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    • 3. 发明授权
    • Encapsulation for organic device
    • 有机装置封装
    • US07518142B2
    • 2009-04-14
    • US11761770
    • 2007-06-12
    • Uwe HoffmannJose Manuel Dieguez-CampoFrank StahrKlaus Schade
    • Uwe HoffmannJose Manuel Dieguez-CampoFrank StahrKlaus Schade
    • H01L35/24
    • H01L51/5253H01L2251/558
    • The present invention concerns a thin-film encapsulation structure for electronic devices with organic substances, especially OLEDs or other organic optoelectronic devices as well as corresponding components and a process for the production with a primary, inorganic barrier layer (5), which is directly arranged on the device or the surface to be encapsulated; a planarization layer (6) arranged on the primary, inorganic barrier layer, the thickness of said planarization layer selected such that it is thicker than the simple value of the distance between highest peak and deepest valley of the surface of the primary barrier layer or the surface of the device under the primary barrier layer or the surface to be encapsulated, as well as a secondary barrier layer (14) arranged on the planarization layer.
    • 本发明涉及一种具有有机物质的电子器件的薄膜封装结构,特别是OLED或其它有机光电子器件以及相应的部件,以及用于生产具有主要无机阻挡层(5)的方法,其直接布置 在要封装的设备或表面上; 布置在初级无机阻挡层上的平坦化层(6),所述平坦化层的厚度被选择为比主要阻挡层的表面的最高峰和最深谷之间的距离的简单值 主要阻挡层或待封装表面下的器件表面,以及布置在平坦化层上的次级阻挡层(14)。
    • 4. 发明申请
    • ENCAPSULATION FOR ORGANIC DEVICE
    • 有机装置封装
    • US20070290201A1
    • 2007-12-20
    • US11761770
    • 2007-06-12
    • Uwe HoffmannJose Dieguez-CampoFrank StahrKlaus Schade
    • Uwe HoffmannJose Dieguez-CampoFrank StahrKlaus Schade
    • H01L29/08
    • H01L51/5253H01L2251/558
    • The present invention concerns a thin-film encapsulation structure for electronic devices with organic substances, especially OLEDs or other organic optoelectronic devices as well as corresponding components and a process for the production with a primary, inorganic barrier layer (5), which is directly arranged on the device or the surface to be encapsulated; a planarization layer (6) arranged on the primary, inorganic barrier layer, the thickness of said planarization layer selected such that it is thicker than the simple value of the distance between highest peak and deepest valley of the surface of the primary barrier layer or the surface of the device under the primary barrier layer or the surface to be encapsulated, as well as a secondary barrier layer (14) arranged on the planarization layer.
    • 本发明涉及一种具有有机物质的电子器件的薄膜封装结构,特别是OLED或其它有机光电子器件以及相应的部件,以及用于生产具有主要无机阻挡层(5)的方法,其直接布置 在要封装的设备或表面上; 布置在初级无机阻挡层上的平坦化层(6),所述平坦化层的厚度被选择为比主要阻挡层的表面的最高峰和最深谷之间的距离的简单值 主要阻挡层或待封装表面下的器件表面,以及布置在平坦化层上的次级阻挡层(14)。