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    • 2. 发明授权
    • Concentrated radiant energy heat source unit
    • 集中辐射能热源单元
    • US4812620A
    • 1989-03-14
    • US860789
    • 1986-05-08
    • Futomi HayakawaKazuo Onoda
    • Futomi HayakawaKazuo Onoda
    • B23K1/00B23K1/005H05B3/00H05K3/34H05K13/04B23K1/04H01J35/00
    • B23K1/005H05K13/0465
    • A heat source unit for concentrating radiant rays from a heat source lamp onto the processing site of the material to be processed by, for example, soldering, so as to bring this site to a requisite high temperature, comprises a mirror assembly composed of a pair of symmetrical half bodies, which have each an arcuate reflecting surface and together form a concave mirror. A pair of reflective side plates are mounted detachably on the opposite sides of the mirror assembly. The mirror assembly has cooling channels permitting circulation of cooling water therethrough. A heat resistant and light-transmissive shield plate is disposed over an irradiation opening of the unit and is supported by and between a pair of adjustable masking elements at opposite ends of the mirror assembly thereby defining a heat outlet opening of adjustable width. Housing shells are fixed detachably on each of the side plates. Pipe connections are provided for connecting the cooling channels and for feeding and discharging cooling water. A heat source lamp is supported in front of the mirror and behind the shield plate and between the side plates and is connected electrically to an electric power source.
    • 一种热源单元,其将来自热源灯的辐射线通过例如焊接将待处理材料的加工位置集中到使得该部位达到必要的高温的位置,包括由一对组成的反射镜组件 对称半体,其具有弧形反射表面并且一起形成凹面镜。 一对反射侧板可拆卸地安装在反射镜组件的相对侧上。 反射镜组件具有允许冷却水循环通过的冷却通道。 耐热和透光的屏蔽板设置在该单元的照射开口上方,并且由反射镜组件的相对端处的一对可调节的掩模元件之间由一个或多个可调节的掩模元件支撑,从而限定可调宽度的热出口。 壳体可拆卸地固定在每个侧板上。 提供管道连接用于连接冷却通道和用于供给和排放冷却水。 一个热源灯被支撑在镜子的前面,在屏蔽板的后面和两个侧板之间,并被电连接到一个电源上。
    • 3. 发明授权
    • Soldering apparatus
    • 焊接设备
    • US4650950A
    • 1987-03-17
    • US809405
    • 1985-12-16
    • Futomi HayakawaKazuo Onoda
    • Futomi HayakawaKazuo Onoda
    • B23K1/00B23K1/005H05B3/00H05K3/34H05K13/04B23K1/12
    • B23K1/005H05K13/0465
    • Soldering apparatus for effecting, for example, a firm connection of the lead pins on IC-packages to a printed circuit board bearing corresponding lead lines. The workpiece such as an IC-package is placed at a predetermined position on the printed circuit board such that the lead pins on the IC-package and the corresponding lead lines on the circuit board, on which the solder has been applied, are in contact with each other. These sites of contact are subjected to radiant heating to cause soldering of them, by the use of apparatus which comprises a mounting base provided with a pair of diagonally disposed arms together with, if necessary, another pair of arms disposed also diagonally but rectangularly to the first pair of arms. Heat sources such as lamp units produce the radiant heat rays and focus them onto the sites of contact of the lead pins with the lead lines to be soldered. Each of the lamp units is hingedly connected to the distal end of each of the arms so as to permit individual adjustment of the angle of inclination of the lamp unit around an axis of angular adjustment. A support shaft adjustable as to its vertical position relative to the work table passes slidably through the mounting base and supports a press plate for bearing the IC-package at its lower end.
    • 用于实现例如将IC封装上的引线针牢固连接到承载相应导线的印刷电路板的焊接装置。 诸如IC封装的工件被放置在印刷电路板上的预定位置,使得IC封装上的引脚和已经施加焊料的电路板上的相应引线接触 与彼此。 通过使用包括设置有一对对角布置的臂的安装基座以及如果需要的话,另外一对布置在另一个对角线但矩形的臂上,这些接触部位经受辐射加热以引起它们的焊接。 第一对双臂。 诸如灯单元的热源产生辐射热射线并将它们聚焦到引脚与待焊接引线的接触部位。 每个灯单元铰链地连接到每个臂的远端,以允许单独调节灯单元围绕角度调整的轴线的倾斜角度。 可相对于工作台垂直位置调节的支撑轴可滑动地穿过安装基座,并支撑用于在其下端轴承IC封装的压板。
    • 4. 发明授权
    • Linear lamp unit with contacts at both ends
    • 线性灯单元,两端有触点
    • US4928210A
    • 1990-05-22
    • US396629
    • 1989-08-18
    • Futomi HayakawaKazuo Onoda
    • Futomi HayakawaKazuo Onoda
    • H01J5/52H01K1/24H01K1/46
    • H01K1/24H01J5/52H01K1/46
    • An elongated lamp unit in which electrically conductive connecting terminals provided at both ends of the lamp are electrically connected by force fitting into metal contact clamps arranged opposite each other. The electrically conductive connecting terminals extend endwise beyond flat portions formed on each end of an elongated lamp bulb and are electrically connected with a filament disposed in the bulb, and have surface-to-surface contact with the metal contact clamps. The metal contact clamps which receive the electrically conductive connecting terminals are connected with a power supply and comprise a pair of electrically conductive metal pieces opposite each other, these metal pieces having upper ends defining an insertion opening portion which receives the electrically conductive connecting terminal and limits at an inner portion of the electrically conductive contact the inserted position of the electrically conductive connecting terminal.
