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1. 发明申请

US20130202136A1 CHIP WITH INTEGRATED CIRCUIT AND MICRO-SILICON CONDENSER MICROPHONE INTEGRATED ON SINGLE SUBSTRATE AND METHOD FOR MAKING THE SAME 有权
标题翻译：具有集成电路的芯片和集成在单个基板上的微硅凝胶麦克风及其制造方法
公开(公告)号：US20130202136A1
公开(公告)日：2013-08-08
申请号：US13561194
申请日：2012-07-30
申请人： Wei Hu , Gang Li , Jia-Xin Mei
发明人： Wei Hu , Gang Li , Jia-Xin Mei
IPC分类号： H04R1/00 , H01L21/02
CPC分类号： B81C1/00158 , B81C1/00246 , H04R19/005 , H04R31/00
摘要： A method for integrating an IC and a MEMS component includes the following steps: S1) providing a SOI base (20) having a first area (21) and a second area (22); S2) fabricating an IC on the first area through a standard semiconductor process, and simultaneously forming a metal conductive layer (26) and a medium insulation layer (25c) extending to the second area; S3) partly removing the medium insulation layer and then further partly removing the silicon component layer so as to form a backplate diagram; S4) depositing a sacrificial layer (32) above the SOI base; S5) forming a Poly Sil-xGex film (33) on the sacrificial layer; S6) forming a back cavity (34); and S7) eroding the sacrificial layer to form a chamber (36) in communication with the back cavity. Besides, a chip (10) fabricated by the above method is also disclosed.
摘要翻译：一种用于集成IC和MEMS部件的方法包括以下步骤：S1）提供具有第一区域（21）和第二区域（22）的SOI基底（20）; S2）通过标准半导体工艺在第一区域上制造IC，同时形成延伸到第二区域的金属导电层（26）和介质绝缘层（25c）; S3）部分地去除介质绝缘层，然后进一步部分去除硅组分层以形成背板图; S4）在SOI基底上方沉积牺牲层（32）; S5）在牺牲层上形成Poly Sil-xGex膜（33）; S6）形成后腔（34）; 和S7）侵蚀牺牲层以形成与后腔连通的腔室（36）。此外，还公开了通过上述方法制造的芯片（10）。

2. 发明授权

US08482357B2 Transverse acoustic wave resonator, oscillator having the resonator and method for making the resonator 有权
标题翻译：横波声波谐振器，具有谐振器的振荡器和用于制造谐振器的方法
公开(公告)号：US08482357B2
公开(公告)日：2013-07-09
申请号：US13310687
申请日：2011-12-02
申请人： Bin Xiao , Ping Lv , Wei Hu , Jia-Xin Mei , Gang Li
发明人： Bin Xiao , Ping Lv , Wei Hu , Jia-Xin Mei , Gang Li
IPC分类号： H03B5/18
CPC分类号： H03H9/2436 , H03H3/0072 , Y10T29/49016
摘要： A transverse acoustic wave resonator includes a base, a resonator component, a number of driving electrodes fixed to the base and a number of fixing portions connecting the base and the resonator component. The resonator component is suspended above a top surface of the base and is perpendicular to the base. The driving electrodes are coupling to side surfaces of the resonator component. The resonator component is formed in a shape of an essential regular polygon. The driving electrodes and the resonator component jointly form an electromechanical coupling system for converting capacitance into electrostatic force. Besides, a capacitive-type transverse extension acoustic wave silicon oscillator includes the transverse acoustic wave resonator and a method of fabricating the transverse acoustic wave resonator are also disclosed.
摘要翻译：横波声谐振器包括基座，谐振器部件，固定到基座的多个驱动电极以及连接基座和谐振器部件的多个固定部分。谐振器部件悬挂在基座的顶表面上方并且垂直于基座。驱动电极耦合到谐振器部件的侧表面。谐振器部件形成为基本正多边形的形状。驱动电极和谐振器部件共同形成用于将电容转换成静电力的机电耦合系统。此外，还公开了包括横向声波谐振器的电容式横向延伸声波硅振荡器和制造横向声波谐振器的方法。

