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    • 6. 发明授权
    • Low-K dielectric functional imprinting materials
    • 低K电介质功能压印材料
    • US08889332B2
    • 2014-11-18
    • US13172350
    • 2011-06-29
    • Frank Y. XuJun Sung ChunMichael P. C. Watts
    • Frank Y. XuJun Sung ChunMichael P. C. Watts
    • G03F7/028G03F7/038G03F7/075
    • G03F7/0002B82Y10/00B82Y40/00H01L21/76817H01L21/7682H01L2221/1047Y10T428/24545Y10T428/24612
    • A polymerizable composition includes an organic modified silicate selected from the group consisting of silsesquioxanes having the composition RSiO1.5, partially condensed alkoxysilanes, organically modified silicates having the composition RSiO3 and R2SiO2, and partially condensed orthosilicates having the composition SiOR4, where R is an organic substituent; a decomposable organic compound; a photoinitiator; and a release agent. The composition polymerizes upon exposure to UV radiation to form an inorganic silica network, and the decomposable organic compound decomposes upon exposure to heat to form pores in the inorganic silica network. The composition may be used to form a patterned dielectric layer in an integrated circuit device. A metallic film may be disposed on the patterned dielectric layer and then planarized.
    • 可聚合组合物包括选自组成为RSiO 1.5的倍半硅氧烷,部分缩合的烷氧基硅烷,具有组成为RSiO 3和R 2 SiO 2的有机改性硅酸盐和具有组成SiOR 4的部分缩合的原硅酸盐的有机改性硅酸盐,其中R是有机 取代基; 可分解的有机化合物; 光引发剂; 和脱模剂。 组合物在暴露于UV辐射下聚合以形成无机二氧化硅网络,并且可分解有机化合物在暴露于热量时分解,以在无机二氧化硅网络中形成孔隙。 组合物可以用于在集成电路器件中形成图案化的介电层。 金属膜可以设置在图案化的介电层上,然后平坦化。
    • 8. 发明授权
    • Method to reduce adhesion between a conformable region and a pattern of a mold
    • 降低适形区域和模具图案之间粘合的方法
    • US07157036B2
    • 2007-01-02
    • US10463396
    • 2003-06-17
    • Byung Jin ChoiFrank Y. XuNicholas A. StaceyVan Xuan Hong TruskettMichael P. C. Watts
    • Byung Jin ChoiFrank Y. XuNicholas A. StaceyVan Xuan Hong TruskettMichael P. C. Watts
    • B29C59/00B29C33/60
    • B82Y10/00B82Y40/00G03F7/0002
    • The present invention provides a method to reduce adhesion between a conformable region on a substrate and a pattern of a mold, which selectively comes into contact with the conformable region. The method features forming a conformable material on the substrate and contacting the conformable material with the surface. A conditioned layer is formed from the conformable material. The conditioned layer has first and second sub-portions, with the first sub-portion being solidified and the second sub-portion having a first affinity for the surface and a second affinity for the first sub-portion. The first affinity is greater than the second affinity. In this fashion, upon separation of the mold from the conditioned layer, a subset of the second sub-portion maintains contact with the mold, thereby reducing the probability that a pattern formed in the conditioned layer becomes compromised. These and other embodiments are described herein.
    • 本发明提供一种降低基材上的适形区域和选择性地与适形区域接触的模具图案之间的粘附性的方法。 该方法的特征在于在基底上形成适形材料并使适形材料与表面接触。 由适形材料形成调理层。 调理层具有第一和第二子部分,其中第一子部分被固化,第二子部分对于表面具有第一亲和力,对第一子部分具有第二亲和力。 第一亲和力大于第二亲和力。 以这种方式,在模具与调理层分离时,第二子部分的子集保持与模具的接触,从而降低在调理层中形成的图案变得损害的可能性。 这些和其他实施例在本文中描述。
    • 9. 发明授权
    • Composition for an etching mask comprising a silicon-containing material
    • 包含含硅材料的蚀刻掩模的组合物
    • US07122079B2
    • 2006-10-17
    • US10789319
    • 2004-02-27
    • Frank Y. XuMichael N. MillerMichael P. C. Watts
    • Frank Y. XuMichael N. MillerMichael P. C. Watts
    • C08L83/00
    • B82Y10/00B82Y40/00G03F7/0002
    • The present invention includes a composition for a silicon-containing material used as an etch mask for underlying layers. More specifically, the silicon-containing material may be used as an etch mask for a patterned imprinted layer comprising protrusions and recessions. To that end, in one embodiment of the present invention, the composition includes a hydroxyl-functional silicone component, a cross-linking component, a catalyst component, and a solvent. This composition allows the silicon-containing material to selectively etch the protrusions and the segments of the patterned imprinting layer in superimposition therewith, while minimizing the etching of the segments in superposition with the recessions, and therefore allowing an in-situ hardened mask to be created by the silicon-containing material, with the hardened mask and the patterned imprinting layer forming a substantially planarized profile.
    • 本发明包括用作下层的蚀刻掩模的含硅材料用组合物。 更具体地,含硅材料可以用作包括突起和凹陷的图案化印记层的蚀刻掩模。 为此,在本发明的一个实施方案中,组合物包括羟基官能的硅氧烷组分,交联组分,催化剂组分和溶剂。 该组合物允许含硅材料与图案化压印层的突起和段的叠加选择性地蚀刻,同时最小化与凹陷叠加的段的蚀刻,并且因此允许形成原位硬化的掩模 通过含硅材料,硬化的掩模和图案化的压印层形成基本平坦化的轮廓。
    • 10. 发明授权
    • Composition for an etching mask comprising a silicon-containing material
    • 包含含硅材料的蚀刻掩模的组合物
    • US07906180B2
    • 2011-03-15
    • US11508765
    • 2006-08-23
    • Frank Y. XuMichael N. MillerMichael P. C. Watts
    • Frank Y. XuMichael N. MillerMichael P. C. Watts
    • B05D3/02C08L9/04
    • B82Y10/00B82Y40/00G03F7/0002
    • The present invention includes a composition for a silicon-containing material used as an etch mask for underlying layers. More specifically, the silicon-containing material may be used as an etch mask for a patterned imprinted layer comprising protrusions and recessions. To that end, in one embodiment of the present invention, the composition includes a hydroxyl-functional silicone component, a cross-linking component, a catalyst component, and a solvent. This composition allows the silicon-containing material to selectively etch the protrusions and the segments of the patterned imprinting layer in superimposition therewith, while minimizing the etching of the segments in superposition with the recessions, and therefore allowing an in-situ hardened mask to be created by the silicon-containing material, with the hardened mask and the patterned imprinting layer forming a substantially planarized profile.
    • 本发明包括用作下层的蚀刻掩模的含硅材料用组合物。 更具体地,含硅材料可以用作包括突起和凹陷的图案化印记层的蚀刻掩模。 为此,在本发明的一个实施方案中,组合物包括羟基官能的硅氧烷组分,交联组分,催化剂组分和溶剂。 该组合物允许含硅材料与图案化压印层的突起和段的叠加选择性地蚀刻,同时最小化与凹陷叠加的段的蚀刻,并且因此允许形成原位硬化的掩模 通过含硅材料,硬化的掩模和图案化的压印层形成基本平坦化的轮廓。