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    • 1. 发明申请
    • Real-time adjustable mechanism of shielding plate in sputtering vacuum chamber design
    • 溅射真空室设计中屏蔽板的实时可调机构
    • US20060278523A1
    • 2006-12-14
    • US11147338
    • 2005-06-08
    • Geeng SheuChung LiuJer ChangYu LiuTuan YuTai Huang
    • Geeng SheuChung LiuJer ChangYu LiuTuan YuTai Huang
    • C23C14/00
    • C23C14/564
    • A sputtering system includes a chamber with two frames therein. Several shafts are pivoted on the frames for rotation and transport. A shielding plate is placed above the shafts, and several adjustable mechanisms are between the frames and the shielding plate. Each of the adjustable mechanisms has an operation member on an exterior side of the chamber and an inner member in the chamber, which is connected to the operation member and the shielding plate. The inner member has a first section with a threaded hole and a second section with a threaded post screwed into the threaded hole of the first section. As a result, when the operation member is turned, the relative length and position of the inner member is changed to elevate or lower the shielding plate, and hence the gap between the carrier and the shielding plate can be adjusted to the desired allowable value.
    • 溅射系统包括其中具有两个框架的室。 几个轴在框架上枢转以旋转和运输。 屏蔽板放置在轴的上方,并且几个可调节的机构在框架和屏蔽板之间。 每个可调节机构在腔室的外侧具有操作构件,并且在腔室中具有连接到操作构件和屏蔽板的内部构件。 内部构件具有带有螺纹孔的第一部分和具有螺纹连接到第一部分的螺纹孔中的螺纹柱的第二部分。 结果,当操作构件转动时,内部构件的相对长度和位置被改变以升高或降低屏蔽板,因此载体和屏蔽板之间的间隙可以被调节到期望的允许值。