3. 发明申请

US20130093527A1 TRANSVERSE ACOUSTIC WAVE RESONATOR, OSCILLATOR HAVING THE RESONATOR AND METHOD FOR MAKING THE RESONATOR 有权
标题翻译：横波声波共振器，具有谐振器的振荡器和制造谐振器的方法
公开(公告)号：US20130093527A1
公开(公告)日：2013-04-18
申请号：US13310687
申请日：2011-12-02
申请人： BIN XIAO , Ping Lv , Wei Hu , Jia-Xin Mei , Gang Li
发明人： BIN XIAO , Ping Lv , Wei Hu , Jia-Xin Mei , Gang Li
IPC分类号： H03B5/30 , H01P11/00 , H01P7/06
CPC分类号： H03H9/2436 , H03H3/0072 , Y10T29/49016
摘要： A transverse acoustic wave resonator includes a base, a resonator component, a number of driving electrodes fixed to the base and a number of fixing portions connecting the base and the resonator component. The resonator component is suspended above a top surface of the base and is perpendicular to the base. The driving electrodes are coupling to side surfaces of the resonator component. The resonator component is formed in a shape of an essential regular polygon. The driving electrodes and the resonator component jointly form an electromechanical coupling system for converting capacitance into electrostatic force. Besides, a capacitive-type transverse extension acoustic wave silicon oscillator includes the transverse acoustic wave resonator and a method of fabricating the transverse acoustic wave resonator are also disclosed.
摘要翻译：横波声谐振器包括基座，谐振器部件，固定到基座的多个驱动电极以及连接基座和谐振器部件的多个固定部分。谐振器部件悬挂在基座的顶表面上方并且垂直于基座。驱动电极耦合到谐振器部件的侧表面。谐振器部件形成为基本正多边形的形状。驱动电极和谐振器部件共同形成用于将电容转换成静电力的机电耦合系统。此外，还公开了包括横向声波谐振器的电容式横向延伸声波硅振荡器和制造横向声波谐振器的方法。

4. 发明申请

US20100258950A1 PACKAGE WITH SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH PACKAGE 审中-公开
标题翻译：具有半导体器件和集成电路的封装及其制造方法
公开(公告)号：US20100258950A1
公开(公告)日：2010-10-14
申请号：US12544415
申请日：2009-08-20
申请人： GANG LI , Wei Hu , Jia-Xin Mei
发明人： GANG LI , Wei Hu , Jia-Xin Mei
IPC分类号： H01L23/52 , H01L21/50
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/019 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/14 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/13099 , H01L2224/16 , H01L2224/29101 , H01L2224/29111 , H01L2224/812 , H01L2224/81801 , H01L2224/838 , H01L2224/83801 , H01L2225/06513 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/01028 , H01L2224/29099
摘要： A multichip package includes a first chip and a second chip coupled with the first chip. The first chip includes a first base with a semiconductor device mounted on one side of the first base, a first electrical connection unit, a first bonding ring surrounding the semiconductor device, a first insulating layer formed on the other side of the first base and a first external bonding portion formed on the first insulating layer. The first external bonding portion is electrically connected to the first electrical connection unit. The second chip includes an integrated circuit corresponding to the semiconductor device, a second electrical connection unit fusing with the first electrical connection unit, and a second bonding ring fusing with the first bonding ring in order to form a hermetic cavity surrounding the semiconductor device, the integrated circuit, the first electrical connection unit and the second electrical connection unit.
摘要翻译：多芯片封装包括第一芯片和与第一芯片耦合的第二芯片。第一芯片包括：第一基座，其具有安装在第一基座的一侧上的半导体器件;第一电连接单元;围绕半导体器件的第一接合环;形成在第一基座的另一侧上的第一绝缘层;以及第一外部接合部分形成在第一绝缘层上。第一外部接合部分电连接到第一电连接单元。第二芯片包括对应于半导体器件的集成电路，与第一电连接单元融合的第二电连接单元和与第一结合环熔合以形成围绕半导体器件的密封腔的第二接合环，集成电路，第一电连接单元和第二电连接单元。

