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    • 3. 发明申请
    • LASER PROCESSING METHOD FOR TRANSPARENT MATERIAL
    • 透明材料的激光加工方法
    • US20110240618A1
    • 2011-10-06
    • US13041124
    • 2011-03-04
    • Takahiro Kanda
    • Takahiro Kanda
    • B23K26/38
    • B41M5/24B23K26/361B23K26/40B23K2103/50
    • Laser processing methods are provided that are capable of processing a surface to be processed of a transparent material with a high accuracy even if the transparent material has a rear surface with a large roughness or has defects therein. The laser processing methods for processing a transparent material using a laser light, can include: attaching a laser light absorbing substance having an absorption coefficient for the laser light of 1 μm−1 or more to a surface to be processed of the transparent material, the laser light having an oscillation wavelength in a range of 193 to 11000 nm, and the transparent material having an absorption coefficient for the laser light of 1 cm−1 or lower; and, emitting the laser light from a front surface side of the laser light absorbing substance attached to the transparent material to process the surface to be processed of the transparent material.
    • 提供了即使透明材料具有大的粗糙度的背面或具有缺陷,也能够高精度地加工透明材料的表面的激光加工方法。 使用激光处理透明材料的激光加工方法可以包括:将具有1μm-1以上的激光的吸收系数的激光吸收物质附着到透明材料的被处理面上, 振荡波长为193〜11000nm的激光,激光的吸收系数为1cm -1以下的透明材料, 并且从附着在透明材料上的激光吸收物质的表面侧发射激光,以处理透明材料的待处理表面。