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1. 发明申请

US20170303440A1 LIQUID COOLING SERVER 审中-公开
公开(公告)号：US20170303440A1
公开(公告)日：2017-10-19
申请号：US15484810
申请日：2017-04-11
申请人： FUJITSU LIMITED
发明人： Akira Shimasaki
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H05K7/20254 , H05K7/20509
摘要： A liquid cooling server includes a chassis including a unit case housing portion; a unit case which moves in a first direction for being inserted in and pulled out from the unit case housing portion and includes a heat generating component and a portion to be cooled; a cooling plate which is disposed to the chassis, opposes the unit case housing portion in a second direction perpendicular to the first direction, and includes a flow path through which a cooling medium flows; a metal portion which is provided to either one of the cooling plate and the portion to be cooled, includes a plurality of first protrusions which protrude in the second direction towards the unit case housing portion and are arranged in the first direction; and a heat transfer body provided between the metal portion and the first member in the second direction, the heat transfer body being elasticity.

2. 发明授权

US10091913B2 Liquid cooling server 有权
公开(公告)号：US10091913B2
公开(公告)日：2018-10-02
申请号：US15484810
申请日：2017-04-11
申请人： FUJITSU LIMITED
发明人： Akira Shimasaki
IPC分类号： H05K7/20 , G06F1/20
摘要： A liquid cooling server includes a chassis including a unit case housing portion; a unit case which moves in a first direction for being inserted in and pulled out from the unit case housing portion and includes a heat generating component and a portion to be cooled; a cooling plate which is disposed to the chassis, opposes the unit case housing portion in a second direction perpendicular to the first direction, and includes a flow path through which a cooling medium flows; a metal portion which is provided to either one of the cooling plate and the portion to be cooled, includes a plurality of first protrusions which protrude in the second direction towards the unit case housing portion and are arranged in the first direction; and a heat transfer body provided between the metal portion and the first member in the second direction, the heat transfer body being elasticity.

3. 发明申请

US20150059388A1 INFORMATION PROCESSING APPARATUS 审中-公开
标题翻译：信息处理装置
公开(公告)号：US20150059388A1
公开(公告)日：2015-03-05
申请号：US14471191
申请日：2014-08-28
申请人： FUJITSU LIMITED
发明人： Yukihiro Hirano , Keita Hirai , Akira Shimasaki , Keitaro KUROSAKI , Misao Umematsu
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20772
摘要： An apparatus includes a cooling device that cools, by using refrigerant, heating components mounted over a circuit board and has different use-temperature conditions, wherein the circuit board is provided with a first area in which a first group of heating components having an operating condition of generating heat less than a given-heat quantity and operating in a temperature range lower than a first temperature is arranged, a second area in which a second group of heating components having an operating condition of generating heat equal not less than the given-heat quantity and operating in a temperature range between the first temperature and a second temperature exceeding the first temperature is arranged, and a third area in which a third group of heating components having an operating condition of generating heat equal to or less than the given-heat quantity and operating in a temperature range exceeding the second temperature is arranged.
摘要翻译：一种装置包括：冷却装置，其通过使用制冷剂冷却安装在电路板上的加热部件，并且具有不同的使用温度条件，其中所述电路板设置有第一区域，其中第一组加热部件具有操作条件设置小于给定热量并在低于第一温度的温度范围内工作的热量;第二区域，其中具有产生热量等于不小于给定热量的操作条件的第二组加热部件布置在第一温度和超过第一温度的第二温度之间的温度范围内的操作量和第三区域，其中具有产生等于或小于给定热量的热的操作条件的第三组加热部件布置了超过第二温度的温度范围内的操作量。

4. 发明授权

US10362704B2 Information processing apparatus 有权
公开(公告)号：US10362704B2
公开(公告)日：2019-07-23
申请号：US16040574
申请日：2018-07-20
申请人： FUJITSU LIMITED
发明人： Yukihiro Hirano , Masanori Tachibana , Akira Shimasaki , Yoshimi Maekawa , Misao Umematsu , Naomi Fukunaga
IPC分类号： H01R25/00 , H05K7/14 , H01R27/02 , H05K7/20 , H01R13/631 , H01R13/74
摘要： An information processing apparatus includes a substrate that includes a first connector and a second connector, a backplane that includes a third connector coupled to the first connector and a fourth connector coupled to the second connector, and a metal plate attached to the backplane, wherein the metal plate has an opening to which the fourth connector is attached, wherein the first connector is arranged near a central part of the substrate on an end side inserted into the backplane and the second connector is arranged on each side of the first connector, and wherein a clearance between the opening of the metal plate and the fourth connector increases as a distance from the third connector to the fourth connector increases.

5. 发明申请

US20190104638A1 INFORMATION PROCESSING APPARATUS 审中-公开
公开(公告)号：US20190104638A1
公开(公告)日：2019-04-04
申请号：US16132599
申请日：2018-09-17
申请人： FUJITSU LIMITED
发明人： Akira Shimasaki
IPC分类号： H05K7/14 , H05K7/18
摘要： An information processing apparatus includes a rack in which slots into each of which an assembly is removably inserted are arranged in a top-bottom direction, a cable holder that bundles cables removably attached to the assembly, using a holding portion extending in the top-bottom direction, a pair of sliders fixed to an upper part and a lower part of the cable holder, and a pair of upper and lower rails fixed to the rack and guiding the pair of sliders to slide the cable holder in a transverse direction on an opening side of the slots.

6. 发明申请

US20190045652A1 INFORMATION PROCESSING APPARATUS 审中-公开
公开(公告)号：US20190045652A1
公开(公告)日：2019-02-07
申请号：US16040574
申请日：2018-07-20
申请人： FUJITSU LIMITED
发明人： Yukihiro Hirano , Masanori Tachibana , Akira Shimasaki , Yoshimi Maekawa , Misao Umematsu , Naomi Fukunaga
IPC分类号： H05K7/14 , H01R27/02 , H05K7/20
CPC分类号： H05K7/1452 , H01R13/6315 , H01R13/743 , H01R27/02 , H05K7/1454 , H05K7/1489 , H05K7/1491 , H05K7/1492 , H05K7/20781
摘要： An information processing apparatus includes a substrate that includes a first connector and a second connector, a backplane that includes a third connector coupled to the first connector and a fourth connector coupled to the second connector, and a metal plate attached to the backplane, wherein the metal plate has an opening to which the fourth connector is attached, wherein the first connector is arranged near a central part of the substrate on an end side inserted into the backplane and the second connector is arranged on each side of the first connector, and wherein a clearance between the opening of the metal plate and the fourth connector increases as a distance from the third connector to the fourth connector increases.

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