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1. 发明授权

US5428499A Printed circuit board having integrated decoupling capacitive core with discrete elements 失效
标题翻译：具有集成去耦电容核心和分立元件的印刷电路板
公开(公告)号：US5428499A
公开(公告)日：1995-06-27
申请号：US010129
申请日：1993-01-28
申请人： Stanley R. Szerlip , Floyd G. Paurus , Archibald W. Smith
发明人： Stanley R. Szerlip , Floyd G. Paurus , Archibald W. Smith
IPC分类号： H01G4/38 , H05K1/16 , H05K3/46
CPC分类号： H01G4/38 , H05K1/162 , H05K2201/0187 , H05K2201/09309 , H05K3/4611
摘要： A printed circuit board laminate is disclosed having a high capacitance power distribution core. The power distribution core comprises a pair of conductive plates electrically connected to an array of high capacitance core tiles, separated by a compliant dielectric filler. The resulting capacitance of the power distribution core is sufficient to eliminate the need for decoupling capacitors on a typical printed circuit board. Separate power supply areas of variable decoupling capacitance can be formed for mounted integrated circuits with different power supply requirements. A method for manufacturing such board laminates is also disclosed that is compatible with standard printed circuit board assembly technology.
摘要翻译：公开了一种具有高电容配电核心的印刷电路板层叠体。配电芯包括电连接到高容量芯片阵列的一对导电板，由柔性介电填料隔开。配电芯的所得电容足以消除对典型印刷电路板上的去耦电容的需要。可以为具有不同电源要求的安装集成电路形成可变去耦电容的独立电源区域。还公开了与标准印刷电路板组装技术相兼容的这种板层叠体的制造方法。

2. 发明授权

US5504993A Method of fabricating a printed circuit board power core using powdered ceramic materials in organic binders 失效
标题翻译：使用有机粘合剂中的陶瓷陶瓷材料制造印刷电路板电源芯的方法
公开(公告)号：US5504993A
公开(公告)日：1996-04-09
申请号：US297799
申请日：1994-08-30
申请人： Stanley R. Szerlip , Floyd G. Paurus , Frances Planinsek , Robert D. Stroud
发明人： Stanley R. Szerlip , Floyd G. Paurus , Frances Planinsek , Robert D. Stroud
IPC分类号： H05K1/03 , H05K1/16 , H05K3/02 , H05K3/10
CPC分类号： H05K1/162 , H05K1/0373 , H05K2201/0209 , H05K2201/0257 , H05K2201/09309 , H05K3/022 , Y10S428/901 , Y10T29/4916 , Y10T29/49163
摘要： A method of fabricating a printed circuit board power core is disclosed wherein ceramic particles that have a diameter that is approximately equal to the desired dielectric thickness are combined with dielectric powders that have a relatively very small size. To produce a dielectric core using this technique, a dielectric material mixture is applied between two conductor layers and bonded therebetween. This dielectric material mixture preferably has a concentration of large particles equal to the desired core thickness with a loading factor of large/small particles less than the maximum ratio needed to provide the desired dielectric constant, but greater than the ratio required to provide stability during the pressing and curing steps.
摘要翻译：公开了一种制造印刷电路板功率芯的方法，其中具有大约等于所需电介质厚度的直径的陶瓷颗粒与具有相对非常小尺寸的介电粉末组合。为了使用该技术制造介质芯，将介电材料混合物施加在两个导体层之间并粘合在其间。该介电材料混合物优选具有等于期望芯厚的大颗粒的浓度，其中大/小颗粒的负载系数小于提供所需介电常数所需的最大比例，但大于提供所需介电常数所需的比例按压和固化步骤。

