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1. 发明授权

US08405992B2 Power-electronic arrangement 有权
标题翻译：电力电子安排
公开(公告)号：US08405992B2
公开(公告)日：2013-03-26
申请号：US12896031
申请日：2010-10-01
申请人： Berk Yesin , Bruno Agostini , Christoph Haederli , Chunlei Liu , Francesco Agostini , Hamit Duran , Slavo Kicin
发明人： Berk Yesin , Bruno Agostini , Christoph Haederli , Chunlei Liu , Francesco Agostini , Hamit Duran , Slavo Kicin
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , H01L25/072 , H01L2924/0002 , H05K7/20936 , Y10T29/49826 , H01L2924/00
摘要： A power-electronic arrangement comprising semiconductor components (102, 103, 107), a heat exchanger (110), and an electrically conductive element (109) is presented. The heat exchanger comprises evaporator channels (111) and condenser channels (112) for working fluid. The electrically conductive element comprises a contact surface providing a thermal contact to outer surfaces of walls of the evaporator channels for transferring heat from the electrically conductive element to the evaporator channels. A main current terminal of each semiconductor component is bonded to the electrically conductive element which thus forms a part of a main current circuitry of a power system. As the main current terminal is directly bonded to the electrically conductive element cooled with the heat exchanger, the temperature gradients inside the semiconductor components can be kept moderate, and thus the temperatures inside the semiconductor components can be limited.
摘要翻译：提供了包括半导体部件（102,103,107），热交换器（110）和导电元件（109）的功率电子装置。热交换器包括用于工作流体的蒸发器通道（111）和冷凝器通道（112）。导电元件包括提供与蒸发器通道的壁的外表面的热接触的接触表面，用于将热量从导电元件传递到蒸发器通道。每个半导体部件的主电流端子被接合到导电元件，由此形成电力系统的主电流电路的一部分。由于主电流端子与由热交换器冷却的导电元件直接接合，所以半导体元件内的温度梯度可以保持适中，因此能够限制半导体元件内部的温度。

2. 发明授权

US08763681B2 Evaporator and cooling circuit 有权
标题翻译：蒸发器和冷却回路
公开(公告)号：US08763681B2
公开(公告)日：2014-07-01
申请号：US12849335
申请日：2010-08-03
申请人： Francesco Agostini , Berk Yesin , Bruno Agostini
发明人： Francesco Agostini , Berk Yesin , Bruno Agostini
IPC分类号： F28D15/00 , B01D1/00 , B01D1/06
CPC分类号： H05K7/20936 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： An evaporator for a cooling circuit is provided, for cooling at least one heat emitting device by evaporation of a cooling fluid. The evaporator includes a top collector, a bottom collector, and an evaporator body. The evaporator body includes at least one thermoconducting wall that is thermally connectable to the at least one heat emitting device, a plurality of evaporation channels, and a plurality of return channels.
摘要翻译：提供了一种用于冷却回路的蒸发器，用于通过冷却流体的蒸发来冷却至少一个发热装置。蒸发器包括顶部收集器，底部收集器和蒸发器主体。蒸发器主体包括至少一个热连接壁，其可热连接到至少一个发热装置，多个蒸发通道和多个返回通道。

3. 发明授权

US09897383B2 Heat exchanger 有权
公开(公告)号：US09897383B2
公开(公告)日：2018-02-20
申请号：US12196862
申请日：2008-08-22
申请人： Berk Yesin , Bruno Agostini
发明人： Berk Yesin , Bruno Agostini
IPC分类号： F28F7/00 , F28D15/00 , F28D1/053 , F28D15/02 , F28F1/12 , F28D21/00 , F28F13/00
CPC分类号： F28D1/05383 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28D2021/0029 , F28D2021/0031 , F28F1/126 , F28F2013/005 , Y10T29/49364
摘要： An exemplary heat exchanger is configured for removing heat energy from a heat generator. The heat exchanger including at least one conduit for a working fluid, which is arranged in an upright position of at least 45°, each conduit having an exterior wall and at least one interior wall for forming at least one evaporator channel and at least one condenser channel within the conduit. Furthermore, the heat exchanger includes a first heat transfer element for transferring heat into the evaporator channel and a second heat transfer element for transferring heat out of the condenser channel.

