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1. 发明申请

US20170347465A1 CIRCUIT BOARD, PRODUCTION METHOD OF CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT 审中-公开
公开(公告)号：US20170347465A1
公开(公告)日：2017-11-30
申请号：US15677771
申请日：2017-08-15
申请人： FUJITSU LIMITED
发明人： Kenji Iida , Takashi Nakagawa , Seigo Yamawaki , Yasuhiro Karahashi , Junichi Kanai , Koji Komemura
IPC分类号： H05K3/46 , H05K3/40 , H05K3/00
CPC分类号： H05K3/4623 , H05K3/0035 , H05K3/007 , H05K3/4069 , H05K2201/096 , Y10T29/49165
摘要： A method for producing circuit board, including: adhering plastic deformable insulating material onto surface of laminate, which contains second-metal-layer of second metal, and first-metal-layer in pattern on second-metal-layer, and the surface of the laminate is surface of second-metal-layer where first-metal-layer is formed, and surface of first-metal-layer, followed by curing the material, and removing second-metal-layer to form plate structure to which first-metal-layer in pattern is formed; opening hole in cured material from surface of the plate structure opposite to surface thereof where first-metal-layer is formed, until the hole reaches first-metal-layer; filling the hole with electroconductive paste, to form the plate structure filled therewith; and laminating one plate structure filled therewith with the other plate structure filled therewith in manner that first-metal-layer of one plate structure filled therewith faces opening of the hole of other plate structure filled therewith, wherein first-metal-layer contains metal different from second metal.

2. 发明申请

US20150029679A1 CIRCUIT BOARD, PRODUCTION METHOD OF CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT 有权
标题翻译：电路板，电路板生产方法和电子设备
公开(公告)号：US20150029679A1
公开(公告)日：2015-01-29
申请号：US14300360
申请日：2014-06-10
申请人： FUJITSU LIMITED
发明人： Kenji Iida , Takashi Nakagawa , Seigo Yamawaki , Yasuhiro Karahashi , Junichi Kanai , Koji Komemura
IPC分类号： H05K3/46 , H05K1/09
CPC分类号： H05K3/4623 , H05K3/0035 , H05K3/007 , H05K3/4069 , H05K2201/096 , Y10T29/49165
摘要： A method for producing circuit board, including: adhering plastic deformable insulating material onto surface of laminate, which contains second-metal-layer of second metal, and first-metal-layer in pattern on second-metal-layer, and the surface of the laminate is surface of second-metal-layer where first-metal-layer is formed, and surface of first-metal-layer, followed by curing the material, and removing second-metal-layer to form plate structure to which first-metal-layer in pattern is formed; opening hole in cured material from surface of the plate structure opposite to surface thereof where first-metal-layer is formed, until the hole reaches first-metal-layer; filling the hole with electroconductive paste, to form the plate structure filled therewith; and laminating one plate structure filled therewith with the other plate structure filled therewith in manner that first-metal-layer of one plate structure filled therewith faces opening of the hole of other plate structure filled therewith, wherein first-metal-layer contains metal different from second metal.
摘要翻译：一种生产电路板的方法，包括：将塑料可变形绝缘材料粘附在层压板的表面上，该表面包含第二金属层的第二金属层和第二金属层上的图案中的第一金属层，层压体是形成第一金属层的第二金属层的表面和第一金属层的表面，然后固化该材料，并且除去第二金属层以形成第一金属层的第一金属层，形成图案层; 在与第一金属层形成的表面相对的板结构的表面上的固化材料的开口孔直到孔达到第一金属层; 用导电膏填充孔，以形成填充的板结构; 并且以填充有填充的板结构的第一金属层面对其中填充的其他板结构的孔的开口的方式将填充有其他板结构的一个板结构层压，其中第一金属层含有不同于第二金属。

