专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5700381A Method for manufacturing thin film magnetic head 失效
标题翻译：制造薄膜磁头的方法
公开(公告)号：US5700381A
公开(公告)日：1997-12-23
申请号：US526498
申请日：1995-09-07
申请人： Fujimi Kimura , Toyoaki Tanaka , Akihiko Dobashi , Takashi Abe
发明人： Fujimi Kimura , Toyoaki Tanaka , Akihiko Dobashi , Takashi Abe
IPC分类号： C04B41/45 , C04B41/53 , C04B41/81 , C04B41/91 , G11B5/31 , B44C1/22
CPC分类号： C04B41/009 , C04B41/4592 , C04B41/5353 , C04B41/81 , C04B41/91 , G11B5/3163 , C04B2111/00422
摘要： After applying a metal film on a surface of a substrate, the metal film is patterned in such a manner that the surface of the substrate is exposed in a pattern that corresponds to the pattern of the required indented portion. Then, the substrate is immersed in an etchant which etches the substrate selectively to form the indented portion in the surface of the substrate using the metal film as a mask. The method makes it possible to define the depth and the pattern of an indented portion where a magnetic transducer is provided with a high degree of accuracy, to prevent a reduction in pattern accuracy due to re-adhering and to advance industrial productivity.
摘要翻译：在基板的表面上施加金属膜之后，以使得基板的表面以对应于所需凹入部分的图案的图案曝光的方式对金属膜进行图案化。然后，将衬底浸入蚀刻剂中，该蚀刻剂选择性地蚀刻衬底，以使用金属膜作为掩模在衬底的表面中形成凹陷部分。该方法能够以高精度定义设置有磁换能器的凹入部分的深度和图案，以防止由于再附着而导致的图案精度降低，并提高工业生产率。

2. 发明授权

US06184613B2 Electrode assembly, cathode device and plating apparatus including a gap configured to eliminate a concentration of a line of electrical force at a boundary between a cathode and plate forming surface of an object 有权
标题翻译：电极组件，阴极器件和电镀设备，其包括间隙，该间隙被配置为消除在物体的阴极和板形成表面之间的边界处的电力线的集中
公开(公告)号：US06184613B2
公开(公告)日：2001-02-06
申请号：US09152787
申请日：1998-09-14
申请人： Satoshi Inoue , Toyoaki Tanaka
发明人： Satoshi Inoue , Toyoaki Tanaka
IPC分类号： H01J120
CPC分类号： C25D7/12 , C25D17/001 , C25D17/10
摘要： An electrode assembly including a first cathode member provided with a hole enclosed by a frame portion. The frame portion surrounding the hole has a contact surface that comes into contact with an object to be plated at one of its surfaces, and an insulating member is provided with holes and enclosed by a frame portion, with one surface of the frame portion placed on top of another surface of the frame portion of the first cathode member. A second cathode member also provided with a hole enclosed by a frame portion, with one surface of the frame portion placed on top of one surface of the other frame portion of the insulating member. The smallest bore diameter at the hole of the second cathode member is larger than the smallest bore diameter at the holes and of the insulating member.
摘要翻译：一种电极组件，包括设置有由框架部分包围的孔的第一阴极部件。围绕孔的框架部分具有接触表面，该接触表面与其表面中的一个处被镀覆的物体接触，并且绝缘构件设置有孔并被框架部分包围，框架部分的一个表面放置在第一阴极部件的框架部分的另一个表面的顶部。第二阴极部件还设置有由框架部分包围的孔，框架部分的一个表面放置在绝缘构件的另一框架部分的一个表面的顶部上。在第二阴极部件的孔处的最小孔径大于孔和绝缘部件处的最小孔径。

3. 发明授权

US4931005A Apparatus for the production of elastic absorbent 失效
标题翻译：用于生产弹性吸收剂的设备
公开(公告)号：US4931005A
公开(公告)日：1990-06-05
申请号：US304089
申请日：1989-01-31
申请人： Toyoaki Tanaka , Katuzi Ohira , Akira Nakamura , Ryosuke Kamei , Akihiro Hashimoto
发明人： Toyoaki Tanaka , Katuzi Ohira , Akira Nakamura , Ryosuke Kamei , Akihiro Hashimoto
IPC分类号： A61F13/00 , A61F13/15 , A61F13/53 , B32B7/00 , B32B27/12 , D01G13/00 , D04H1/54
CPC分类号： D04H1/54 , A61F13/15642 , D21H17/71 , D21H23/10 , D21H5/2628 , A61F2013/00119 , A61F2013/15048 , A61F2013/15821 , A61F2013/530481 , A61F2013/53445 , Y10S428/913 , Y10T428/25 , Y10T428/253 , Y10T428/2982 , Y10T442/676 , Y10T442/678
摘要： An apparatus for the preparation of an elastic absorbent composed of a mixed web. Elements of the apparatus can include two supply hoppers for separately supplying pulverized pulp and staple fibers of a synthetic fiber split yarn at a constant mixing ratio with each hopper having a pair of confronting moving belts, two guide mechanisms located below the hoppers, a pair of nip rollers located below the guide mechanisms, a garnet roll located below the pair of nip rollers, a vacuum device located below the garnet roll, and a mesh belt located between the vacuum device and the garnet roll. Each guide mechanism in the apparatus may include at least two gear guides arranged in series. The apparatus operates by feeding the pulverized pulp and the staple fibers of the split yarn from the hoppers to the nip rolls via the guide mechanisms. The nip rolls compress the material, which is then disintegrated and mixed by the garnet roll. The mixture is pulled onto the mesh belt by the vacuum device.

