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    • 3. 发明申请
    • Borehole Liner
    • 钻孔衬板
    • US20090025942A1
    • 2009-01-29
    • US11828848
    • 2007-07-26
    • David R. HallJohn FernandezJoe Fox
    • David R. HallJohn FernandezJoe Fox
    • E21B25/06E21B43/10
    • E21B43/103E21B7/068E21B7/20E21B19/22E21B43/105
    • A system for forming a liner downhole within a well bore has a rig comprising a tool string driving mechanism and an aperture proximate an opening of a well bore. The system also has first and second tool string components and each component has a central bore disposed intermediate first and second tool joints of the component. The first tool joint of the first component is disposed proximate the aperture and the second tool joint of the second component. First and second resilient lining materials are disposed within the central bore of the first and second tool string components respectively. At least one lining material connecting mechanism is disposed proximate the aperture. The system also comprises at least one downhole dispenser that is adapted to direct a resilient continuous lining material against the well bore to form a liner.
    • 用于在井眼内部形成衬垫的系统具有包括工具串驱动机构和靠近井眼的开口的孔的钻机。 该系统还具有第一和第二工具串部件,并且每个部件具有中心孔,该中心孔设置在部件的第一和第二工具接头的中间。 第一部件的第一工具接头设置在第二部件的孔和第二工具接头附近。 第一和第二弹性衬里材料分别设置在第一和第二工具组件的中心孔内。 至少一个衬里材料连接机构设置在孔附近。 该系统还包括至少一个井下分配器,其适于将弹性连续衬里材料引导到井眼以形成衬套。
    • 5. 发明申请
    • A Cutting Element with a Non-shear Stress Relieving Substrate Interface
    • 具有非剪切应力消除基板界面的切割元件
    • US20070062737A1
    • 2007-03-22
    • US11162681
    • 2005-09-19
    • David HallJohn Fernandez
    • David HallJohn Fernandez
    • E21B10/36
    • E21B10/5735
    • The present invention includes an improved cutting element substrate for cutting elements. The cutting element substrate includes non-planar, non-linear interfaces with an abrasive layer of superhard material affixed thereto often using a high pressure high temperature press apparatus. The cutting element substrate includes a cant intersecting a first and second interfacial surface. A plurality of truncated nodules intersects the first surface and extends towards the second surface. Arcuate segments protrude out of the second surface and are radially positioned along the surface. The truncated nodules are ill-aligned with the arcuate segments proximate the truncated nodules.
    • 本发明包括用于切割元件的改进的切割元件基底。 切割元件基板包括非平面的非线性界面,其中经常使用高压高温压制装置将超硬材料磨料层固定在其上。 切割元件基板包括与第一和第二界面表面相交的凹部。 多个截顶的结节与第一表面相交并且朝向第二表面延伸。 弧形段从第二表面伸出并沿着表面径向定位。 截断的结节与靠近截节的结节的弧形段不对齐。
    • 8. 发明授权
    • Borehole liner
    • 钻孔衬板
    • US07647977B2
    • 2010-01-19
    • US11828848
    • 2007-07-26
    • David R. HallJohn FernandezJoe Fox
    • David R. HallJohn FernandezJoe Fox
    • E21B17/22F16L55/1645
    • E21B43/103E21B7/068E21B7/20E21B19/22E21B43/105
    • A system for forming a liner downhole within a well bore has a rig comprising a tool string driving mechanism and an aperture proximate an opening of a well bore. The system also has first and second tool string components and each component has a central bore disposed intermediate first and second tool joints of the component. The first tool joint of the first component is disposed proximate the aperture and the second tool joint of the second component. First and second resilient lining materials are disposed within the central bore of the first and second tool string components respectively. At least one lining material connecting mechanism is disposed proximate the aperture. The system also comprises at least one downhole dispenser that is adapted to direct a resilient continuous lining material against the well bore to form a liner.
