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1. 发明授权

US08061811B2 Micro-fluid ejection heads with chips in pockets 有权
标题翻译：微型液体喷射头，带有口袋中的芯片
公开(公告)号：US08061811B2
公开(公告)日：2011-11-22
申请号：US11536470
申请日：2006-09-28
申请人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
发明人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
IPC分类号： B41J2/04
CPC分类号： B41J2/14 , B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , Y10T29/49401
摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.
摘要翻译：提供了微流体喷射头和用于制造微流体喷射头的方法，包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。导电材料沉积在衬底的器件表面附近并与芯片电连通。

2. 发明申请

US20080079776A1 Micro-Fluid Ejection Heads with Chips in Pockets 有权
标题翻译：微型流体喷射头与芯片中的芯片
公开(公告)号：US20080079776A1
公开(公告)日：2008-04-03
申请号：US11536470
申请日：2006-09-28
申请人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
发明人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
IPC分类号： B41J2/04
CPC分类号： B41J2/14 , B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , Y10T29/49401
摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.
摘要翻译：提供了微流体喷射头和用于制造微流体喷射头的方法，包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。导电材料沉积在衬底的器件表面附近并与芯片电连通。

3. 发明授权

US08029100B2 Micro-fluid ejection heads with chips in pockets 有权
公开(公告)号：US08029100B2
公开(公告)日：2011-10-04
申请号：US12765259
申请日：2010-04-22
申请人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
发明人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence Weaver
IPC分类号： B41J2/04
CPC分类号： B41J2/14 , B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , Y10T29/49401
摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.

4. 发明申请

US20100199497A1 Micro-Fluid Ejection Heads with Chips in Pockets 有权
标题翻译：微型流体喷射头与芯片中的芯片
公开(公告)号：US20100199497A1
公开(公告)日：2010-08-12
申请号：US12765259
申请日：2010-04-22
申请人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence weaver
发明人： Frank Edward Anderson , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan , Sean Terrence weaver
IPC分类号： B23P17/00
CPC分类号： B41J2/14 , B41J2/16 , B41J2/1623 , B41J2002/14362 , B41J2002/14491 , Y10T29/49401
摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.
摘要翻译：提供了微流体喷射头和用于制造微流体喷射头的方法，包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。导电材料沉积在衬底的器件表面附近并与芯片电连通。

5. 发明授权

US06357864B1 Tab circuit design for simplified use with hot bar soldering technique 有权
标题翻译： Tab电路设计，简化使用热棒焊接技术
公开(公告)号：US06357864B1
公开(公告)日：2002-03-19
申请号：US09464969
申请日：1999-12-16
申请人： Carl Edmond Sullivan , Frank Edward Anderson , Paul Timothy Spivey , Kris Ann Reeves , Gary Raymond Williams , Jeanne Marie Saldanha Singh
发明人： Carl Edmond Sullivan , Frank Edward Anderson , Paul Timothy Spivey , Kris Ann Reeves , Gary Raymond Williams , Jeanne Marie Saldanha Singh
IPC分类号： B41J205
CPC分类号： B41J2/14072 , B41J2/14024 , H05K3/3494 , H05K3/363 , H05K3/4084 , H05K2201/0394 , H05K2201/10681 , H05K2201/10977 , H05K2203/0195 , H05K2203/1311
摘要： The invention provides a printhead cartridge body contained within an inkjet printer which contains a tape automated bonding (TAB) circuit, having a unique architecture, electrically connected to a printhead heater chip and a printed circuit board (PCB). Moreover, the TAB circuit architecture is readily sealable by a variety of methods. The TAB circuit includes elongate apertures which have a length axis aligned perpendicular to electrical traces which run through the apertures. Each trace has a first end running through the apertures and being connected to a PCB by means of a hot bar soldering technique and the second end of the traces being connected to a printhead heater chip. An encapsulant layer substantially encloses the rectangular apertures and electrical connections preventing ink mist from contacting the connections. The TAB circuit design provides improvement in the manufacturing process and enables rework of connections without destroying the TAB circuit.
摘要翻译：本发明提供了一种包含在喷墨打印机内的打印头墨盒体，其包含带状自动粘合（TAB）电路，其具有电连接到打印头加热器芯片和印刷电路板（PCB）的独特结构。此外，TAB电路架构可以通过各种方法容易地密封。 TAB电路包括细长孔，其具有垂直于穿过孔的电迹线对准的长度轴。每个迹线具有穿过孔的第一端，并且通过热棒焊接技术连接到PCB，并且迹线的第二端连接到打印头加热器芯片。密封剂层基本上包围矩形孔和防止墨雾接触连接的电连接。 TAB电路设计提供了制造过程的改进，并能够重新连接连接而不破坏TAB电路。

