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1. 发明授权

US5194713A Removal of excimer laser debris using carbon dioxide laser 失效
标题翻译：使用二氧化碳激光去除准分子激光碎片
公开(公告)号：US5194713A
公开(公告)日：1993-03-16
申请号：US777057
申请日：1991-10-17
申请人： Frank D. Egitto , Cynthia J. Moring , Daniel C. Van Hart
发明人： Frank D. Egitto , Cynthia J. Moring , Daniel C. Van Hart
IPC分类号： H01L21/48 , H05K1/03 , H05K3/00
CPC分类号： H05K3/0032 , H01L21/486 , H05K3/0055 , H05K1/0366 , H05K2201/015 , H05K2203/107 , H05K2203/108 , H05K3/0035 , H05K3/0047 , H05K3/005
摘要： Disclosed is a method of fabricating a microelectronic circuit package. The circuit package has a reinforced fluorocarbon polymer dielectric. According to the disclosed process, vias or through holes are formed in the composite by a process that leaves debris. The debris in the formed vias or through holes is reflowed in order to smooth the via and through hole walls for subsequent plating.
摘要翻译：公开了一种制造微电子电路封装的方法。电路封装具有增强的氟碳聚合物电介质。根据所公开的方法，通过留下碎片的方法在复合材料中形成通孔或通孔。形成的通孔或通孔中的碎屑被回流以便平滑通孔和通孔壁用于随后的电镀。

2. 发明申请

US20110260299A1 METHOD FOR VIA PLATING IN ELECTRONIC PACKAGES CONTAINING FLUOROPOLYMER DIELECTRIC LAYERS 审中-公开
标题翻译：用于在含有荧光体介质层的电子封装中进行镀覆的方法
公开(公告)号：US20110260299A1
公开(公告)日：2011-10-27
申请号：US12765110
申请日：2010-04-22
申请人： Robert D. Edwards , Frank D. Egitto , Luis J. Matienzo , Susan Pitely , Daniel C. Van Hart
发明人： Robert D. Edwards , Frank D. Egitto , Luis J. Matienzo , Susan Pitely , Daniel C. Van Hart
IPC分类号： H01L23/50 , H05K3/00 , H01L21/441
CPC分类号： H05K3/0055 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H05K2201/015 , H05K2201/09509 , H05K2203/095 , H01L2924/00
摘要： A semiconductor printed circuit board assembly (PCBA) and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of dielectric substrate placed on the core layer. A second layer of dielectric substrate is placed on the lower surface of the core layer of CIC. The layers are laminated together. Blind vias are laser drilled into the layers of dielectric substrate. The partially completed PCBA is subjected to a reactive ion etch (RIE) plasma as a first step to clean blind vias in the PCBA. After the plasma etch, an acidic etchant liquid solution is used on the blind vias. Pre-plating cleaning of blind vias removes a majority of oxides from the blind vias. Seed copper layers are then applied to the PCBA, followed by a layer of copper plating that can be etched to meet the requirements of the PCBA.
摘要翻译：一种半导体印刷电路板组件（PCBA）及其制造方法，用于具有放置在芯层上的介电基片层的具有铜 - 铜 - 铜（CIC）芯层的电子封装。第二层电介质基片放置在CIC芯层的下表面上。层叠在一起。盲孔通过激光钻入电介质基片的层中。部分完成的PCBA经受反应离子蚀刻（RIE）等离子体作为清洁PCBA中的盲孔的第一步骤。在等离子体蚀刻之后，在盲孔上使用酸性蚀刻剂液体溶液。盲孔的电镀前清洁从盲孔中除去大部分氧化物。然后将种子铜层施加到PCBA，随后是可以被蚀刻以满足PCBA的要求的一层镀铜层。

