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1. 发明授权

US5059450A Process for producing electric connecting means, in particular interconnection substrates for hybrid circuits 失效
标题翻译：用于混合电路的特殊互连基板生产电气连接手段的方法
公开(公告)号：US5059450A
公开(公告)日：1991-10-22
申请号：US495028
申请日：1990-03-16
申请人： Sylvie Mellul , Frederic Rotman , Dominique Navarro
发明人： Sylvie Mellul , Frederic Rotman , Dominique Navarro
IPC分类号： H05K3/12 , H01L21/48 , C23C26/00
CPC分类号： H01L21/4867
摘要： The process comprises, after deposition of a layer of raw ink on a support having a high thermal dissipation, of the aluminium nitride type, effecting a preliminary drying of this ink at a temperature on the order of 100.degree. C. to 150.degree. C., then a firing comprising:(a) a temperature rise including a polymer resin eliminating stage,(b) a sintering plateau at a temperature on the order of 600.degree. C. to 1000.degree. C., and(c) a timed cooling,wherein the atmosphere of the polymer resin eliminating stage has an oxygen content of between 100 ppm and 5000 ppm, while the oxygen contents of the high temperature sintering atmosphere and of the cooling atmosphere must be lower than about 10 ppm.
摘要翻译：该方法包括在将一层原始油墨沉积在具有高散热性的支撑体上之后，在氮化铝类型中，在大约100℃至150℃的温度下进行该油墨的初步干燥。然后进行焙烧，其包括：（a）包括聚合物树脂消除阶段的温度升高，（b）在约600℃至1000℃的温度下的烧结平台，和（c）定时冷却，其中聚合物树脂消除阶段的气氛的氧含量在100ppm和5000ppm之间，而高温烧结气氛和冷却气氛的氧含量必须低于约10ppm。

2. 发明授权

US5194294A Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits 失效
标题翻译：用于制备电连接装置的方法，特别是混合电路的互连物质
公开(公告)号：US5194294A
公开(公告)日：1993-03-16
申请号：US684434
申请日：1991-04-11
申请人： Frederic Rotman , Dominique Navarro , Sylvie Mellul
发明人： Frederic Rotman , Dominique Navarro , Sylvie Mellul
IPC分类号： C04B41/45 , H05K1/09 , H05K3/12
CPC分类号： H05K3/1291 , C04B41/4519 , H05K1/092 , H05K2203/086 , H05K2203/1126 , H05K2203/1476
摘要： The invention relates to a process for preparing interconnection substrates of hybrid circuits, comprising effecting on a support the deposition of a thick layer of ink or paste based on a non-noble metal, such as copper or other material having a "copper compatible" formulation, by carrying out in succession a preliminary drying for eliminating solvents at a temperature on the order of 100.degree. C. to 150.degree. C., a firing comprising:a) a temperature rise incorporating a stage for eliminating polymer resins,b) a sintering step at a temperature on the order of 600.degree. C. to 1000.degree. C., andc) a timed cooling,the firing being carried out under a substantially inert gas atmosphere (nitrogen and/or argon and/or helium), the atmosphere of the stage for eliminating the polymer resins having a content of water vapor lower than 15,000 ppm, preferably between 1,000 and 10,000 ppm, while the atmosphere for sintering at high temperature has a content of water vapor in any case lower than 1,000 ppm.
摘要翻译：本发明涉及一种用于制备混合电路的互连基板的方法，其包括在支撑物上沉积基于非贵金属（例如铜或其它具有“铜兼容性”配方）的材料的油墨或糊状物的厚层通过连续进行在大约100℃至150℃的温度下消除溶剂的初步干燥，焙烧包括：a）包括用于消除聚合物树脂的阶段的温度升高，b）烧结在大约600℃至1000℃的温度下进行步骤，c）定时冷却，在基本惰性的气体气氛（氮气和/或氩气和/或氦气）下进行焙烧，气氛用于除去水蒸汽含量低于15,000ppm，优选1,000至10,000ppm的聚合物树脂的阶段，而在高温下烧结的气氛在任何情况下都低于1,000 ppm。