6. 发明授权

US06267472B1 Ink jet heater chip module with sealant material 失效
标题翻译：喷墨加热器芯片模块采用密封材料
公开(公告)号：US06267472B1
公开(公告)日：2001-07-31
申请号：US09100070
申请日：1998-06-19
申请人： Colin Geoffrey Maher , Ashok Murthy , Darrin Wayne Oliver , Robert Allen Samples , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan
发明人： Colin Geoffrey Maher , Ashok Murthy , Darrin Wayne Oliver , Robert Allen Samples , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan
IPC分类号： B41J205
CPC分类号： B41J2/1635 , B41J2/14024 , B41J2/14072 , B41J2/1603 , B41J2/1623 , B41J2202/03
摘要： A heater chip module is provided comprising a carrier adapted to be secured directly to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes inner side walls and a support section which together define an inner cavity. An edge feed heater chip is coupled to the carrier support section. The heater chip includes side walls. The support section includes first and second passages which define first and second paths for ink to travel from the container to the inner cavity. The inner cavity and the heater chip are sized such that a first side wall of the heater chip is spaced from a first inner side wall of the carrier and a second side wall of the heater chip is spaced from a second inner side wall of the carrier. A nozzle plate is coupled to the heater chip and the carrier. The nozzle plate has a width such that the nozzle plate extends over an outer surface of the carrier. Sealant material is provided in the inner cavity such that at least a portion of the first inner side wall of the carrier, at least a portion of the first side wall of the heater chip, a first section of the nozzle plate and the sealant material define a first sealed ink cavity for receiving ink passing through the first passage. Additional sealant material is provided in the inner cavity such that at least a portion of the second inner side wall of the carrier, at least a portion of the second side wall of the heater chip, a second section of the nozzle plate and the additional sealant material define a second sealed ink cavity for receiving ink passing through the second passage.
摘要翻译：提供一种加热器芯片模块，其包括适于直接固定到填充墨水的容器的载体，至少一个具有联接到载体的基座的加热器芯片，以及耦合到加热器芯片的至少一个喷嘴板。载体包括内侧壁和一起限定内腔的支撑部分。边缘进料加热器芯片联接到载体支撑部分。加热器芯片包括侧壁。支撑部分包括第一和第二通道，其限定用于油墨从容器行进到内腔的第一和第二路径。内腔和加热器芯片的尺寸使得加热器芯片的第一侧壁与载体的第一内侧壁间隔开，并且加热器芯片的第二侧壁与载体的第二内侧壁间隔开。喷嘴板连接到加热器芯片和载体。喷嘴板具有使得喷嘴板在载体的外表面上延伸的宽度。密封材料设置在内腔中，使得载体的第一内侧壁的至少一部分，加热器芯片的第一侧壁的至少一部分，喷嘴板的第一部分和密封材料限定用于接收通过第一通道的油墨的第一密封油墨腔。附加的密封剂材料设置在内腔中，使得载体的第二内侧壁的至少一部分，加热器芯片的第二侧壁的至少一部分，喷嘴板的第二部分和附加密封剂材料限定了用于接收通过第二通道的油墨的第二密封油墨腔。

