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1. 发明申请

US20170117689A1 WIRE SPLICING DEVICE, WIRE SPLICING METHOD, AND METHOD FOR MANUFACTURING SPLICE STRUCTURE 审中-公开
公开(公告)号：US20170117689A1
公开(公告)日：2017-04-27
申请号：US15399995
申请日：2017-01-06
申请人： FUJIKURA LTD.
发明人： Shinji FUJITA
IPC分类号： H02G1/00 , H01B12/04 , B23K3/08 , B23K1/00 , B23K1/19 , H01R43/02 , H01R4/68
CPC分类号： H02G1/005 , B23K1/0008 , B23K1/0016 , B23K1/19 , B23K3/04 , B23K3/085 , B23K3/087 , B23K20/004 , B23K37/0408 , B23K2101/32 , H01B12/00 , H01B12/04 , H01R4/022 , H01R4/027 , H01R4/68 , H01R43/02 , H01R43/0263
摘要： A wire splicing method including: disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other; disposing solder to straddle the first wire and the second wire; disposing a connection wire on the solder; pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder; keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

2. 发明申请

US20130040819A1 ELECTRODE UNIT JOINING STRUCTURE FOR SUPERCONDUCTING WIRE, SUPERCONDUCTING WIRE, AND SUPERCONDUCTING COIL 有权
标题翻译：超导电线，超导线和超导线圈的电极单元接合结构
公开(公告)号：US20130040819A1
公开(公告)日：2013-02-14
申请号：US13650811
申请日：2012-10-12
申请人： FUJIKURA LTD.
发明人： Masashi HARAGUCHI , Shinji FUJITA , Masanori DAIBO
IPC分类号： H01B12/02 , H01F5/00
CPC分类号： H01F6/065 , H01L39/02
摘要： An electrode unit joining structure for a superconducting wire includes: a superconducting wire comprising a first base member, a first superconducting layer provided on the first base member, and a first electroconductive layer provided on the first superconducting layer; an electrode provided on the first electroconductive layer at an end portion of the superconducting wire; and a superconducting cover tape comprising a second base member, a second superconducting layer provided on the second base member, and a second electroconductive layer provided on the second superconducting layer, the superconducting cover tape being provided so as to cover at least part of the electrode, wherein the second electroconductive layer of the superconducting cover tape is disposed on the electrode side, and the electrode, the superconducting wire, and the superconducting cover tape are electrically connected to each other.
摘要翻译：用于超导线的电极单元接合结构包括：超导线，包括第一基底构件，设置在第一基底构件上的第一超导层和设置在第一超导层上的第一导电层; 在所述超导线的端部设置在所述第一导电层上的电极; 以及包括第二基底构件，设置在所述第二基底构件上的第二超导层和设置在所述第二超导层上的第二导电层的超导盖带，所述超导盖带设置成覆盖所述电极的至少一部分，其中所述超导盖带的所述第二导电层设置在所述电极侧，并且所述电极，所述超导线和所述超导盖带彼此电连接。

3. 发明申请

US20170117688A1 WIRE SPLICING DEVICE, WIRE SPLICING METHOD, AND METHOD FOR MANUFACTURING SPLICE STRUCTURE 审中-公开
公开(公告)号：US20170117688A1
公开(公告)日：2017-04-27
申请号：US15399951
申请日：2017-01-06
申请人： FUJIKURA LTD.
发明人： Shinji FUJITA
IPC分类号： H02G1/00 , B23K3/08 , B23K1/00 , B23K1/19 , H01B12/04 , H01R43/02
CPC分类号： H02G1/005 , B23K1/0008 , B23K1/0016 , B23K1/19 , B23K3/04 , B23K3/085 , B23K3/087 , B23K20/004 , B23K37/0408 , B23K2101/32 , H01B12/00 , H01B12/04 , H01R4/022 , H01R4/027 , H01R4/68 , H01R43/02 , H01R43/0263
摘要： A wire splicing method including: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

4. 发明申请

US20160105005A1 WIRE SPLICING DEVICE, WIRE SPLICING METHOD, AND METHOD FOR MANUFACTURING SPLICE STRUCTURE 有权
标题翻译：电线分线装置，电线分线方法及其制造方法
公开(公告)号：US20160105005A1
公开(公告)日：2016-04-14
申请号：US14893814
申请日：2014-05-28
申请人： FUJIKURA LTD.
发明人： Shinji FUJITA
IPC分类号： H02G1/00 , H01R43/02 , B23K37/04 , B23K3/04 , B23K3/08 , H01B12/00 , B23K1/00
CPC分类号： H02G1/005 , B23K1/0008 , B23K1/0016 , B23K1/19 , B23K3/04 , B23K3/085 , B23K3/087 , B23K20/004 , B23K37/0408 , B23K2101/32 , H01B12/00 , H01B12/04 , H01R4/022 , H01R4/027 , H01R4/68 , H01R43/02 , H01R43/0263
摘要： A wire connection device includes: a holding base which is provided with a wire accommodation groove having a width, the wire accommodation groove being configured to accommodate a plurality of wires; a pressing plate which is positioned above the holding base; a heating body which is positioned above the pressing plate and includes a heating member; a first driver which drives the holding base and the pressing plate away from or toward one another; and a second driver which drives the holding base and the heating body toward or away from one another, in which the pressing plate which is driven toward the holding base by the first driver presses together the plurality of wires accommodated in the wire accommodation groove with solder interposed therebetween.
摘要翻译：线连接装置包括：保持基座，其设有具有宽度的线容纳槽，所述线容纳槽配置成容纳多根线; 位于保持基座上方的压板; 加热体，其位于所述加压板的上方并具有加热部件; 第一驱动器，其将保持基座和压板彼此远离或相对地驱动; 以及第二驱动器，其将保持基座和加热体朝彼此或彼此远离地驱动，其中由第一驱动器朝向保持基座驱动的按压板将容纳在电线容纳槽中的多个电线焊接在一起，焊接插入其间。

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