3. 发明授权

US06210547B1 Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties 失效
标题翻译：增强的焊料表面和用于化学和机械增强焊料表面性能的工艺
公开(公告)号：US06210547B1
公开(公告)日：2001-04-03
申请号：US09382221
申请日：1999-08-24
申请人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
发明人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
IPC分类号： C23C800
CPC分类号： C23C26/00 , B23K35/262 , B23K35/268 , C23C8/00 , H05K3/3457 , H05K2203/092 , H05K2203/095 , Y10S148/901 , Y10S148/903 , Y10T428/12687 , Y10T428/12701 , Y10T428/12708 , Y10T428/12861 , Y10T428/12896
摘要： A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.
摘要翻译：一种用于改变包含第一金属和第二金属的金属合金焊料块的表面性质的方法。该方法包括将质量暴露于通电离子以优先溅射第一金属的原子，以形成小于体积比的第一金属与第二金属原子的表面层比。焊料可以位于衬底的表面上，其中该工艺可以进一步包括掩蔽衬底以屏蔽离开所述离子束的所有区域。溅射气体可以包括诸如氧的反应性气体，并且衬底可以是有机衬底。该方法可以进一步包括将有机底物同时暴露于活性气体的激发离子以粗糙化有机基底表面。

4. 发明授权

US06607613B2 Solder ball with chemically and mechanically enhanced surface properties 失效
标题翻译：焊球具有化学和机械增强的表面性能
公开(公告)号：US06607613B2
公开(公告)日：2003-08-19
申请号：US09775747
申请日：2001-02-01
申请人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
发明人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
IPC分类号： C22C1106
CPC分类号： C23C8/00 , B23K1/206 , B23K35/0244 , B23K35/262 , B23K35/268 , B23K2101/40 , C23C26/00 , H05K3/3457 , H05K3/3489 , H05K2203/092 , H05K2203/095 , Y10T428/12 , Y10T428/12021 , Y10T428/12458 , Y10T428/12493 , Y10T428/12687
摘要： A metal alloy solder ball comprising a first metal and a second metal, the first metal having a sputtering yield greater than the second metal. The solder ball comprises a bulk portion having a bulk ratio of the first metal to the second metal, an outer surface, and a surface gradient having a depth and a gradient ratio of the first metal to the second metal that is less than the bulk ratio. The gradient ratio increases along the surface gradient depth from a minimum at the outer surface. The solder ball may be formed by the process of exposing the ball to energized ions of a sputtering gas for an effective amount of time to form the surface gradient.
摘要翻译：一种包含第一金属和第二金属的金属合金焊球，所述第一金属的溅射产率大于所述第二金属。焊球包括具有第一金属与第二金属的体积比的主体部分，外表面和具有小于体积比的第一金属与第二金属的深度和梯度比的表面梯度。梯度比沿着表面梯度深度从外表面的最小值增加。可以通过将球暴露于溅射气体的激发离子有效时间以形成表面梯度的过程来形成焊球。

5. 发明授权

US6056831A Process for chemically and mechanically enhancing solder surface properties 失效
标题翻译：化学和机械增强焊料表面性能的工艺
公开(公告)号：US6056831A
公开(公告)日：2000-05-02
申请号：US113445
申请日：1998-07-10
申请人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
发明人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
IPC分类号： B23K35/14 , B23K35/26 , C23C8/00 , C23C26/00 , H05K3/34
CPC分类号： C23C26/00 , B23K35/262 , B23K35/268 , C23C8/00 , H05K3/3457 , H05K2203/092 , H05K2203/095 , Y10S148/901 , Y10S148/903 , Y10T428/12687 , Y10T428/12701 , Y10T428/12708 , Y10T428/12861 , Y10T428/12896
摘要： A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.
摘要翻译：一种用于改变包括第一金属和第二金属的金属合金焊料块的表面性质的方法。该方法包括将质量暴露于通电离子以优先溅射第一金属的原子，以形成小于体积比的第一金属与第二金属原子的表面层比。焊料可以位于衬底的表面上，其中该工艺可以进一步包括掩蔽衬底以屏蔽离开所述离子束的所有区域。溅射气体可以包括诸如氧的反应性气体，并且衬底可以是有机衬底。该方法可以进一步包括将有机底物同时暴露于活性气体的激发离子以粗糙化有机基底表面。