    • 用于在井眼内形成井筒内的衬套的系统具有包括工具串驱动机构的钻机和靠近井眼开口的孔。 该系统还具有第一和第二工具串部件,并且每个部件具有中心孔,该中心孔设置在部件的第一和第二工具接头的中间。 第一部件的第一工具接头设置在第二部件的孔和第二工具接头附近。 第一和第二弹性衬里材料分别设置在第一和第二工具组件的中心孔内。 至少一个衬里材料连接机构设置在孔附近。 该系统还包括至少一个井下分配器,其适于将弹性连续衬里材料引导到井眼以形成衬套。
    • 9. 发明申请
    • High Pressure Connection
    • 高压连接
    • US20070096465A1
    • 2007-05-03
    • US11163672
    • 2005-10-26
    • David HallJohn Fernandez
    • David HallJohn Fernandez
    • F16L19/06
    • F16L19/06E21B17/02E21B33/038F16L19/0218H01R13/5219H01R13/523
    • A connection for use in pressure includes a first and second surface stationary with respect to one another and a primary seal and secondary seal are formed between the surfaces and a labyrinth redundant seal is formed between the first and second surfaces and intermediate the primary and secondary seals. A connection for sealing against pressure may also include a retainer disposed within a housing receptacle a conduit disposed within a bore of the retainer. A primary seal may be formed between the conduit and the receptacle and a secondary seal may be formed between the retainer and the receptacle. A labyrinth seal may be formed between the retainer and the receptacle and intermediate the primary and secondary seals.
    • 用于压力的连接包括相对于彼此固定的第一和第二表面,并且在表面之间形成主密封件和次级密封件,并且在第一和第二表面之间形成迷宫式冗余密封件,并且在主密封件和次密封件之间形成 。 用于密封抵抗压力的连接件还可以包括设置在壳体容器内的保持器,设置在保持器的孔内的导管。 可以在导管和容器之间形成主密封件,并且可以在保持器和容器之间形成二次密封。 可以在保持器和容器之间形成迷宫式密封件,并且在主密封件和次密封件之间形成迷宫式密封件。
    • 10. 发明授权
    • Semiconductor lead frame and package with stiffened mounting paddle
    • 半导体引线框架和带有加固安装板的封装
    • US06303985B1
    • 2001-10-16
    • US09191858
    • 1998-11-12
    • Charles LarsonJohn Fernandez
    • Charles LarsonJohn Fernandez
    • H01L23495
    • H01L23/49503H01L24/45H01L24/48H01L2224/451H01L2224/48091H01L2224/48247H01L2224/73265H01L2224/83385H01L2924/181H01L2924/00014H01L2924/00015H01L2924/00012
    • A semiconductor lead frame, a semiconductor package, and a method for fabricating semiconductor packages, are provided. The lead frame includes side rails and multiple patterns of lead fingers. The lead frame also includes die mounting paddles associated with the patterns of lead fingers, and support members that attach the mounting paddles to the side rails. The mounting paddles include stiffening members such as indentations, ridges or corrugations formed in a die mounting surface thereof. The stiffening members prevent bowing of the mounting paddles, provide an increased surface area for bonding dice to the mounting paddles, and allow the mounting paddles to flex to accommodate thermal stresses. The support members for the mounting paddles can also have a stiffening cross sectional configuration to help maintain a planar orientation and location of the mounting paddles. The semiconductor package includes a semiconductor die bonded to a rigidified mounting paddle, and a plastic body encapsulating the die and mounting paddle.
    • 提供半导体引线框架,半导体封装以及半导体封装的制造方法。 引线框架包括侧轨和引线指的多个图案。 引线框架还包括与引线图案的图案相关联的模具安装板和将安装板附接到侧轨的支撑构件。 安装板包括形成在其模具安装表面中的加强构件,例如凹口,脊或波纹。 加强构件防止安装桨的弯曲,提供用于将骰子连接到安装桨的增加的表面积,并且允许安装桨弯曲以适应热应力。 用于安装桨叶的支撑构件还可以具有加强的横截面构造,以帮助保持安装桨的平面取向和位置。 半导体封装包括结合到刚性安装焊盘的半导体管芯和封装管芯和安装焊盘的塑料体。