7. 发明授权

US07784909B2 Ink jetting structure having protected connections 有权
标题翻译：具有受保护连接的喷墨结构
公开(公告)号：US07784909B2
公开(公告)日：2010-08-31
申请号：US12021375
申请日：2008-01-29
申请人： Frank Edward Anderson , Michael John Dixon , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
发明人： Frank Edward Anderson , Michael John Dixon , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
IPC分类号： B41J2/14
CPC分类号： B41J2/17553 , B41J2/17526
摘要： An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer.
摘要翻译：喷墨结构包括具有第一表面和第二表面的基底。加热器芯片安装到基板的第二表面，并且包括第一组电触头。打印头电路构件具有第三表面，第四表面和开口，其构造成接收加热器芯片，加热器芯片的第一组电触点通过开口露出。第三表面安装到基板的第二表面。第四表面具有通过引线键合连接到第一组电触点的第二组电触头。第三表面具有电耦合到第二组电触头的第三组电触点，并且电连接到柔性电缆，用于耦合到打印机上的相应触点。

8. 发明申请

US20100132874A1 Composite Ceramic Substrate for Micro-Fluid Ejection Head 有权
标题翻译：用于微流体喷射头的复合陶瓷基板
公开(公告)号：US20100132874A1
公开(公告)日：2010-06-03
申请号：US12697308
申请日：2010-02-01
申请人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
发明人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
IPC分类号： B29C65/02
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1632 , B41J2/1634 , B41J2202/03 , Y10T29/435 , Y10T29/49155 , Y10T29/49163 , Y10T29/49401 , Y10T428/24926
摘要： A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTCC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.
摘要翻译：一种用于接收用于微流体喷射头的喷射头芯片的复合陶瓷基板和用于制造复合陶瓷基板的方法。衬底包括具有基本平坦化的第一表面的高温预先烧制的陶瓷基底和穿过其中的至少一个流体供给槽。具有至少两个LTCC带层的低温共烧陶瓷（LTCC）带层束在LTCC带层束和陶瓷基底的第一表面之间的界面附着在陶瓷基底上。 LTCC带层束在其中具有至少一个芯片袋，并且LTCC带层中的至少一个包括多个导体。

9. 发明授权

US07959261B2 Micro-fluid ejection devices having reduced input/output addressable heaters 有权
标题翻译：具有减少的输入/输出可寻址加热器的微流体喷射装置
公开(公告)号：US07959261B2
公开(公告)日：2011-06-14
申请号：US11745545
申请日：2007-05-08
申请人： Frank Edward Anderson , Michael John Dixon , Jeanne Marie Saldanha Singh , Timothy Lowell Strunk , George Nelson Woolcott
发明人： Frank Edward Anderson , Michael John Dixon , Jeanne Marie Saldanha Singh , Timothy Lowell Strunk , George Nelson Woolcott
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/14129 , B41J2/14072 , B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1642 , B41J2/1646 , Y10T29/49401
摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection, heads, and micro-fluid ejection heads having N actuators on a first substrate and logic capable of driving the N actuators on a second substrate. The ejection heads also have less than N electrical connections between the first and second substrates.
摘要翻译：微流体喷射装置，用于制造微流体喷射的方法，具有在第一基板上具有N个致动器的微流体喷射头和能够在第二基板上驱动N个致动器的逻辑。喷头在第一和第二基板之间也具有少于N个电连接。

10. 发明授权

US07937835B2 Composite ceramic substrate for micro-fluid ejection head 有权
标题翻译：用于微流体喷射头的复合陶瓷基板
公开(公告)号：US07937835B2
公开(公告)日：2011-05-10
申请号：US12697308
申请日：2010-02-01
申请人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
发明人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
IPC分类号： B21H1/08 , B41J2/05
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1632 , B41J2/1634 , B41J2202/03 , Y10T29/435 , Y10T29/49155 , Y10T29/49163 , Y10T29/49401 , Y10T428/24926
摘要： A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTTC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.
摘要翻译：一种用于接收用于微流体喷射头的喷射头芯片的复合陶瓷基板和用于制造复合陶瓷基板的方法。衬底包括具有基本平坦化的第一表面的高温预先烧制的陶瓷基底和穿过其中的至少一个流体供给槽。具有至少两个LTCC带层的低温共烧陶瓷（LTCC）带层束在LTCC带层束和陶瓷基底的第一表面之间的界面附着在陶瓷基底上。 LTTC带层束在其中具有至少一个芯片袋，并且LTCC带层中的至少一个包括多个导体。

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