    • 一种细长的灯单元,其中设置在灯的两端的导电连接端子通过强力配合电连接到彼此相对布置的金属接触夹中。 导电连接端子端部延伸超过形成在细长灯泡的每个端部上的平坦部分,并且与设置在灯泡中的细丝电连接,并且与金属接触夹具具有表面到表面的接触。 接收导电连接端子的金属接触夹具与电源连接,并且包括彼此相对的一对导电金属片,这些金属片具有限定插入开口部分的上端,该插入开口部分接收导电连接端子和限制 在导电接触件的内部部分处是导电连接端子的插入位置。
    • 5. 发明授权
    • Apparatus for automatic soldering
    • 自动焊接设备
    • US4788403A
    • 1988-11-29
    • US4414
    • 1987-01-20
    • Futomi HayakawaKazuo Onoda
    • Futomi HayakawaKazuo Onoda
    • B23K3/00B23K1/005H01R43/02H05K3/34H05K13/04B23K1/12
    • H01R43/02H05K13/0465H05K3/3494H05K2203/163H05K3/3421
    • An apparatus for the automatic soldering of lead pins distributed on a packaged IC chip in bilateral or quadrilateral parallel rows, to corresponding contact pins which are distributed on a substrate printed circuit board in rows corresponding to said rows of lead pins and have preliminarily been pasted with solder. The packaged IC chip is placed on the substrate board, and the packaged IC chip is positioned to align each lead pin in the rows on the packaged IC chip with a corresponding contact pin in the rows on the substrate board. The lead pin together with the contact pin aligned therewith is then exposed to iradiation by a heat ray emitted from a heat ray soldering head and focussed thereon as a line of focus in the form of a segment of a line corresponding to the soldering line. The apparatus comprises a memory-operation section (A), a control section (B) and an actuation section (C), wherein the control section (B) performs upon receipt of commands from the memory-operation section (A) and governs the actuation section (C), so as to move the heat ray soldering head along the x- and/or y-coordinates on the substrate board to each preset position for the packaged IC chip to be soldered and so as to effect the soldering of each spot, where an electric junction is to be built up, by the heat ray focussed as a line of focus, under programmed control.
    • 一种用于将分布在双向或四边形并行的封装IC芯片上的引脚的自动焊接到对应于所述引线引脚行的行的基板印刷电路板上的相应接触引脚的装置,并且预先已被粘贴 焊接。 封装的IC芯片放置在基板上,并且封装的IC芯片被定位成将封装的IC芯片上的行中的每个引脚与在基板上的行中的相应的接触引脚对准。 然后将引线与与其对准的接触销一起暴露于通过从热射线焊接头发射的热射线引起的辐射,并以聚焦线为对应于对应于焊接线的线段的形式聚焦。 该装置包括存储器操作部分(A),控制部分(B)和致动部分(C),其中控制部分(B)在从存储器操作部分(A)接收到命令时执行, 致动部分(C),以将热射线焊头沿着基板的x和/或y坐标移动到待焊接的封装IC芯片的每个预设位置,以便实现每个 通过在编程控制下被聚焦成焦点线的热线,将要建立电连接点。
    • 6. 发明授权
    • Apparatus for continuous processing in the directions of x- and
y-coordinates
    • 用于在x坐标和y坐标方向上连续处理的装置
    • US4720617A
    • 1988-01-19
    • US886787
    • 1986-07-18
    • Futomi HayakawaKazuo Onoda
    • Futomi HayakawaKazuo Onoda
    • H05K3/34B23K1/005B23K3/04B23K101/40H05K13/04B23K1/04
    • H05K13/0465B23K1/005
    • An apparatus for the continuous processing of a work piece, such as an IC-chip or an LSI-chip, in the directions of the x- and y-coordinates, which comprises a pair of heat ray sources arranged on a heat ray source assembly for irradiating a corresponding pair of parallel processing lines extending in the direction of the x-coordinate, by focussing heat rays onto each of the processing lines in the shape of a straight line. A cylinder/piston arrangement effects vertical positioning of the pair of heat ray sources for adjusting the focussing of heat rays onto the processing line. A turning mechanism turns the heat ray source assembly through 90.degree. so as to align the pair of line foci with a pair of parallel processing lines extending in the direction of the y-coordinate. There is a distance adjustment for adjusting the distance between the pair of parallel line foci by effecting a parallel relative shifting of the pair of heat ray sources. A masking element for each heat ray source has a pair of shield members for limiting the width of the heat ray beam discharged from the heat ray source, to determine the length of the line focus for each operation in the x- or y-direction. A masking element actuator is provided for each pair of heat ray sources and comprises a pair of cylinder/piston units for effecting simultaneous relative shifting of the pair of shield members to limit the width of the heat ray beam and thus to define the length of the line focus.
    • 一种用于在x和y坐标的方向上连续处理诸如IC芯片或LSI芯片的工件的装置,其包括布置在热射线源组件上的一对热射线源 用于照射沿x坐标方向延伸的对应的一对平行处理线,通过将热射线聚焦成直线形状的每条处理线。 气缸/活塞装置实现一对热射线源的垂直定位,用于调节热射线聚焦到处理线上。 转动机构使热射线源组件转动90度,以使一对线路焦点与沿y坐标方向延伸的一对平行处理线对准。 通过实现一对热射线源的平行相对移动,存在用于调整一对平行线焦点之间的距离的距离调整。 用于每个热射线源的掩模元件具有一对屏蔽构件,用于限制从热射线源放出的热射线束的宽度,以确定在x或y方向上的每个操作的线对焦的长度。 为每对热射线源提供掩蔽元件致动器,并且包括一对气缸/活塞单元,用于实现一对屏蔽构件的同时相对移动以限制热射线束的宽度,从而限定 线重点。