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1. 发明申请

US20060284088A1 Focus correction method for inspection of circuit patterns 审中-公开
标题翻译：电路图案检查的对焦校正方法
公开(公告)号：US20060284088A1
公开(公告)日：2006-12-21
申请号：US11439538
申请日：2006-05-24
申请人： Fumihiko Fukunaga , Kouichi Hayakawa , Masayoshi Takeda
发明人： Fumihiko Fukunaga , Kouichi Hayakawa , Masayoshi Takeda
IPC分类号： G21K7/00
CPC分类号： H01J37/265 , H01J37/21 , H01J37/222 , H01J37/244 , H01J2237/004 , H01J2237/216 , H01J2237/2487 , H01J2237/2817
摘要： A charged particle application circuit pattern inspection apparatus and method are disclosed, in which the reduction in the rejection rate attributable to an out-of-focus state due to the change in the charge condition on the sample surface is prevented and the false information is reduced to improve the apparatus reliability. The image acquisition position on a sample is stored in an image acquisition position storage unit, a focus correction value is stored in a focus correction value storage unit in accordance with the image acquisition position and the sample charge condition, the inspection conditions and the sample to be inspected are input from an input unit, the sample charge condition is evaluated in accordance with the image position acquisition position, and the focal point is corrected by a focus correction unit.
摘要翻译：公开了一种带电粒子应用电路图案检查装置和方法，其中防止由于样品表面上的充电条件的变化而导致的失焦状态的抑制率的降低，并且错误信息被减少提高设备的可靠性。将样本上的图像获取位置存储在图像获取位置存储单元中，根据图像获取位置和样本计费条件，检查条件和样本将聚焦校正值存储在聚焦校正值存储单元中被检查是从输入单元输入的，根据图像位置获取位置评估样本计费条件，并且通过聚焦校正单元校正焦点。

2. 发明授权

US09165356B2 Defect inspection method and defect inspection device 有权
标题翻译：缺陷检查方法和缺陷检查装置
公开(公告)号：US09165356B2
公开(公告)日：2015-10-20
申请号：US14238105
申请日：2012-07-06
申请人： Minoru Harada , Atsushi Miyamoto , Takehiro Hirai , Fumihiko Fukunaga
发明人： Minoru Harada , Atsushi Miyamoto , Takehiro Hirai , Fumihiko Fukunaga
IPC分类号： G06K9/00 , G06T7/00 , G01N21/956 , H01L21/66 , G01N21/95 , G01N21/88
CPC分类号： G06T7/001 , G01N21/9501 , G01N21/956 , G01N2021/8861 , G01N2021/8867 , H01L22/12 , H01L22/20
摘要： A defect inspection method for inspecting a defect on a semiconductor wafer, using plural inspection methods includes: merging hot-spot coordinates as coordinates on the semiconductor wafer, designated by a user, or coordinates where a systematic defect can occur, with detected defect coordinates on the semiconductor wafer, acquired from inspection information, after information indicating the type of coordinates are added thereto; deciding an inspection sequence of the coordinates merged with each other; and defect inspection for executing selection using the information indicating the respective types of the coordinates merged with each other, and executing an inspection by selecting an inspection method for every coordinates to be inspected.
摘要翻译：使用多种检查方法检查半导体晶片上的缺陷的缺陷检查方法包括：将由用户指定的半导体晶片上的坐标作为坐标或者发生系统缺陷的坐标合并到检测到的缺陷坐标上从检查信息获取的半导体晶片在附加了表示坐标类型的信息之后; 决定彼此合并的坐标的检查顺序; 以及使用表示彼此合并的坐标的各种类型的信息来执行选择的缺陷检查，并且通过为每个被检查坐标选择检查方法来执行检查。

3. 发明申请

US20130265408A1 CHARGED PARTICLE BEAM APPARATUS 有权
标题翻译：充电颗粒光束装置
公开(公告)号：US20130265408A1
公开(公告)日：2013-10-10
申请号：US13991948
申请日：2011-10-24
申请人： Kohei Yamaguchi , Takehiro Hirai , Fumihiko Fukunaga
发明人： Kohei Yamaguchi , Takehiro Hirai , Fumihiko Fukunaga
IPC分类号： G06T7/00
CPC分类号： G06T7/0002 , G06T7/001 , G06T2200/24 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/221 , H01J2237/24578 , H01J2237/24592 , H01J2237/2817
摘要： For inspection of a pattern such as a semiconductor device, it is useful to selectively detect a defect on the specific pattern in order to estimate the cause of the occurrence of the defect. An object of the invention is to provide a charged particle beam apparatus capable of setting, on the basis of the shape of the pattern on a sample, a region to be inspected. The invention is characterized in that the contour of the pattern on the sample is extracted using a template image obtained on the basis of an image of the sample, the region to be inspected is set on the basis of the contour of the pattern, a defect candidate is detected by comparing the image to be inspected with a comparative image, and the sample is inspected using a positional relationship between the region to be inspected and the defect candidate included in the region to be inspected.
摘要翻译：为了检查诸如半导体器件的图案，有选择地检测特定图案上的缺陷以估计缺陷发生的原因。本发明的目的是提供一种能够根据样品上的图案的形状来设定要检查的区域的带电粒子束装置。本发明的特征在于，使用基于样本的图像获得的模板图像来提取样本上的图案的轮廓，基于图案的轮廓设置待检查的区域，缺陷通过将待检查的图像与比较图像进行比较来检测候选物，并且使用待检查区域和包括在待检查区域中的缺陷候选物之间的位置关系来检查样品。