5. 发明授权

US09221675B2 Chip with integrated circuit and micro-silicon condenser microphone integrated on single substrate and method for making the same 有权
标题翻译：芯片集成电路和微硅电容麦克风集成在单个基板上，并制作相同的方法
公开(公告)号：US09221675B2
公开(公告)日：2015-12-29
申请号：US13561194
申请日：2012-07-30
申请人： Wei Hu , Gang Li , Jia-Xin Mei
发明人： Wei Hu , Gang Li , Jia-Xin Mei
IPC分类号： B81C1/00 , H04R31/00 , H04R19/00
CPC分类号： B81C1/00158 , B81C1/00246 , H04R19/005 , H04R31/00
摘要： A method for integrating an IC and a MEMS component includes the following steps: S1) providing a SOI base (20) having a first area (21) and a second area (22); S2) fabricating an IC on the first area through a standard semiconductor process, and simultaneously forming a metal conductive layer (26) and a medium insulation layer (25c) extending to the second area; S3) partly removing the medium insulation layer and then further partly removing the silicon component layer so as to form a backplate diagram; S4) depositing a sacrificial layer (32) above the SOI base; S5) forming a Poly Sil-xGex film (33) on the sacrificial layer; S6) forming a back cavity (34); and S7) eroding the sacrificial layer to form a chamber (36) in communication with the back cavity. Besides, a chip (10) fabricated by the above method is also disclosed.
摘要翻译：一种用于集成IC和MEMS部件的方法包括以下步骤：S1）提供具有第一区域（21）和第二区域（22）的SOI基底（20）; S2）通过标准半导体工艺在第一区域上制造IC，同时形成延伸到第二区域的金属导电层（26）和介质绝缘层（25c）; S3）部分地去除介质绝缘层，然后进一步部分去除硅组分层以形成背板图; S4）在SOI基底上方沉积牺牲层（32）; S5）在牺牲层上形成Poly Sil-xGex膜（33）; S6）形成后腔（34）; 和S7）侵蚀牺牲层以形成与后腔连通的腔室（36）。此外，还公开了通过上述方法制造的芯片（10）。

6. 发明申请

US20120042735A1 Feedback System for Identifying Movement and Intensity of External Force 有权
标题翻译：识别外力的运动和强度的反馈系统
公开(公告)号：US20120042735A1
公开(公告)日：2012-02-23
申请号：US12910797
申请日：2010-10-23
申请人： Jia-Xin Mei , Gang Li , Hong-Yuan Yang
发明人： Jia-Xin Mei , Gang Li , Hong-Yuan Yang
IPC分类号： G01L1/04
CPC分类号： G06F3/0414 , G06F3/0338 , G06F3/041 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A feedback system for identifying an external force, includes an operation plate and a pressure-sensing unit. The pressure-sensing unit includes an elastic member supporting the operation plate and a pressure sensor inside the elastic member. The pressure sensor includes a pressure sensitive film. An inner side of the elastic member is filled with fluid material which acts on the pressure sensitive film. The operation plate is driven by the external force to be slant which extrudes the elastic member to deform so as to change fluid pressure of the fluid material limited in the elastic member, and such change of the fluid pressure can be sensed by the pressure sensitive film of the pressure sensor so as to identify the movement and the intensity of the external force.
摘要翻译：用于识别外力的反馈系统包括操作板和压力感测单元。压力感测单元包括支撑操作板的弹性构件和弹性构件内的压力传感器。压力传感器包括压敏膜。弹性构件的内侧填充作用在压敏膜上的流体材料。操作板被外力驱动以倾斜，挤压弹性构件变形，以便改变弹性构件限制的流体材料的流体压力，并且可以通过压敏膜感测到流体压力的这种变化以识别外力的运动和强度。

7. 发明授权

US08621941B2 Feedback system for identifying movement and intensity of external force 有权
标题翻译：用于识别外力的运动和强度的反馈系统
公开(公告)号：US08621941B2
公开(公告)日：2014-01-07
申请号：US12910797
申请日：2010-10-23
申请人： Jia-Xin Mei , Gang Li , Hong-Yuan Yang
发明人： Jia-Xin Mei , Gang Li , Hong-Yuan Yang
IPC分类号： G01L1/02 , G01L1/22 , G01L1/04
CPC分类号： G06F3/0414 , G06F3/0338 , G06F3/041 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A feedback system for identifying an external force, includes an operation plate and a pressure-sensing unit. The pressure-sensing unit includes an elastic member supporting the operation plate and a pressure sensor inside the elastic member. The pressure sensor includes a pressure sensitive film. An inner side of the elastic member is filled with fluid material which acts on the pressure sensitive film. The operation plate is driven by the external force to be slant which extrudes the elastic member to deform so as to change fluid pressure of the fluid material limited in the elastic member, and such change of the fluid pressure can be sensed by the pressure sensitive film of the pressure sensor so as to identify the movement and the intensity of the external force.
摘要翻译：用于识别外力的反馈系统包括操作板和压力感测单元。压力感测单元包括支撑操作板的弹性构件和弹性构件内的压力传感器。压力传感器包括压敏膜。弹性构件的内侧填充作用在压敏膜上的流体材料。操作板由外力驱动而倾斜，挤压弹性构件变形，以改变在弹性构件中限制的流体材料的流体压力，并且可以通过压敏膜感测到流体压力的这种变化以识别外力的运动和强度。