3. 发明授权

US5433820A Method and apparatus for dry process fluxing 失效
标题翻译：干法助熔的方法和装置
公开(公告)号：US5433820A
公开(公告)日：1995-07-18
申请号：US136278
申请日：1993-10-15
申请人： Thierry Sindzingre , Sylvie Mellul , Eric Duchateau
发明人： Thierry Sindzingre , Sylvie Mellul , Eric Duchateau
IPC分类号： B23K1/20 , B23K3/00 , C21D1/38 , C23G5/00 , H05H1/46 , H05K3/34 , H05H1/00
CPC分类号： C23G5/00 , B23K1/203 , H05K3/3489
摘要： In a method of dry process fluxing at least one surface of a metallic article, the surface to be fluxed is treated with a plasma at atmospheric pressure of a gaseous mixture comprising hydrogen and optionally at least one inert gas. The invention also concerns an apparatus, particularly for practicing the process, as well as a process for soldering or plating.
摘要翻译：在对金属制品的至少一个表面进行干法处理助熔的方法中，待处理的表面在包含氢气和任选的至少一种惰性气体的气体混合物的大气压下用等离子体处理。本发明还涉及一种特别用于实施该方法的装置，以及用于焊接或电镀的工艺。

4. 发明授权

US5433372A Process for the application of solder composition on the pins of electronic components 失效
标题翻译：焊料成分应用于电子元器件引脚的工艺
公开(公告)号：US5433372A
公开(公告)日：1995-07-18
申请号：US995537
申请日：1992-12-22
申请人： Sylvie Mellul , Pierre Claverie
发明人： Sylvie Mellul , Pierre Claverie
IPC分类号： H05K3/34 , B23K1/08 , B23K35/38 , B23K31/02
CPC分类号： B23K35/383 , B23K1/085
摘要： A solder composition is applied to the pins of an electronic component. The pins of the component are brought into contact with solder at a soldering station having a bath exposed to a controlled atmosphere of low oxygen content maintained in a hood enclosing at least the surface of the bath. The controlled atmosphere is comprised of at least one neutral gas and a gaseous silicon hydride whose content is between 50.times.10.sup.-6 and 2.times.10.sup.-3 of the volume of the controlled atmosphere. The controlled atmosphere is produced:a) by introducing into the hood the neutral gas to bring the residual oxygen content to less than 200 ppm, thenb) by introducing into the hood the neutral gas and the silicon hydride with a content greater than four times the residual oxygen content in the controlled atmosphere, at the end of step a).
摘要翻译：将焊料组合物施加到电子部件的销上。在具有暴露于至少包围浴表面的罩中的低氧含量的受控气氛的焊接站的焊接站处，使部件的销与焊料接触。受控气氛由至少一种中性气体和含量在受控气氛体积的50×10 -6和2×10 -3之间的气态氢化硅组成。产生受控气氛：a）通过将中性气体引入发动机罩中以使残余氧含量低于200ppm，然后b）通过将中性气体和含量大于四倍的氢化硅引入罩中在步骤a）结束时，受控气氛中的残余氧含量。

5. 发明授权

US5161727A Device for providing a non-oxidizing atmosphere above a soldering bath of a machine for wave soldering 失效
标题翻译：用于提供用于波形焊接的机器的焊接上的非氧化大气的装置
公开(公告)号：US5161727A
公开(公告)日：1992-11-10
申请号：US804717
申请日：1991-12-12
申请人： Marc Leturmy , Denis Fumat , Sylvie Mellul , Michel Verlhac
发明人： Marc Leturmy , Denis Fumat , Sylvie Mellul , Michel Verlhac
IPC分类号： B23K1/008 , B23K1/08 , B23K3/06 , B23K3/08 , H05K3/34
CPC分类号： B23K1/085 , B23K1/008 , B23K3/0653 , B23K3/08
摘要： A device for providing a non-oxidizing atmosphere above a soldering bath in a vat of a machine for wave soldering, includes a hooding assembly closing the vat, an inner space and a conveyor for electronic circuits extending through the inner space. The inner space is separated from the surrounding atmosphere through seals disposed along the path of the circuits. There is structure for providing and maintaining a non-oxidizing atmosphere in the inner space, for example an inert gas or a mixture of inert and reducing gas.
摘要翻译：用于在用于波峰焊接的机器的槽中的焊接槽上方提供非氧化气氛的装置包括关闭槽的保持组件，内部空间和延伸穿过内部空间的电子电路的传送器。内部空间通过沿电路路径设置的密封与周围大气隔开。存在在内部空间中提供和维持非氧化性气氛的结构，例如惰性气体或惰性气体和还原气体的混合物。

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