4. 发明授权

US08913386B2 Cooling module for cooling electronic components 有权
标题翻译：用于冷却电子部件的冷却模块
公开(公告)号：US08913386B2
公开(公告)日：2014-12-16
申请号：US13432595
申请日：2012-03-28
申请人： Thomas Gradinger , Berk Yesin , Francesco Agostini
发明人： Thomas Gradinger , Berk Yesin , Francesco Agostini
IPC分类号： H05K7/20 , F28D15/02 , F28D1/03 , F28F3/14 , H01L23/427 , F28F1/00
CPC分类号： H05K7/20936 , F28D1/035 , F28D15/0266 , F28F1/00 , F28F3/14 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.
摘要翻译：提供了一种包括冷凝器，包括冷却模块的功率模块和用于冷却电气和/或电子部件的方法的冷却模块。冷却模块的冷凝器包括用于冷却电气和/或电子部件的至少一个面板。两片板通过涉及辊粘合的方法彼此附接，使得在两片之间形成导管。导管沿着由片形成的平面的方向延伸。可以通过在面板的蒸发部分的管道中蒸发冷却剂并且通过在面板的冷凝部分处冷凝冷却剂来提供冷却。热负荷可以从热源传递到热接收单元。热接收单元适于将热负荷传递到面板，其通过热载体将热负载传递到周围环境。

5. 发明授权

US08134833B2 Evaporator for a cooling circuit 失效
标题翻译：蒸发器用于冷却回路
公开(公告)号：US08134833B2
公开(公告)日：2012-03-13
申请号：US12465442
申请日：2009-05-13
申请人： Bruno Agostini , Berk Yesin
发明人： Bruno Agostini , Berk Yesin
IPC分类号： H05K7/20
CPC分类号： F28D15/0266
摘要： An evaporator is disclosed for a cooling circuit. The evaporator includes a housing having at least one wall for contacting a heat emitting device. A channel, the cross section of which is small enough to allow convection boiling, and a separation volume are located in the evaporator. The separation volume is located at a vapor exiting port of the channel. The evaporator can include a liquid reservoir.
摘要翻译：公开了一种用于冷却回路的蒸发器。蒸发器包括具有用于接触发热装置的至少一个壁的壳体。通道，其横截面小到允许对流沸腾，并且分离容积位于蒸发器中。分离容积位于通道的蒸气出口端口处。蒸发器可以包括液体储存器。

6. 发明申请

US20130077245A1 COOLING MODULE FOR COOLING ELECTRONIC COMPONENTS 有权
标题翻译：冷却电子元件的冷却模块
公开(公告)号：US20130077245A1
公开(公告)日：2013-03-28
申请号：US13432595
申请日：2012-03-28
申请人： Thomas Gradinger , Berk Yesin , Francesco Agostini
发明人： Thomas Gradinger , Berk Yesin , Francesco Agostini
IPC分类号： H05K7/20 , F28F1/00
CPC分类号： H05K7/20936 , F28D1/035 , F28D15/0266 , F28F1/00 , F28F3/14 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.
摘要翻译：提供了一种包括冷凝器，包括冷却模块的功率模块和用于冷却电气和/或电子部件的方法的冷却模块。冷却模块的冷凝器包括用于冷却电气和/或电子部件的至少一个面板。两片板通过涉及辊粘合的方法彼此附接，使得在两片之间形成导管。导管沿着由片形成的平面的方向延伸。可以通过在面板的蒸发部分的管道中蒸发冷却剂并且通过在面板的冷凝部分处冷凝冷却剂来提供冷却。热负荷可以从热源传递到热接收单元。热接收单元适于将热负荷传递到面板，其通过热载体将热负载传递到周围环境。