3. 发明授权

US09769936B2 Production method of circuit board 有权
公开(公告)号：US09769936B2
公开(公告)日：2017-09-19
申请号：US14300360
申请日：2014-06-10
申请人： FUJITSU LIMITED
发明人： Kenji Iida , Takashi Nakagawa , Seigo Yamawaki , Yasuhiro Karahashi , Junichi Kanai , Koji Komemura
IPC分类号： H01K3/10 , H05K3/46 , H05K3/40 , H05K3/00
CPC分类号： H05K3/4623 , H05K3/0035 , H05K3/007 , H05K3/4069 , H05K2201/096 , Y10T29/49165
摘要： A method for producing circuit board, including: adhering plastic deformable insulating material onto surface of laminate, which contains second-metal-layer of second metal, and first-metal-layer in pattern on second-metal-layer, and the surface of the laminate is surface of second-metal-layer where first-metal-layer is formed, and surface of first-metal-layer, followed by curing the material, and removing second-metal-layer to form plate structure to which first-metal-layer in pattern is formed; opening hole in cured material from surface of the plate structure opposite to surface thereof where first-metal-layer is formed, until the hole reaches first-metal-layer; filling the hole with electroconductive paste, to form the plate structure filled therewith; and laminating one plate structure filled therewith with the other plate structure filled therewith in manner that first-metal-layer of one plate structure filled therewith faces opening of the hole of other plate structure filled therewith, wherein first-metal-layer contains metal different from second metal.

4. 发明申请

US20160338193A1 MULTILAYER BOARD AND METHOD OF MANUFACTURING MULTILAYER BOARD 审中-公开
标题翻译：多层板和制造多层板的方法
公开(公告)号：US20160338193A1
公开(公告)日：2016-11-17
申请号：US15099646
申请日：2016-04-15
申请人： FUJITSU LIMITED
发明人： Junichi Kanai , Yasuhiro Karahashi , Hirofumi Kobayashi , Shunsuke KOGOI , Junichi Murayama , Koji Komemura , Hidehiko Fujisaki
IPC分类号： H05K1/02 , H05K1/11 , H05K3/00 , H05K3/46 , H05K3/06 , H05K1/09 , H05K1/03 , H05K3/40
CPC分类号： H05K3/4652 , H05K3/06 , H05K3/4069 , H05K3/462 , H05K3/4632 , H05K2201/0141 , H05K2201/096 , H05K2203/0191 , H05K2203/0264 , H05K2203/107 , H05K2203/1572 , H05K2203/308
摘要： A multilayer board disclosed herein includes: a plurality of insulating layers made of a thermosetting resin and stacked on one another, each insulating layer being provided with a via hole; a plurality of wiring each formed between the insulating layers and including an inclined side surface; and a conductive via made of a cured product of conductive paste filled in the via hole and connecting the vertically adjacent wiring to each other. Here, orientations of the inclined side surfaces are alternately changed from the wiring to the wiring.
摘要翻译：本文公开的多层板包括：由热固性树脂制成的多个绝缘层，彼此堆叠，每个绝缘层设置有通孔; 多个布线，其各自形成在所述绝缘层之间并且包括倾斜侧表面; 以及导电通孔，其由填充在通孔中的导电性浆料的固化物构成，并将上下相邻的配线彼此连接。这里，倾斜侧面的取向从布线交替地变更为布线。

5. 发明授权

US10327340B2 Circuit board, production method of circuit board, and electronic equipment 有权
公开(公告)号：US10327340B2
公开(公告)日：2019-06-18
申请号：US15677771
申请日：2017-08-15
申请人： FUJITSU LIMITED
发明人： Kenji Iida , Takashi Nakagawa , Seigo Yamawaki , Yasuhiro Karahashi , Junichi Kanai , Koji Komemura
IPC分类号： H05K3/46 , H05K3/40 , H05K3/00
摘要： A method for producing circuit board, including: adhering plastic deformable insulating material onto surface of laminate, which contains second-metal-layer of second metal, and first-metal-layer in pattern on second-metal-layer, and the surface of the laminate is surface of second-metal-layer where first-metal-layer is formed, and surface of first-metal-layer, followed by curing the material, and removing second-metal-layer to form plate structure to which first-metal-layer in pattern is formed; opening hole in cured material from surface of the plate structure opposite to surface thereof where first-metal-layer is formed, until the hole reaches first-metal-layer; filling the hole with electroconductive paste, to form the plate structure filled therewith; and laminating one plate structure filled therewith with the other plate structure filled therewith in manner that first-metal-layer of one plate structure filled therewith faces opening of the hole of other plate structure filled therewith, wherein first-metal-layer contains metal different from second metal.

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