申请日：2012-12-19
申请人： GENERAL ELECTRIC COMPANY
发明人： Eladio Clemente Delgado , John Stanley Glaser , Brian Lynn Rowden
IPC分类号： H01L23/46 , H01L25/00
CPC分类号： H01L23/473 , H01L23/13 , H01L23/3735 , H01L23/46 , H01L24/19 , H01L24/24 , H01L24/83 , H01L25/50 , H01L2224/04105 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/83815 , H01L2224/92144 , H01L2224/9222 , H01L2924/01029 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/19043 , H01L2924/19105 , H01L2924/20105 , H01L2924/20106 , H01L2924/00
摘要： An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.
摘要翻译：集成功率模块包括具有至少一个切出区域的基本上平面的绝缘金属基板; 设置在所述切出区域内的至少一个基本上平面的陶瓷基板，其中所述陶瓷基板通过所述绝缘金属基板在至少两侧框架，所述陶瓷基板包括在第一侧上的第一金属层和在第一侧上的第二金属层第二面耦合到陶瓷衬底的第一侧的至少一个功率半导体器件; 耦合到所述绝缘金属基板的第一表面的至少一个控制装置; 功率覆盖层，电连接所述至少一个半导体功率器件和所述至少一个控制器件; 以及可操作地连接到所述至少一个陶瓷基板的第二金属层的冷却流体储存器，其中在所述冷却流体储存器中设置多个冷却流体通道。

3. 发明申请

US20140133104A1 LOW PROFILE SURFACE MOUNT PACKAGE WITH ISOLATED TAB 有权
标题翻译：低分辨率表面安装包与隔离的标签
公开(公告)号：US20140133104A1
公开(公告)日：2014-05-15
申请号：US13675084
申请日：2012-11-13
申请人： GENERAL ELECTRIC COMPANY
发明人： Eladio Clemente Delgado , John Stanley Glaser , Brian Lynn Rowden
IPC分类号： H05K7/20
CPC分类号： H01L24/19 , H01L23/3735 , H01L23/49805 , H01L23/49844 , H01L23/49894 , H01L23/5385 , H01L23/5389 , H01L24/06 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/06181 , H01L2224/12105 , H01L2224/24137 , H01L2224/291 , H01L2224/32225 , H01L2224/73267 , H01L2224/82005 , H01L2224/82031 , H01L2224/82039 , H01L2224/82047 , H01L2224/83424 , H01L2224/83447 , H01L2224/92144 , H01L2225/1035 , H01L2924/10272 , H01L2924/1203 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/351 , H01L2924/014 , H01L2924/00
摘要： A surface mount package includes at least one semiconductor device and a POL packaging and interconnect system formed about the at least one semiconductor device that is configured enable mounting of the surface mount package to an external circuit. The POL system includes a dielectric layer overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias formed through the dielectric layer so as to be electrically coupled to connection pads on the semiconductor device(s). A metallization layer is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate is positioned on a second surface of the semiconductor device(s), with the double-sided ceramic substrate being configured to electrically isolate a drain of the semiconductor device(s) from an external circuit when the surface mount package is joined thereto and to conduct heat away from the semiconductor device(s).
摘要翻译：表面安装封装包括至少一个半导体器件和围绕所述至少一个半导体器件形成的POL封装和互连系统，该半导体器件被配置为能够将表面贴装封装安装到外部电路。 POL系统包括覆盖半导体器件的第一表面的电介质层和延伸穿过通过介电层形成的通孔的金属互连结构，以便电耦合到半导体器件上的连接焊盘。在包括平面结构的金属互连结构上形成金属化层，并且双面陶瓷衬底位于半导体器件的第二表面上，双面陶瓷衬底被配置为电隔离当表面安装封装与其连接时，半导体器件从外部电路漏极，并将热量从半导体器件导出。

4. 发明授权

US12092082B1 System and method for use of an automatically tunable spring mass damper to reduce vibrations in wind turbine blades 有权
公开(公告)号：US12092082B1
公开(公告)日：2024-09-17
申请号：US18352013
申请日：2023-07-13
申请人： General Electric Company
发明人： Logan Sproull Snow , Charles Erklin Seeley , Eladio Clemente Delgado
IPC分类号： F03D80/50 , F03D7/02 , F03D17/00
CPC分类号： F03D7/0298 , F03D17/015 , F05B2260/964
摘要： A system and method are provided for reducing vibrations and loads in one or more rotor blades on a rotor hub of a wind turbine when the rotor hub is in a locked or idling condition. An electronically tunable spring mass damper is attached to a fixed location on one or more of the rotor blades. The spring mass damper is maintained on the rotor blades during the locked or idling condition of the rotor hub. The method includes sensing movement of the mass component resulting from the vibrations induced in the blade. Based on the sensed movement of the mass component, the spring mass damper is automatically tuned to the amplitude of the vibrations by operating the electric machine as a generator in a virtual damper mode and/or tuned to the frequency of the vibrations by operating the electrical machine as a motor-generator in a virtual spring mode.