8. 发明申请

US20090257614A1 PACKAGE FOR MICRO-ELECTRO-MECHANICAL ACOUSTIC TRANSDUCER WITH IMPROVED DOUBLE SIDE MOUNTABLE ELECTRODES 有权
标题翻译：具有改进的双面安装电极的微机电声传感器的包装
公开(公告)号：US20090257614A1
公开(公告)日：2009-10-15
申请号：US12416186
申请日：2009-04-01
申请人： Jia-Xin Mei , Gang Li
发明人： Jia-Xin Mei , Gang Li
IPC分类号： H04R11/04
CPC分类号： H04R19/04 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A surface mountable package includes a base and a cover with a cavity defined thereby, and an acoustic transducer unit received in the cavity. The cover includes a first metal ring to enclose the acoustic transducer unit. The base includes a second metal ring to press against the first metal ring in order to form a metal shielding area. First and second metal connecting paths are formed electrically connected to the metal shielding area and the acoustic transducer unit, respectively. Besides, two pairs of first and second surface mountable metal electrodes are electrically connected to the first and the second metal connecting paths, respectively. As a result, the package can be selectively double surface mountable to a user's circuit board via the metal electrodes of the base or the metal electrodes of the cover.
摘要翻译：表面可安装的包装包括底座和由其限定的空腔的盖，以及容纳在空腔中的声学换能器单元。盖包括用于封闭声换能器单元的第一金属环。底座包括第二金属环，以压靠第一金属环以形成金属屏蔽区域。第一和第二金属连接路径分别形成为电连接到金属屏蔽区域和声学换能器单元。此外，两对第一和第二可表面安装的金属电极分别电连接到第一和第二金属连接路径。结果，封装可以通过基座的金属电极或盖的金属电极选择性地双面表面安装到用户的电路板。

9. 发明授权

US08472647B2 Package for micro-electro-mechanical acoustic transducer with improved double side mountable electrodes 有权
标题翻译：用于具有改进的双面安装电极的微机电声换能器的封装
公开(公告)号：US08472647B2
公开(公告)日：2013-06-25
申请号：US12416186
申请日：2009-04-01
申请人： Jia-Xin Mei , Gang Li
发明人： Jia-Xin Mei , Gang Li
IPC分类号： H04R25/00 , H01L29/84
CPC分类号： H04R19/04 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A surface mountable package includes a base and a cover with a cavity defined thereby, and an acoustic transducer unit received in the cavity. The cover includes a first metal ring to enclose the acoustic transducer unit. The base includes a second metal ring to press against the first metal ring in order to form a metal shielding area. First and second metal connecting paths are formed electrically connected to the metal shielding area and the acoustic transducer unit, respectively. Besides, two pairs of first and second surface mountable metal electrodes are electrically connected to the first and the second metal connecting paths, respectively. As a result, the package can be selectively double surface mountable to a user's circuit board via the metal electrodes of the base or the metal electrodes of the cover.
摘要翻译：表面可安装的包装包括底座和由其限定的空腔的盖，以及容纳在空腔中的声学换能器单元。盖包括用于封闭声换能器单元的第一金属环。底座包括第二金属环，以压靠第一金属环以形成金属屏蔽区域。第一和第二金属连接路径分别形成为电连接到金属屏蔽区域和声学换能器单元。此外，两对第一和第二可表面安装的金属电极分别电连接到第一和第二金属连接路径。结果，封装可以通过基座的金属电极或盖的金属电极选择性地双面表面安装到用户的电路板。

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