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    • 3. 发明申请
    • Bipolar Junction Transistors and Methods of Fabrication Thereof
    • 双极结晶体管及其制造方法
    • US20120264269A1
    • 2012-10-18
    • US13535090
    • 2012-06-27
    • Po-Yao KeTao-Wen ChungShine ChungFu-Lung Hsueh
    • Po-Yao KeTao-Wen ChungShine ChungFu-Lung Hsueh
    • H01L21/8222
    • H01L29/73H01L21/823431
    • A method of forming a semiconductor device is provided. The method includes forming a first fin above a substrate, forming a first emitter region in a first portion of the first fin, forming a first collector region in a second portion of the first fin, and forming a first base region in a third portion of the first fin. The third portion of the first fin is disposed underneath a first gate electrode. The method further includes forming a second fin adjacent to the first fin and above the substrate. The second fin is composed of a semiconductor material. The method also includes forming a first base contact over the second fin. The first base contact is coupled to the first base region through the second fin, the substrate, and the first fin.
    • 提供一种形成半导体器件的方法。 该方法包括在衬底上形成第一鳍片,在第一鳍片的第一部分中形成第一发射极区域,在第一鳍片的第二部分中形成第一集电极区域,并在第三鳍片的第三部分形成第一基底区域 第一个翅膀 第一鳍片的第三部分设置在第一栅电极下方。 该方法还包括形成邻近第一鳍片和衬底上方的第二鳍片。 第二鳍由半导体材料构成。 该方法还包括在第二翅片上形成第一基底接触。 第一基底接触件通过第二鳍片,基底和第一鳍片耦合到第一基底区域。
    • 6. 发明授权
    • Methods of fabricating bipolar junction transistors having a fin
    • 制造具有翅片的双极结型晶体管的方法
    • US08703571B2
    • 2014-04-22
    • US13535090
    • 2012-06-27
    • Po-Yao KeTao-Wen ChungShine ChungFu-Lung Hsueh
    • Po-Yao KeTao-Wen ChungShine ChungFu-Lung Hsueh
    • H01L21/331
    • H01L29/73H01L21/823431
    • A method of forming a semiconductor device is provided. The method includes forming a first fin above a substrate, forming a first emitter region in a first portion of the first fin, forming a first collector region in a second portion of the first fin, and forming a first base region in a third portion of the first fin. The third portion of the first fin is disposed underneath a first gate electrode. The method further includes forming a second fin adjacent to the first fin and above the substrate. The second fin is composed of a semiconductor material. The method also includes forming a first base contact over the second fin. The first base contact is coupled to the first base region through the second fin, the substrate, and the first fin.
    • 提供一种形成半导体器件的方法。 该方法包括在衬底上形成第一鳍片,在第一鳍片的第一部分中形成第一发射极区域,在第一鳍片的第二部分形成第一集电极区域,并在第三鳍片的第三部分形成第一基底区域 第一个翅膀 第一鳍片的第三部分设置在第一栅电极下方。 该方法还包括形成邻近第一鳍片和衬底上方的第二鳍片。 第二鳍由半导体材料构成。 该方法还包括在第二翅片上形成第一基底接触。 第一基底接触件通过第二鳍片,基底和第一鳍片耦合到第一基底区域。
    • 7. 发明授权
    • High-voltage BJT formed using CMOS HV processes
    • 使用CMOS HV工艺形成高压BJT
    • US08415764B2
    • 2013-04-09
    • US12750503
    • 2010-03-30
    • Tao-Wen ChungPo-Yao KeWei-Yang LinShine Chung
    • Tao-Wen ChungPo-Yao KeWei-Yang LinShine Chung
    • H01L27/082
    • H01L27/0823H01L29/0692H01L29/0821H01L29/7322H01L29/735
    • An integrated circuit device includes a semiconductor substrate having a top surface; at least one insulation region extending from the top surface into the semiconductor substrate; a plurality of base contacts of a first conductivity type electrically interconnected to each other; and a plurality of emitters and a plurality of collectors of a second conductivity type opposite the first conductivity type. Each of the plurality of emitters, the plurality of collectors, and the plurality of base contacts is laterally spaced apart from each other by the at least one insulation region. The integrated circuit device further includes a buried layer of the second conductivity type in the semiconductor substrate, wherein the buried layer has an upper surface adjoining bottom surfaces of the plurality of collectors.
    • 集成电路器件包括具有顶表面的半导体衬底; 至少一个绝缘区域,从所述顶表面延伸到所述半导体衬底中; 多个彼此电互连的第一导电类型的基座触头; 以及与第一导电类型相反的第二导电类型的多个发射极和多个集电极。 多个发射器,多个集光器和多个基座触点中的每一个通过至少一个绝缘区域彼此横向间隔开。 集成电路装置还包括在半导体衬底中的第二导电类型的掩埋层,其中掩埋层具有邻接多个集电极的底表面的上表面。
    • 8. 发明申请
    • High-Voltage BJT Formed Using CMOS HV Processes
    • 使用CMOS HV工艺形成高压BJT
    • US20100301453A1
    • 2010-12-02
    • US12750503
    • 2010-03-30
    • Tao Wen ChungPo-Yao KeWei-Yang LinShine Chung
    • Tao Wen ChungPo-Yao KeWei-Yang LinShine Chung
    • H01L27/082
    • H01L27/0823H01L29/0692H01L29/0821H01L29/7322H01L29/735
    • An integrated circuit device includes a semiconductor substrate having a top surface; at least one insulation region extending from the top surface into the semiconductor substrate; a plurality of base contacts of a first conductivity type electrically interconnected to each other; and a plurality of emitters and a plurality of collectors of a second conductivity type opposite the first conductivity type. Each of the plurality of emitters, the plurality of collectors, and the plurality of base contacts is laterally spaced apart from each other by the at least one insulation region. The integrated circuit device further includes a buried layer of the second conductivity type in the semiconductor substrate, wherein the buried layer has an upper surface adjoining bottom surfaces of the plurality of collectors.
    • 集成电路器件包括具有顶表面的半导体衬底; 至少一个绝缘区域,从所述顶表面延伸到所述半导体衬底中; 多个彼此电互连的第一导电类型的基座触头; 以及与第一导电类型相反的第二导电类型的多个发射极和多个集电极。 多个发射器,多个集光器和多个基座触点中的每一个通过至少一个绝缘区域彼此横向间隔开。 集成电路装置还包括在半导体衬底中的第二导电类型的掩埋层,其中掩埋层具有邻接多个集电极的底表面的上表面。