会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明授权
    • Etchant and method for fabricating a substrate for an electronic device using the same wherein the substrate includes a copper or copper alloy film
    • 用于制造使用其的电子器件的衬底的蚀刻剂和方法,其中所述衬底包括铜或铜合金膜
    • US06727188B2
    • 2004-04-27
    • US09983733
    • 2001-10-25
    • Gyoo Chul JoGee Sung Chae
    • Gyoo Chul JoGee Sung Chae
    • H01L21461
    • H01L21/32134C23F1/18H01L27/124
    • An etchant and a method for fabricating a substrate for an electronic device using the etchant where the etchant contains a predetermined additive to control the etch rate of a Cu deposition layer (containing Cu, Cu/Ti, or Cu/Ta) over passage of time. Some examples of the additive may include a chelate having the —COOH group, a chemical compound containing a Cu ion, and a deoxidizer containing sulfur (S). The method includes forming a metal thin film containing copper (Cu) on a substrate, selectively exposing the metal thin film, and etching at least one of the exposed and the unexposed portions on the metal thin film with the additive-containing etchant to control the Cu etch rate over time against the number of sheets of processed substrates. The use of the additive-containing etchant results in improved yield and reduction in production costs because of less frequent etchant replacements.
    • 蚀刻剂和使用蚀刻剂制造用于电子器件的衬底的方法,其中蚀刻剂含有预定添加剂以控制Cu沉积层(含有Cu,Cu / Ti或Cu / Ta)的蚀刻速率随时间流逝 。 添加剂的一些实例可以包括具有-COOH基团的螯合物,含有Cu离子的化合物和含硫(S)的脱氧剂。 该方法包括在基板上形成含有铜(Cu)的金属薄膜,选择性地暴露金属薄膜,并用含添加剂的蚀刻剂蚀刻金属薄膜上的暴露部分和未曝光部分中的至少一个,以控制 随着时间的推移,Cu蚀刻速率相对于经处理的基板的数量。 使用含添加剂的蚀刻剂导致生产成本的提高和生产成本的降低,因为蚀刻剂更换次数较少。
    • 9. 发明授权
    • Soft mold and method for fabricating the same
    • 软模具及其制造方法
    • US08268214B2
    • 2012-09-18
    • US11314637
    • 2005-12-20
    • Gee Sung ChaeGyoo Chul JoJin Wuk KimChang Hee Lee
    • Gee Sung ChaeGyoo Chul JoJin Wuk KimChang Hee Lee
    • B29C33/40
    • B29C33/38B29C33/3857B29C33/40
    • A soft mold and a method for fabricating the same are disclosed. A master mold that has a pattern on a substrate is first formed. A first liquid high polymer precursor is formed on the master mold and then partially cured. A support film having high UV transmittance is attached to the partially cured high polymer. The attached support film and the partially cured high polymer are treated with a coupling agent and a second liquid high polymer precursor is formed on the partially cured high polymer and the support film. The second liquid high polymer precursor and the partially cured high polymer are then fully cured to form a mold. The fully cured mold is stripped from the master mold to form a soft mold having a predetermined shape on one surface.
    • 公开了一种软模具及其制造方法。 首先形成在基板上具有图案的母模。 在母模上形成第一液体高分子前体,然后部分固化。 具有高紫外线透过率的支撑膜附着在部分固化的高分子聚合物上。 附着的支撑膜和部分固化的高分子用偶联剂处理,第二液体高分子前体形成在部分固化的高分子聚合物和载体膜上。 然后将第二液体高分子前体和部分固化的高聚物完全固化以形成模具。 将完全固化的模具从主模具剥离以在一个表面上形成具有预定形状的软模具。