4. 发明授权

US08120040B2 Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication 有权
标题翻译：用于安装IC芯片的基板，用于安装IC芯片的基板的制造方法，光通信装置以及用于光通信的装置的制造方法
公开(公告)号：US08120040B2
公开(公告)日：2012-02-21
申请号：US12785786
申请日：2010-05-24
申请人： Motoo Asai , Hiroaki Kodama , Toyoaki Tanaka
发明人： Motoo Asai , Hiroaki Kodama , Toyoaki Tanaka
IPC分类号： H01L29/04
CPC分类号： G02B6/43 , H01L24/73 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/01322 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H05K1/0274 , H05K3/28 , H05K3/4602 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.
摘要翻译：一种用于光通信的装置，包括用于安装IC芯片的基板和多层印刷电路板。在用于安装IC芯片的基板中形成有用于透射用于安装IC芯片的基板的用于透射光信号的光路。

5. 发明授权

US07881423B2 X-ray CT apparatus and X-ray radiographic method 有权
标题翻译： X射线CT装置和X射线摄影法
公开(公告)号：US07881423B2
公开(公告)日：2011-02-01
申请号：US11467811
申请日：2006-08-28
申请人： Masaharu Tsuyuki , Toyoaki Tanaka
发明人： Masaharu Tsuyuki , Toyoaki Tanaka
IPC分类号： A61B6/00
CPC分类号： A61B6/032 , A61B6/5235
摘要： An X-ray CT apparatus is adapted for switchover between a CT mode to obtain a tomographic image of a subject and a transmission mode to obtain a transmission image of the subject, depending upon projection data acquired in an imager system thereof. The apparatus includes an image-data storage device that stores image data of the subject in a three-dimensional region, a three-dimensional image processor that performs a three-dimensional image processing on the image data and generates three-dimensional image data, for display, corresponding to a line-of-sight direction inputted from an input device, and a transmission-image generator that generates the transmission image as to the image-taking direction, from data acquired in the imager system aligned by the CPU.
摘要翻译： X射线CT装置适于在CT模式之间进行切换，以获得被摄体的断层图像和透射模式，以根据在其成像系统中获取的投影数据来获得被摄体的透射图像。该装置包括存储三维区域中的被摄体的图像数据的图像数据存储装置，对该图像数据进行三维图像处理并生成三维图像数据的三维图像处理装置，生成三维图像数据，显示，对应于从输入装置输入的视线方向，以及发送图像生成器，从通过CPU对准的成像器系统中获取的数据，生成关于拍摄方向的发送图像。

6. 发明授权

US5143786A Composite fibers, water-absorbing material using the composite fibers as a base material and method for producing the same 失效
标题翻译：复合纤维，使用复合纤维作为基材的吸水材料及其制造方法
公开(公告)号：US5143786A
公开(公告)日：1992-09-01
申请号：US708692
申请日：1991-05-31
申请人： Toyoaki Tanaka , Akira Nakamura , Yoshisuke Kamei , Akihiro Hashimoto
发明人： Toyoaki Tanaka , Akira Nakamura , Yoshisuke Kamei , Akihiro Hashimoto
IPC分类号： A61L15/42 , D01D5/42 , D01F8/04 , D04H1/54
CPC分类号： D04H1/54 , A61L15/42 , D01D5/42 , D01F8/04 , Y10S57/907 , Y10T428/249921 , Y10T428/29 , Y10T428/2904 , Y10T428/2909 , Y10T428/2913 , Y10T428/2922 , Y10T428/2924 , Y10T428/2929 , Y10T428/2931 , Y10T442/637
摘要： The present invention uses, as a base material, a multi-layer film comprising more than two layers and formed from thermoplastic resins different in melting point from one another. A sectional construction of the multi-layer film or a tape obtained from the multi-layer film is applied to a sectional construction of a fibre without modification, the multi-layer film or tape being formed into the fibre. The invention provides a composite fibre which is much more excellent as compared to a conventional heat adhesive composite fibre by melt spinning, a water-absorbing material using the composite fibre as a base material and a method for the production of the same by the stated simple means.

