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1. 发明授权

US08129762B2 Image sensor 有权
标题翻译：图像传感器
公开(公告)号：US08129762B2
公开(公告)日：2012-03-06
申请号：US12347427
申请日：2008-12-31
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： H01L27/148
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要翻译：提供了一种处理衬底的方法。衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。在衬底上形成第一平坦化层。平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

2. 发明授权

US07507598B2 Image sensor fabrication method and structure 有权
标题翻译：图像传感器制造方法和结构
公开(公告)号：US07507598B2
公开(公告)日：2009-03-24
申请号：US11156794
申请日：2005-06-20
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： H01L21/00
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要翻译：提供了一种处理衬底的方法。衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。在衬底上形成第一平坦化层。平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

3. 发明申请

US20090104547A1 IMAGE SENSOR 有权
标题翻译：图像传感器
公开(公告)号：US20090104547A1
公开(公告)日：2009-04-23
申请号：US12347427
申请日：2008-12-31
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： G03F3/00
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要翻译：提供了一种处理衬底的方法。衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。在衬底上形成第一平坦化层。平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

4. 发明申请

US20060019424A1 Image sensor fabrication method and structure 有权
公开(公告)号：US20060019424A1
公开(公告)日：2006-01-26
申请号：US11156794
申请日：2005-06-20
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： H01L21/00
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.

5. 发明授权

US07505206B2 Microlens structure for improved CMOS image sensor sensitivity 有权
标题翻译：微透镜结构提高了CMOS图像传感器的灵敏度
公开(公告)号：US07505206B2
公开(公告)日：2009-03-17
申请号：US11456249
申请日：2006-07-10
申请人： Jack Deng , Chih-Kung Chang , Chin Chen Kuo , Ming-Chang Kao , Fu-Tien Weng , Bii-Junq Chang
发明人： Jack Deng , Chih-Kung Chang , Chin Chen Kuo , Ming-Chang Kao , Fu-Tien Weng , Bii-Junq Chang
IPC分类号： G02B27/10
CPC分类号： G02B3/0056 , G02B3/0018
摘要： A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.
摘要翻译：一种通过在包括光电传感器的衬底上沉积微透镜材料层来制造微透镜器件的方法。然后将微透镜材料层曝光和显影以限定微透镜材料元件，包括第一微透镜材料元件和第二微透镜材料元件。每个第二微透镜材料元件相对于每个第一微透镜材料元件的厚度基本上更大。然后将微透镜材料元件加热以形成微透镜阵列，其包括每个对应于第一微透镜材料元件的第一微透镜阵列元件和分别对应于第二微透镜材料元件的第二微透镜阵列元件。每个第一微透镜阵列元件相对于每个第二微透镜阵列元件具有大得多的焦距。例如，每个第二微透镜阵列元件相对于每个第一微透镜阵列元件的厚度基本上更大。

6. 发明授权

US07264976B2 Advance ridge structure for microlens gapless approach 有权
标题翻译：用于微透镜无间隙方法的前进脊结构
公开(公告)号：US07264976B2
公开(公告)日：2007-09-04
申请号：US11064452
申请日：2005-02-23
申请人： Jack Deng , Chin Chen Kuo , Fu-Tien Weng , Chih-Kung Chang , Bii-Junq Chang
发明人： Jack Deng , Chin Chen Kuo , Fu-Tien Weng , Chih-Kung Chang , Bii-Junq Chang
IPC分类号： H01L21/00
CPC分类号： G02B3/0018 , B29D11/00278 , H01L27/14627 , H01L27/14685
摘要： A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.
摘要翻译：在衬底上制造多个微透镜的方法包括在衬底上形成具有限定多个开口的凸脊的栅格，并且形成多个图案化的光刻胶特征，每个设置在多个开口中的一个开口内。然后，多个图案化的光致抗蚀剂特征可以在网格内回流。

7. 发明申请

US20060189062A1 Advance ridge structure for microlens gapless approach 有权
标题翻译：用于微透镜无间隙方法的前进脊结构
公开(公告)号：US20060189062A1
公开(公告)日：2006-08-24
申请号：US11064452
申请日：2005-02-23
申请人： Jack Deng , Chin Kuo , Fu-Tien Weng , Chih-Kung Chang , Bii-Junq Chang
发明人： Jack Deng , Chin Kuo , Fu-Tien Weng , Chih-Kung Chang , Bii-Junq Chang
IPC分类号： H01L21/00 , H01L21/8238 , H01L27/14
CPC分类号： G02B3/0018 , B29D11/00278 , H01L27/14627 , H01L27/14685
摘要： A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.
摘要翻译：在衬底上制造多个微透镜的方法包括在衬底上形成具有限定多个开口的凸脊的栅格，并且形成多个图案化的光刻胶特征，每个设置在多个开口中的一个开口内。然后，多个图案化的光致抗蚀剂特征可以在网格内回流。

8. 发明申请

US20060131710A1 Advanced cavity structure for wafer level chip scale package 审中-公开
标题翻译：先进的腔体结构，用于晶圆级芯片级封装
公开(公告)号：US20060131710A1
公开(公告)日：2006-06-22
申请号：US11020041
申请日：2004-12-21
申请人： Chin Kuo , Jack Deng , Fu-Tien Weng , Chih-Kung Chang , Bii-Jung Chang
发明人： Chin Kuo , Jack Deng , Fu-Tien Weng , Chih-Kung Chang , Bii-Jung Chang
IPC分类号： H01L21/00 , H01L23/02
CPC分类号： H01L27/14685 , H01L27/14618 , H01L27/14621 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides an advanced cavity structure for optically sensitive devices in wafer level chip scale package and methods of manufacturing thereof. Image sensor or light detection integrated circuits are formed on substrate. Substantially absorptive bleached cavity walls are formed about the image sensor or light detection integrated circuits. Upon attaching a transparent layer to the bleached cavity walls and above the image sensor or light detection integrated circuits, open chambers are formed thereby permitting the image sensor or light detection integrated circuits to receive and manipulate signals without decreasing or decaying the optical sensitivity of the incident light. Furthermore, individual image sensor or light detection integrated circuits may be separated from each other to comprise wafer level chip scale packages of at least one image sensor or light detection integrated circuits, at least one transparent layer, and at least one open chamber.
摘要翻译：本发明提供了一种用于晶片级芯片级封装中的光敏器件的高级腔结构及其制造方法。图像传感器或光检测集成电路形成在基板上。围绕图像传感器或光检测集成电路形成基本吸收漂白的空腔壁。当将透明层附着到漂白的空腔壁和图像传感器或光检测集成电路上方时，形成开放室，从而允许图像传感器或光检测集成电路接收和操纵信号而不会降低或衰减事件的光学灵敏度光。此外，各个图像传感器或光检测集成电路可以彼此分离，以包括至少一个图像传感器或光检测集成电路，至少一个透明层和至少一个开放室的晶片级芯片级封装。

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