6. 发明授权

US06693031B2 Formation of a metallic interlocking structure 失效
标题翻译：形成金属互锁结构
公开(公告)号：US06693031B2
公开(公告)日：2004-02-17
申请号：US10039710
申请日：2002-01-04
申请人： Gerald G. Advocate, Jr. , Francis J. Downes, Jr. , Luis J. Matienzo , Ronald A. Kaschak , John S. Kresge , Daniel C. Van Hart
发明人： Gerald G. Advocate, Jr. , Francis J. Downes, Jr. , Luis J. Matienzo , Ronald A. Kaschak , John S. Kresge , Daniel C. Van Hart
IPC分类号： H01L2144
CPC分类号： H01L23/5226 , H01L23/49827 , H01L2924/0002 , H05K3/0035 , H05K3/027 , H05K3/06 , H05K3/383 , H05K3/421 , H05K3/4644 , H05K2201/0248 , H05K2201/09509 , H05K2201/09563 , H05K2203/0307 , H05K2203/0353 , H01L2924/00
摘要： An electronic structure including a metallic interlocking structure for bonding a conductive plated layer to metal surface, and a method of forming the electronic structure. The method provides a substrate having a metallic sheet within a dielectric layer. The metallic sheet includes a metal such as copper. An opening in the substrate, such as a blind via, is formed by laser drilling through the dielectric layer and partially through the metallic sheet. If the opening is a blind via, then the laser drilling is within an outer ring of the blind via cross section using a laser beam having a target diameter between about 20% and about 150% of a radius of the blind via cross section. A surface at the bottom of the opening, called a “blind surface,” includes a metallic protrusion formed by the laser drilling, such that the metallic protrusion is integral with a portion of the blind surface. The metallic protrusion includes the metal of the metallic sheet and at least one constituent element from the dielectric layer. The metallic protrusion is then etched to form a metallic interlocking structure that is integral with the portion of the blind surface. The metallic interlocking structure includes discrete metallic fibers, with each metallic fiber having a curved (or curled) geometry. Each metallic fiber has its own unique composition that includes the metal, at least one constituent element of the dielectric layer, or both.
摘要翻译：一种电子结构，包括用于将导电镀层接合到金属表面的金属互锁结构，以及形成电子结构的方法。该方法提供了在电介质层内具有金属片的衬底。金属片包括铜等金属。通过激光钻孔穿过电介质层并且部分地穿过金属片，形成诸如盲孔之类的衬底中的开口。如果开口是盲孔，则激光钻孔是通过横截面的盲孔通过横截面的半径的约20％至约150％之间的目标直径的激光束在盲孔的外环内。在开口底部的称为“盲面”的表面包括通过激光钻孔形成的金属突起，使得金属突起与盲表面的一部分成一体。金属突起包括金属片的金属和来自电介质层的至少一个构成元件。然后蚀刻金属突起以形成与盲表面的一部分成一体的金属互锁结构。金属互锁结构包括分立的金属纤维，每个金属纤维具有弯曲（或卷曲）的几何形状。每种金属纤维具有其独特的组成，其包括金属，介电层的至少一个构成元件，或两者。