4. 发明授权

US08111902B2 Method and apparatus for inspecting defects of circuit patterns 有权
标题翻译：检查电路图形缺陷的方法和装置
公开(公告)号：US08111902B2
公开(公告)日：2012-02-07
申请号：US11488734
申请日：2006-07-19
申请人： Takashi Hiroi , Naoki Hosoya , Hirohito Okuda , Koichi Hayakawa , Fumihiko Fukunaga
发明人： Takashi Hiroi , Naoki Hosoya , Hirohito Okuda , Koichi Hayakawa , Fumihiko Fukunaga
IPC分类号： G06K9/00
CPC分类号： G06T7/0004 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/2817
摘要： The present invention relates to a defect inspection apparatus for inspecting defects in patterns formed on a semiconductor device, on the GUI of which for the confirmation of the inspection results an area is provided for displaying any one of or facing each other the features amount of defects, and the image during inspection or the reacquired image, and on the GUI of which a means is provided for setting the classification class and importance of the defects, and based on the classification class and the importance of the defects information set by this setting means, the classification conditions or the defect judging conditions are automatically or manually set so that the inspection conditions may be set easily.
摘要翻译：本发明涉及一种用于检查形成在半导体器件上的图案中的缺陷的缺陷检查装置，在其GUI上，为了确认检查结果，提供了用于显示任何一个或相互面对的特征量的缺陷，以及在检查期间的图像或重新获取的图像，并且在GUI上提供用于设置缺陷的分类等级和重要性的装置，并且基于分类等级和由该设置装置设置的缺陷信息的重要性，分类条件或缺陷判断条件自动或手动设定，以便容易地设定检查条件。

5. 发明授权

US09342878B2 Charged particle beam apparatus 有权
标题翻译：带电粒子束装置
公开(公告)号：US09342878B2
公开(公告)日：2016-05-17
申请号：US13991948
申请日：2011-10-24
申请人： Kohei Yamaguchi , Takehiro Hirai , Fumihiko Fukunaga
发明人： Kohei Yamaguchi , Takehiro Hirai , Fumihiko Fukunaga
IPC分类号： H04N9/47 , H04N7/18 , G06T7/00 , H01J37/22 , H01J37/28
CPC分类号： G06T7/0002 , G06T7/001 , G06T2200/24 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/221 , H01J2237/24578 , H01J2237/24592 , H01J2237/2817
摘要： For inspection of a pattern such as a semiconductor device, it is useful to selectively detect a defect on the specific pattern in order to estimate the cause of the occurrence of the defect. An object of the invention is to provide a charged particle beam apparatus capable of setting, on the basis of the shape of the pattern on a sample, a region to be inspected. The invention is characterized in that the contour of the pattern on the sample is extracted using a template image obtained on the basis of an image of the sample, the region to be inspected is set on the basis of the contour of the pattern, a defect candidate is detected by comparing the image to be inspected with a comparative image, and the sample is inspected using a positional relationship between the region to be inspected and the defect candidate included in the region to be inspected.
摘要翻译：为了检查诸如半导体器件的图案，有选择地检测特定图案上的缺陷以估计缺陷发生的原因。本发明的目的是提供一种能够根据样品上的图案的形状来设定要检查的区域的带电粒子束装置。本发明的特征在于，使用基于样本的图像获得的模板图像来提取样本上的图案的轮廓，基于图案的轮廓设置待检查的区域，缺陷通过将待检查的图像与比较图像进行比较来检测候选物，并且使用待检查区域和包括在待检查区域中的缺陷候选物之间的位置关系来检查样品。