3. 发明授权

US5469324A Integrated decoupling capacitive core for a printed circuit board and method of making same 失效
标题翻译：用于印刷电路板的集成去耦电容芯及其制造方法
公开(公告)号：US5469324A
公开(公告)日：1995-11-21
申请号：US319651
申请日：1994-10-07
申请人： Watson R. Henderson , Floyd G. Paurus , Stanley R. Szerlip
发明人： Watson R. Henderson , Floyd G. Paurus , Stanley R. Szerlip
IPC分类号： H05K1/03 , H05K1/16 , H05K3/46 , H01G4/018
CPC分类号： H05K1/162 , H05K1/03 , H05K2201/0187 , H05K2201/0355 , H05K2201/09309 , H05K3/4611 , Y10T29/435
摘要： A printed circuit board includes a planar first outer layer, a planar second outer layer, and a planar capacitive power distribution core disposed between the first and second outer layers. The capacitive core is formed from first and second electrically conductive layers with a dielectric layer disposed therebetween. The dielectric layer is made from a high dielectric constant material such as a ceramic in the form of a perforated sheet. The perforations permit the electrically conductive layers to be bound to the dielectric layer without significantly increasing the separation between the conductive layers. Each perforation allows a column of adhesive to collect therein to bond the power distribution core together. The resulting capacitance is typically sufficient to eliminate the need for decoupling capacitors.
摘要翻译：印刷电路板包括平面第一外层，平面第二外层和设置在第一和第二外层之间的平面电容配电芯。电容芯由第一和第二导电层形成，其间设置介电层。电介质层由高介电常数材料制成，例如陶瓷形式的多孔板。穿孔允许导电层与介电层结合，而不显着增加导电层之间的间隔。每个穿孔允许一列粘合剂收集在其中以将配电芯片结合在一起。所得到的电容通常足以消除对去耦电容器的需要。

4. 发明授权

US5273439A Thermally conductive elastomeric interposer connection system 失效
标题翻译：导热弹性插入器连接系统
公开(公告)号：US5273439A
公开(公告)日：1993-12-28
申请号：US29825
申请日：1993-03-11
申请人： Stanley R. Szerlip , Floyd G. Paurus
发明人： Stanley R. Szerlip , Floyd G. Paurus
IPC分类号： H01R12/71 , H01R13/66 , H01R9/09 , H01R13/533
CPC分类号： H01R12/714 , H01R13/66
摘要： A multi-chip module electrical and thermal conducting apparatus is provided. The apparatus is disposed between layers or boards of the module and includes electrical conducting traces. Electrical conductors are deposited on the faces of the layers and the traces electrically interconnect the electrical conductors of the two layers. The traces are joined to an elastomeric body and insulating material that are essentially non-conductive of electrical and thermal energy. The apparatus includes a thermal conduction unit that acts as a thermal shunt around the body and insulating material. The thermal conduction unit is electrically isolated from the traces. Thermal energy is received by the thermal conduction unit when heat is generated by the activation of electronic components mounted on the module layers. The thermal energy received by the thermal conduction unit is carried away by thermal vias formed in the module layers.
摘要翻译：提供了一种多芯片模块的导热和热传导装置。该装置设置在模块的层或板之间，并且包括导电迹线。电导体沉积在层的表面上，并且迹线将两层电导体电互连。迹线被连接到基本上不导电和热能的弹性体和绝缘材料。该装置包括用作围绕身体的热分流和绝缘材料的导热单元。导热单元与走线电隔离。当通过激活安装在模块层上的电子元件产生热量时，热能被热传导单元接收。由导热单元接收的热能通过在模块层中形成的热通孔带走。

5. 发明授权

US5162977A Printed circuit board having an integrated decoupling capacitive element 失效
标题翻译：具有集成去耦电容元件的印刷电路板
公开(公告)号：US5162977A
公开(公告)日：1992-11-10
申请号：US750409
申请日：1991-08-27
申请人： Floyd G. Paurus , Archibald W. Smith , Stanley R. Szerlip
发明人： Floyd G. Paurus , Archibald W. Smith , Stanley R. Szerlip
IPC分类号： H05K1/03 , H05K1/16
CPC分类号： H05K1/0231 , H05K1/162 , H05K2201/0209 , H05K2201/0257 , H05K2201/09309 , Y10T428/24917
摘要： A printed circuit board is disclosed which includes a high capacitance power distribution core, the manufacture of which is compatible with standard printed circuit board assembly technology. The high capacitance core consists of a ground plane and a power plane separated by a planar element having a high dielectric constant. The high dielectric constant material is typically glass fiber impregnated with a bonding material, such as epoxy resin loaded with a ferro-electric ceramic substance having a high dielectric constant. The ferro-electric ceramic substance is typically a nanopowder combined with an epoxy bonding material. The resulting capacitance of the power distribution core is typically sufficient to totally eliminate the need for decoupling capacitors on a typical printed circuit board.
摘要翻译：公开了一种印刷电路板，其包括高电容配电芯，其制造与标准印刷电路板组装技术兼容。高电容磁芯由接地平面和由具有高介电常数的平面元件隔开的电力平面组成。高介电常数材料通常是用粘合材料浸渍的玻璃纤维，例如负载有高介电常数的铁电陶瓷物质的环氧树脂。铁电陶瓷材料通常是与环氧树脂粘合材料组合的纳米粉末。所得到的配电芯的电容通常足以完全消除在典型印刷电路板上去耦电容器的需要。

