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    • 9. 发明授权
    • Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor device
    • 电容器片,其制造方法,具有内置电容器的板和半导体器件
    • US06916706B2
    • 2005-07-12
    • US10833817
    • 2004-04-27
    • Fumio EchigoTadashi NakamuraDaizo Andoh
    • Fumio EchigoTadashi NakamuraDaizo Andoh
    • H01L21/02H05K1/14H05K1/16H05K3/40H05K3/42H01L21/8242
    • H05K1/162H01L28/60H05K1/141H05K3/4069H05K3/429H05K2201/09309H05K2201/09581
    • A capacitor sheet includes a laminate sheet, interface-connection feedthrough conductors for electrically connecting faces of the laminate sheet, and capacitor-connection feedthrough conductors. The laminate sheet has at least one laminate which is composed of a power source layer electrode, a grounding layer electrode, and a dielectric layer interposed between the power source layer electrode and the grounding layer electrode. The interface-connection feedthrough conductors are formed in through holes that pass through the dielectric layer, the power source layer electrode, and the grounding layer electrode, and are insulated by insulation walls from the power source layer electrode and the grounding layer electrode provided inside. The capacitor-connection feedthrough conductors are formed in regions where only either the power source layer electrode or the grounding layer electrode is provided, and are connected electrically with either the power source layer electrode or the grounding layer electrode. This configuration makes the electric connection for employing the capacitors and the electric connection between faces of the sheet independent from each other. Thus, it is possible to provide a capacitor sheet in which the adverse effects of inductances of vias are minimized.
    • 电容器片包括层压片,用于电连接层压片的表面的接口连接馈通导体和电容器连接馈通导体。 层叠片具有至少一层由电源层电极,接地层电极和插在电源层电极和接地层电极之间的电介质层构成的层叠体。 界面连接馈通导体形成在穿过电介质层,电源层电极和接地层电极的通孔中,并且由设置在内部的电源层电极和接地层电极的绝缘壁绝缘。 电容器连接馈通导体形成在仅设置电源层电极或接地层电极的区域中,并且与电源层电极或接地层电极电连接。 这种构造使得用于采用电容器的电连接和片材的面之间的电连接彼此独立。 因此,可以提供一种电容器片,其中通孔的电感的不利影响被最小化。