7. 发明授权

US5071705A Composite fibres, water-absorbing material using the composite fibres as a base material and method for producing the same 失效
标题翻译：复合纤维，使用复合纤维作为基材的吸水材料及其制造方法
公开(公告)号：US5071705A
公开(公告)日：1991-12-10
申请号：US68039
申请日：1987-06-29
申请人： Toyoaki Tanaka , Akira Nakamura , Yoshisuke Kamei , Akihiro Hashimoto
发明人： Toyoaki Tanaka , Akira Nakamura , Yoshisuke Kamei , Akihiro Hashimoto
IPC分类号： A61L15/42 , D01D5/42 , D01F8/04 , D04H1/54
CPC分类号： D04H1/54 , A61L15/42 , D01D5/42 , D01F8/04 , Y10S57/907 , Y10T428/249921 , Y10T428/29 , Y10T428/2904 , Y10T428/2909 , Y10T428/2913 , Y10T428/2922 , Y10T428/2924 , Y10T428/2929 , Y10T428/2931 , Y10T442/637
摘要： The present invention uses, as a base material, a multi-layer film comprising more than two layers and formed from thermoplastic resins different in melting point from one another. A sectional construction of the multi-layer film or a tape obtained from the multi-layer film is applied to a sectional construction of a fibre without modification, the multi-layer film or tape being formed into the fibre. The invention provides a composite fibre which is much more excellent as compared to a conventional heat adhesive composite fibre by melt spinning, a water-absorbing material using the composite fibre as a base material and a method for the production of the same by the stated simple means.

8. 发明申请

US20100232744A1 SUBSTRATE FOR MOUNTING IC CHIP, MANUFACTURING METHOD OF SUBSTRATE FOR MOUNTING IC CHIP, DEVICE FOR OPTICAL COMMUNICATION, AND MANUFACTURING METHOD OF DEVICE FOR OPTICAL COMMUNICATION 有权
标题翻译：用于安装IC芯片的基板，用于安装IC芯片的基板的制造方法，用于光通信的设备以及用于光通信的设备的制造方法
公开(公告)号：US20100232744A1
公开(公告)日：2010-09-16
申请号：US12785786
申请日：2010-05-24
申请人： Motoo ASAI , Hiroaki Kodama , Toyoaki Tanaka
发明人： Motoo ASAI , Hiroaki Kodama , Toyoaki Tanaka
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , H01L24/73 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/01322 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H05K1/0274 , H05K3/28 , H05K3/4602 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.
摘要翻译：一种用于光通信的装置，包括用于安装IC芯片的基板和多层印刷电路板。在用于安装IC芯片的基板中形成有用于透射用于安装IC芯片的基板的用于透射光信号的光路。

9. 发明授权

US06181057B2 Electrode assembly, cathode device and plating apparatus including an insulating member covering an internal circumferential edge of a cathode member 有权
标题翻译：电极组件，阴极装置和电镀装置，其包括覆盖阴极部件的内周缘的绝缘部件
公开(公告)号：US06181057B2
公开(公告)日：2001-01-30
申请号：US09152789
申请日：1998-09-14
申请人： Satoshi Inoue , Toyoaki Tanaka
发明人： Satoshi Inoue , Toyoaki Tanaka
IPC分类号： H01J120
CPC分类号： C25D7/12 , C25D17/001 , C25D17/10
摘要： An electrode assembly, including a cathode member is provided with a hole enclosed by a frame portion and a contact surface that comes into contact with an object to be plated at one surface of the frame portion. The cathode member include a conductive material such as copper plate. The cathode member is provided with a lead conductor. An insulating member is provided with holes and enclosed by frame portions, with the frame portions and placed on another surface of the frame portion of the cathode member. The frame portion of the first insulating member covers the internal circumferential edge of the cathode member over a width W1.
摘要翻译：包括阴极部件的电极组件设置有由框架部分和与框架部分的一个表面处被镀物体接触的接触表面所包围的孔。阴极构件包括诸如铜板的导电材料。阴极部件设有引线导体。绝缘构件设置有孔并由框架部分包围，框架部分被放置在阴极构件的框架部分的另一个表面上。第一绝缘构件的框架部分在宽度W1上覆盖阴极构件的内周边缘。

10. 发明授权

US6090260A Electroplating method 失效
标题翻译：电镀法
公开(公告)号：US6090260A
公开(公告)日：2000-07-18
申请号：US48328
申请日：1998-03-26
申请人： Satoshi Inoue , Toyoaki Tanaka , Yoshiro Nakagawa
发明人： Satoshi Inoue , Toyoaki Tanaka , Yoshiro Nakagawa
IPC分类号： C25D5/00 , C25D17/10 , C25D21/12 , C25D5/10
CPC分类号： C25D17/10 , C25D21/12 , Y10S204/07 , Y10S205/917 , Y10S205/918
摘要： A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.
摘要翻译：电镀被镀物体的电镀方法，该方法是将电镀液的下部部分电镀，由电镀液排出，并在每次镀敷工序中供给新的电镀液。该方法具有提供附加电流的步骤，使得待镀覆的对象总是具有阴极电位，同时将被镀物体浸入镀浴中，并且不进行电镀。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式