7. 发明授权

US06348737B1 Metallic interlocking structure 失效
标题翻译：形成金属互锁结构
公开(公告)号：US06348737B1
公开(公告)日：2002-02-19
申请号：US09517847
申请日：2000-03-02
申请人： Gerald G. Advocate, Jr. , Francis J. Downes, Jr. , Luis J. Matienzo , Ronald A. Kaschak , John S. Kresge , Daniel C. Van Hart
发明人： Gerald G. Advocate, Jr. , Francis J. Downes, Jr. , Luis J. Matienzo , Ronald A. Kaschak , John S. Kresge , Daniel C. Van Hart
IPC分类号： H01L2348
CPC分类号： H01L23/5226 , H01L23/49827 , H01L2924/0002 , H05K3/0035 , H05K3/027 , H05K3/06 , H05K3/383 , H05K3/421 , H05K3/4644 , H05K2201/0248 , H05K2201/09509 , H05K2201/09563 , H05K2203/0307 , H05K2203/0353 , H01L2924/00
摘要： An electronic structure including a metallic interlocking structure for bonding a conductive plated layer to metal surface, and a method of forming the electronic structure. The method provides a substrate having a metallic sheet within a dielectric layer. The metallic sheet includes a metal such as copper. An opening in the substrate, such as a blind via, is formed by laser drilling through the dielectric layer and partially through the metallic sheet. If the opening is a blind via, then the laser drilling is within an outer ring of the blind via cross section using a laser beam having a target diameter between about 20% and about 150% of a radius of the blind via cross section. A surface at the bottom of the opening, called a “blind surface,” includes a metallic protrusion formed by the laser drilling, such that the metallic protrusion is integral with a portion of the blind surface. The metallic protrusion includes the metal of the metallic sheet and at least one constituent element from the dielectric layer. The metallic protrusion is then etched to form a metallic interlocking structure that is integral with the portion of the blind surface. The metallic interlocking structure includes discrete metallic fibers, with each metallic fiber having a curved (or curled) geometry. Each metallic fiber has its own unique composition that includes the metal, at least one constituent element of the dielectric layer, or both.
摘要翻译：一种电子结构，包括用于将导电镀层接合到金属表面的金属互锁结构，以及形成电子结构的方法。该方法提供了在电介质层内具有金属片的衬底。金属片包括铜等金属。通过激光钻孔穿过电介质层并且部分地穿过金属片，形成诸如盲孔之类的衬底中的开口。如果开口是盲孔，则激光钻孔是通过横截面的盲孔通过横截面的半径的约20％至约150％之间的目标直径的激光束在盲孔的外环内。在开口底部的称为“盲面”的表面包括通过激光钻孔形成的金属突起，使得金属突起与盲表面的一部分成一体。金属突起包括金属片的金属和来自电介质层的至少一个构成元件。然后蚀刻金属突起以形成与盲表面的一部分成一体的金属互锁结构。金属互锁结构包括分立的金属纤维，每个金属纤维具有弯曲（或卷曲）的几何形状。每种金属纤维具有其独特的组成，其包括金属，介电层的至少一个构成元件，或两者。

8. 发明授权

US06639661B2 Technique for imaging electrical contacts 失效
公开(公告)号：US06639661B2
公开(公告)日：2003-10-28
申请号：US09756325
申请日：2001-01-08
申请人： William L. Brodsky , Lawrence P. Lehman , Daniel C. Van Hart
发明人： William L. Brodsky , Lawrence P. Lehman , Daniel C. Van Hart
IPC分类号： G01N2100
CPC分类号： G01R31/043
摘要： A congruence between the element that provides an electrical conductive path in a component of micron dimensions and an imaging of that element provides a basis for predicting the effectiveness and the consistency in the functioning of the element in an actual operating environment. The element is formed first into a sandwich whereby the operating end is deformed against a light transparent surface. By directing a beam of light into the end of that light transparent surface, the asperity of the operating end produces a light scattering effect that is imaged by microscopic optics that is located facing the operating end.

9. 发明授权

US5176811A Gold plating bath additives for copper circuitization on polyimide printed circuit boards 失效
标题翻译：用于聚酰胺印刷电路板铜电镀的镀金浴添加剂
公开(公告)号：US5176811A
公开(公告)日：1993-01-05
申请号：US649514
申请日：1991-02-01
申请人： Leann G. Keim , Ralph S. Paonessa , Daniel C. Van Hart
发明人： Leann G. Keim , Ralph S. Paonessa , Daniel C. Van Hart
IPC分类号： C25D3/48 , H01L21/48 , H01L23/12 , H05K3/24
CPC分类号： H05K3/244 , C25D3/48 , H01L21/4846 , Y10S205/92 , Y10S205/926
摘要： Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having gold plated copper circuitization on a polyimide substrate. The method includes the steps of forming a pattern of copper circuitization on the selected portions of the polyimide substrate, and thereafter depositing a gold thin film of selected portions of the copper circuitization layer. The gold thin film is electrodeposited from an electrodeposition solution of KAu(CN).sub.2, K.sub.2 HPO.sub.4, and KH.sub.2 PO.sub.4, modified by the addition of an effective amount of NH.sub.4.sup.+.

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