6. 发明授权

US5448511A Memory stack with an integrated interconnect and mounting structure 失效
标题翻译：具有集成互连和安装结构的内存堆栈
公开(公告)号：US5448511A
公开(公告)日：1995-09-05
申请号：US252609
申请日：1994-06-01
申请人： Floyd G. Paurus , Stanley R. Szerlip
发明人： Floyd G. Paurus , Stanley R. Szerlip
IPC分类号： G11C5/00 , H05K1/18 , G11C5/04 , G06K19/07
CPC分类号： H05K1/189 , H01L25/0657 , H01L2225/06579 , H01L2225/06589 , H01L2924/0002 , H01L2924/19105
摘要： A memory stack includes a flexible interconnect device having a plurality of rigid sections connected together by a plurality of flexible sections. Memory devices such as dice or chips are mounted on the flexible interconnect structure and the structure is folded to at the flexible sections to form a stack. Connections among memory device I/Os and interconnect device mounting contacts are made via traces in a signal layer. A thermal conduction layer can be added to increase heat conduction away from the memory devices.
摘要翻译：存储器堆叠包括具有由多个柔性部分连接在一起的多个刚性部分的柔性互连装置。诸如骰子或芯片的存储器件安装在柔性互连结构上，并且结构被折叠到柔性部分以形成堆叠。存储器件I / O和互连器件安装触点之间的连接通过信号层中的迹线进行。可以加入导热层以增加远离存储器件的热传导。

7. 发明授权

US5274584A Solid state memory device having optical data connections 失效
标题翻译：具有光学数据连接的固态存储器件
公开(公告)号：US5274584A
公开(公告)日：1993-12-28
申请号：US696357
申请日：1991-05-06
申请人： Watson R. Henderson , Michael S. Kelly , Michael L. Leonhardt , Floyd G. Paurus , Archibald W. Smith , Stanley R. Szerlip
发明人： Watson R. Henderson , Michael S. Kelly , Michael L. Leonhardt , Floyd G. Paurus , Archibald W. Smith , Stanley R. Szerlip
IPC分类号： G11C5/00 , G11C5/14 , G11C7/00 , G11C5/06
CPC分类号： G11C5/141 , G11C5/00 , G11C7/005
摘要： The solid state memory device consists of a circuit board based system which is mounted in a 3480 type magnetic tape cartridge form factor housing to make this media physically compatible with the 3480 type magnetic tape cartridges. The interconnection of the solid state memory device with the read/write device is by an optical connections which transfer data between the solid state memory device and the associated read/write device. A plurality of batteries in the solid state memory device provide power for the memory retention capability required of the volatile solid state memory devices. The batteries are recharged by the use of a pair of power rails that are incorporated into the exterior housing of the 3480 form factor cartridge. Thus, the associated read/write device applies power to the solid state memory via these power rails when the 3480 form factor cartridge is placed in the associated read/write device. Likewise, an associated manual or automated cartridge storage system supplies power when the cartridge is offline, in storage.
摘要翻译：固态存储器件由基于电路板的系统组成，该系统安装在3480型磁带盒形状因数外壳中，以使该介质与3480型磁带盒物理兼容。固态存储器件与读/写器件的互连是通过在固态存储器件和相关的读/写器件之间传输数据的光学连接。固态存储器件中的多个电池为挥发性固态存储器件所需的存储器保持能力提供电力。电池通过使用一对电源轨进行再充电，这些电源导轨结合到3480外形尺寸盒的外壳中。因此，当3480形状因子盒被放置在相关联的读/写设备中时，相关联的读/写设备通过这些电源轨将电力施加到固态存储器。同样，相关的手动或自动化盒式磁带存储系统在存储器中脱机时提供电力。

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