7. 发明申请

US20090284926A1 TWO-PHASE COOLING CIRCUIT 有权
标题翻译：两相冷却电路
公开(公告)号：US20090284926A1
公开(公告)日：2009-11-19
申请号：US12466036
申请日：2009-05-14
申请人： Bruno AGOSTINI , Berk Yesin
发明人： Bruno AGOSTINI , Berk Yesin
IPC分类号： H05K7/20 , F28D5/00 , F28D15/00
CPC分类号： F28D15/0266 , F25B23/006 , F25B2400/23 , F28D2021/0031 , F28F13/06 , H01L23/427 , H01L2924/0002 , H05K7/20336 , H05K7/20936 , H01L2924/00
摘要： The disclosure relates to a two-phase cooling circuit. The cooling circuit can include an evaporator and a condenser. The evaporator and condenser can be connected by a feeder line and a first return line. A phase separator is arranged at an inlet side of the condenser. The phase separator can be connected with the evaporator by a second return line.
摘要翻译：本公开涉及一种两相冷却回路。冷却回路可以包括蒸发器和冷凝器。蒸发器和冷凝器可以通过馈线和第一回路连接。在冷凝器的入口侧设置相分离器。相分离器可以通过第二返回管线与蒸发器连接。

8. 发明授权

US07791885B2 Two-phase cooling circuit 有权
标题翻译：两相冷却回路
公开(公告)号：US07791885B2
公开(公告)日：2010-09-07
申请号：US12466036
申请日：2009-05-14
申请人： Bruno Agostini , Berk Yesin
发明人： Bruno Agostini , Berk Yesin
IPC分类号： H05K7/20
CPC分类号： F28D15/0266 , F25B23/006 , F25B2400/23 , F28D2021/0031 , F28F13/06 , H01L23/427 , H01L2924/0002 , H05K7/20336 , H05K7/20936 , H01L2924/00
摘要： The disclosure relates to a two-phase cooling circuit. The cooling circuit can include an evaporator and a condenser. The evaporator and condenser can be connected by a feeder line and a first return line. A phase separator is arranged at an inlet side of the condenser. The phase separator can be connected with the evaporator by a second return line.
摘要翻译：本公开涉及一种两相冷却回路。冷却回路可以包括蒸发器和冷凝器。蒸发器和冷凝器可以通过馈线和第一回路连接。在冷凝器的入口侧设置相分离器。相分离器可以通过第二返回管线与蒸发器连接。

9. 发明申请

US20080179047A1 Flexible heat cable device 审中-公开
标题翻译：柔性热电缆设备
公开(公告)号：US20080179047A1
公开(公告)日：2008-07-31
申请号：US12004037
申请日：2007-12-20
申请人： Berk Yesin , Mervi Jylhakallio , Matti Kauhanen , Jose Balta
发明人： Berk Yesin , Mervi Jylhakallio , Matti Kauhanen , Jose Balta
IPC分类号： F28D15/00 , F28F7/00
CPC分类号： H01L23/427 , F28D15/0241 , F28D15/0266 , F28F2250/08 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus for cooling an electronic device to be cooled includes a heat collector device which is in thermal contact with the electronic device, a heat sink for absorbing heat which is emitted from the heat collector device and comprising a condenser unit and a thermal interface unit, wherein the condenser unit is cooled down via the thermal interface unit, and a heat transfer device made from a flexible material for transferring heat which is emitted from the heat collector device to the heat sink. The thermal interface unit is designed as a thermal plug for connecting the condenser unit of the heat sink thermally and removably to an external cooling means.
摘要翻译：用于冷却要冷却的电子设备的冷却装置包括与电子设备热接触的集热器装置，用于吸收从集热器件发射的热量的散热器，其包括冷凝器单元和热接口单元其中，所述冷凝器单元经由所述热接口单元被冷却，以及由用于传递从所述集热器件发射到所述散热器的热量的柔性材料制成的传热装置。热接口单元被设计为用于将散热器的冷凝器单元热可拆卸地连接到外部冷却装置的热塞。

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