5. 发明授权

US11572868B1 System and method for use of a tunable mass damper to reduce vibrations in wind turbine blades in a locked or idling condition of the rotor hub 有权
公开(公告)号：US11572868B1
公开(公告)日：2023-02-07
申请号：US17685481
申请日：2022-03-03
申请人： General Electric Company
发明人： Charles Erklin Seeley , Eladio Clemente Delgado , Darren John Danielsen
IPC分类号： F03D80/50 , F03D1/06 , F03D7/02
摘要： A system and method are provided for reducing vibrations and loads in one or more rotor blades on a rotor hub of a wind turbine when the rotor hub is in a locked or idling condition. An electronically tunable mass damper is attached to a fixed location on one or more of the rotor blades. The mass damper is maintained on the rotor blades during the locked or idling condition of the rotor hub. The method includes sensing movement of a mass component of the mass damper from vibrations or oscillations induced in the rotor blade. The mass damper is automatically tuned based on the sensed movements of the mass component by automatically varying an electrical characteristic of the mass damper.

6. 发明申请

US20180373020A1 CASCADED ELECTRICAL DEVICE BUS STRUCTURE SYSTEMS AND METHODS 审中-公开
公开(公告)号：US20180373020A1
公开(公告)日：2018-12-27
申请号：US15632002
申请日：2017-06-23
申请人： General Electric Company
发明人： Ruxi Wang , Douglas Link , Melissa Freeman , Fengfeng Tao , Juan Antonio Sabate , Eladio Clemente Delgado
IPC分类号： G02B26/00 , H02G5/00 , G01R33/04 , G01R35/04 , G01R22/00
摘要： The present disclosure presents techniques to facilitate improving operation of an electrical system, which includes a bus structure that cascades multiple electrical devices. The bus structure includes a first outer conductive layer implemented as a positive layer; a second outer conductive layer implemented as a negative layer; a first intermediate conductive layer neighboring the first outer conductive layer; a second intermediate conductive layer neighboring the second outer conductive layer; and a third intermediate conductive layer neighboring the second intermediate conductive layer, in which the third intermediate conductive layer is implemented as an inter-device layer that facilitates electrically coupling at least two of the electrical devices in series. The first intermediate conductive layer is implemented as a negative layer and the second intermediate conductive layer is implemented as a positive layer to facilitate reducing stray inductance and/or increasing stray capacitance introduced in the electrical system during operation.

7. 发明公开

US20230279917A1 AUTOMATICALLY TUNABLE MASS DAMPER 审中-公开
公开(公告)号：US20230279917A1
公开(公告)日：2023-09-07
申请号：US17685495
申请日：2022-03-03
申请人： General Electric Company
发明人： Charles Erklin Seeley , Eladio Clemente Delgado
IPC分类号： F16F7/10 , F16F7/104 , H02K7/02 , H02K7/116
CPC分类号： F16F7/1005 , F16F7/104 , H02K7/02 , H02K7/116 , F16F2222/08 , F16F2232/08 , F03D7/0296
摘要： A system and method include with a mass damper for reducing vibrations in a structure or machine. The mass damper includes a frame that is movable linearly along a base, which includes a track gear. A flywheel is in geared engagement with the track gear so as to be rotationally driven as the frame moves linearly relative to the base. A rotation damper is mounted on the frame and is geared engagement with the flywheel, the rotation damper producing a counter-torque against rotation of the flywheel that is proportional to a rotational velocity of the flywheel. The rotation damper has an electrical characteristic that is automatically adjusted to change the counter-torque and tune the mass damper.

8. 发明授权

US10185141B2 Cascaded electrical device bus structure systems and methods 有权
公开(公告)号：US10185141B2
公开(公告)日：2019-01-22
申请号：US15632002
申请日：2017-06-23
申请人： General Electric Company
发明人： Ruxi Wang , Douglas Link , Melissa Freeman , Fengfeng Tao , Juan Antonio Sabate , Eladio Clemente Delgado
IPC分类号： G02B26/00 , H02G5/00 , G01R33/04 , G01R35/04 , G01R22/00
摘要： The present disclosure presents techniques to facilitate improving operation of an electrical system, which includes a bus structure that cascades multiple electrical devices. The bus structure includes a first outer conductive layer implemented as a positive layer; a second outer conductive layer implemented as a negative layer; a first intermediate conductive layer neighboring the first outer conductive layer; a second intermediate conductive layer neighboring the second outer conductive layer; and a third intermediate conductive layer neighboring the second intermediate conductive layer, in which the third intermediate conductive layer is implemented as an inter-device layer that facilitates electrically coupling at least two of the electrical devices in series. The first intermediate conductive layer is implemented as a negative layer and the second intermediate conductive layer is implemented as a positive layer to facilitate reducing stray inductance and/or increasing stray capacitance introduced in the electrical system during operation.