6. 发明授权

US5845054A Method and apparatus for determining a correction pattern of periodical unevenness of an apparatus in which optical beams are reflected by a rotating polygonal mirror and scan a recording body 失效
标题翻译：用于确定光束由旋转多面镜反射并扫描记录体的装置的周期性不均匀性的校正图案的方法和装置
公开(公告)号：US5845054A
公开(公告)日：1998-12-01
申请号：US681920
申请日：1996-07-29
申请人： Fumihiko Fukunaga
发明人： Fumihiko Fukunaga
IPC分类号： G02B26/10 , H04N1/113 , H04N1/401 , H04N1/40
CPC分类号： H04N1/4015
摘要： An apparatus for forming an image corresponding to an input image signal, includes a light beam generator for generating a light beam; a driver for driving the light beam generator; and an image outputting device for scanning the generated light beam which has been reflected by a rotary polygonal mirror to a recording medium in a primary direction and, for moving the recording medium in a secondary direction substantially perpendicular to the primary direction so that the image is formed. A periodical modulation signal generator changes a phase or an amplitude of a first reference signal including a fundamental frequency having a period corresponding to one rotation of the rotary polygonal mirror, and generates a plurality of periodical modulation signals having different phases or different amplitudes from each other. A multiplier multiplies a second reference signal having a predetermined frequency value by the plurality of periodical modulation signals respectively. A controller controls the driver and the image outputting device in accordance with a plurality of multiplied periodical signals, and forms images respectively corresponding to the plurality of multiplied periodical signals. A periodical modulation signal inputting device inputs a first periodical modulation signal corresponding to a first position on the recording medium, and a second periodical modulation signal corresponding to a second position different from the first position. A calculator generates an unevenness correction signal in response to the inputted first and second periodical modulation signals.
摘要翻译：一种用于形成对应于输入图像信号的图像的装置，包括用于产生光束的光束发生器; 用于驱动光束发生器的驱动器; 以及图像输出装置，用于将已经被旋转多面镜反射的所产生的光束沿主要方向扫描到记录介质，并且用于沿着与主要方向基本垂直的次要方向移动记录介质，使得图像是形成。周期性调制信号发生器改变包括具有与旋转多面镜的一个旋转相对应的周期的基频的第一参考信号的相位或幅度，并且产生具有彼此不同相位或不同振幅的多个周期性调制信号。乘法器分别乘以具有预定频率值的第二参考信号与多个周期性调制信号。控制器根据多个相乘周期信号控制驱动器和图像输出装置，并且形成分别对应于多个倍增周期信号的图像。周期性调制信号输入装置输入对应于记录介质上的第一位置的第一周期性调制信号和对应于与第一位置不同的第二位置的第二周期调制信号。计算器响应于输入的第一和第二周期性调制信号产生不平坦校正信号。

7. 发明申请

US20140169657A1 Defect Inspection Method and Defect Inspection Device 有权
标题翻译：缺陷检查方法和缺陷检测装置
公开(公告)号：US20140169657A1
公开(公告)日：2014-06-19
申请号：US14238105
申请日：2012-07-06
申请人： Minoru Harada , Atsushi Miyamoto , Takehiro Hirai , Fumihiko Fukunaga
发明人： Minoru Harada , Atsushi Miyamoto , Takehiro Hirai , Fumihiko Fukunaga
IPC分类号： G06T7/00
CPC分类号： G06T7/001 , G01N21/9501 , G01N21/956 , G01N2021/8861 , G01N2021/8867 , H01L22/12 , H01L22/20
摘要： A defect inspection method for inspecting a defect on a semiconductor wafer, using plural inspection methods includes: merging hot-spot coordinates as coordinates on the semiconductor wafer, designated by a user, or coordinates where a systematic defect can occur, with detected defect coordinates on the semiconductor wafer, acquired from inspection information, after information indicating the type of coordinates are added thereto; deciding an inspection sequence of the coordinates merged with each other; and defect inspection for executing selection using the information indicating the respective types of the coordinates merged with each other, and executing an inspection by selecting an inspection method for every coordinates to be inspected.
摘要翻译：使用多种检查方法检查半导体晶片上的缺陷的缺陷检查方法包括：将由用户指定的半导体晶片上的坐标作为坐标或者发生系统缺陷的坐标合并到检测到的缺陷坐标上从检查信息获取的半导体晶片在附加了表示坐标类型的信息之后; 决定彼此合并的坐标的检查顺序; 以及使用表示彼此合并的坐标的各种类型的信息来执行选择的缺陷检查，并且通过为每个被检查坐标选择检查方法来执行检查。

8. 发明申请

US20070047800A1 Method and apparatus for inspecting defects of circuit patterns 有权
标题翻译：检查电路图形缺陷的方法和装置
公开(公告)号：US20070047800A1
公开(公告)日：2007-03-01
申请号：US11488734
申请日：2006-07-19
申请人： Takashi Hiroi , Naoki Hosoya , Hirohito Okuda , Koichi Hayakawa , Fumihiko Fukunaga
发明人： Takashi Hiroi , Naoki Hosoya , Hirohito Okuda , Koichi Hayakawa , Fumihiko Fukunaga
IPC分类号： G06K9/00
CPC分类号： G06T7/0004 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/2817
摘要： The present invention relates to a defect inspection apparatus for inspecting defects in patterns formed on a semiconductor device, on the GUI of which for the confirmation of the inspection results an area is provided for displaying any one of or facing each other the features amount of defects, and the image during inspection or the reacquired image, and on the GUI of which a means is provided for setting the classification class and importance of the defects, and based on the classification class and the importance of the defects information set by this setting means, the classification conditions or the defect judging conditions are automatically or manually set so that the inspection conditions may be set easily.
摘要翻译：本发明涉及一种用于检查形成在半导体器件上的图案中的缺陷的缺陷检查装置，在其GUI上，为了确认检查结果，提供了用于显示任何一个或相互面对的特征量的缺陷，以及在检查期间的图像或重新获取的图像，并且在GUI上提供用于设置缺陷的分类等级和重要性的装置，并且基于分类等级和由该设置装置设置的缺陷信息的重要性，分类条件或缺陷判断条件自动或手动设定，以便容易地设定检查条件。

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