9. 发明授权

US09337163B2 Low profile surface mount package with isolated tab 有权
标题翻译：薄型表面贴装封装，带隔离片
公开(公告)号：US09337163B2
公开(公告)日：2016-05-10
申请号：US13675084
申请日：2012-11-13
申请人： General Electric Company
发明人： Eladio Clemente Delgado , John Stanley Glaser , Brian Lynn Rowden
IPC分类号： H05K7/20 , H01L23/00 , H01L23/373 , H01L23/498 , H01L23/538
CPC分类号： H01L24/19 , H01L23/3735 , H01L23/49805 , H01L23/49844 , H01L23/49894 , H01L23/5385 , H01L23/5389 , H01L24/06 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/06181 , H01L2224/12105 , H01L2224/24137 , H01L2224/291 , H01L2224/32225 , H01L2224/73267 , H01L2224/82005 , H01L2224/82031 , H01L2224/82039 , H01L2224/82047 , H01L2224/83424 , H01L2224/83447 , H01L2224/92144 , H01L2225/1035 , H01L2924/10272 , H01L2924/1203 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/351 , H01L2924/014 , H01L2924/00
摘要： A surface mount package includes at least one semiconductor device and a POL packaging and interconnect system formed about the at least one semiconductor device that is configured enable mounting of the surface mount package to an external circuit. The POL system includes a dielectric layer overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias formed through the dielectric layer so as to be electrically coupled to connection pads on the semiconductor device(s). A metallization layer is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate is positioned on a second surface of the semiconductor device(s), with the double-sided ceramic substrate being configured to electrically isolate a drain of the semiconductor device(s) from an external circuit when the surface mount package is joined thereto and to conduct heat away from the semiconductor device(s).
摘要翻译：表面安装封装包括至少一个半导体器件和围绕所述至少一个半导体器件形成的POL封装和互连系统，该半导体器件被配置为能够将表面贴装封装安装到外部电路。 POL系统包括覆盖半导体器件的第一表面的电介质层和延伸穿过通过介电层形成的通孔的金属互连结构，以便电耦合到半导体器件上的连接焊盘。在包括平面结构的金属互连结构上形成金属化层，并且双面陶瓷衬底位于半导体器件的第二表面上，双面陶瓷衬底被配置为电隔离当表面安装封装与其连接时，半导体器件从外部电路漏极，并将热量从半导体器件导出。

10. 发明授权

US09142484B2 Power module package 有权
标题翻译：电源模块封装
公开(公告)号：US09142484B2
公开(公告)日：2015-09-22
申请号：US14509666
申请日：2014-10-08
申请人： GENERAL ELECTRIC COMPANY
发明人： Eladio Clemente Delgado , John Stanley Glaser , Brian Lynn Rowden
IPC分类号： H01L23/427 , H01L23/373 , H01L23/473 , H01L23/46 , H01L25/00 , H01L23/00
CPC分类号： H01L23/473 , H01L23/13 , H01L23/3735 , H01L23/46 , H01L24/19 , H01L24/24 , H01L24/83 , H01L25/50 , H01L2224/04105 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/83815 , H01L2224/92144 , H01L2224/9222 , H01L2924/01029 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/19043 , H01L2924/19105 , H01L2924/20105 , H01L2924/20106 , H01L2924/00
摘要： An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.
摘要翻译：集成功率模块包括具有至少一个切出区域的基本上平面的绝缘金属基板; 设置在所述切出区域内的至少一个基本上平面的陶瓷基板，其中所述陶瓷基板通过所述绝缘金属基板在至少两侧框架，所述陶瓷基板包括在第一侧上的第一金属层和在第一侧上的第二金属层第二面耦合到陶瓷衬底的第一侧的至少一个功率半导体器件; 耦合到所述绝缘金属基板的第一表面的至少一个控制装置; 功率覆盖层，电连接所述至少一个半导体功率器件和所述至少一个控制器件; 以及可操作地连接到所述至少一个陶瓷基板的第二金属层的冷却流体储存器，其中在所述冷却流体储存器中设置多个冷却流体通道。

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