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    • 4. 发明申请
    • METHOD FOR REGENERATING PLATING LIQUID, PLATING METHOD, AND PLATING APPARATUS
    • 再生液体,镀层方法和镀膜装置的方法
    • US20150037512A1
    • 2015-02-05
    • US14349194
    • 2012-11-27
    • Fuji Shoji Co., Ltd.
    • Tatsuya BannoKatsuhiro GotoNobuhiro Kanazawa
    • C23C18/16C23C18/18C23C18/38C25C1/12C25C1/06
    • C23C18/1617C23C18/1632C23C18/1633C23C18/1637C23C18/1848C23C18/38C25C1/06C25C1/12C25D3/38C25D3/58C25D5/36C25D7/0607C25D17/10C25D21/14C25D21/22
    • A problem to be solved is to provide a method for regenerating plating liquid from plating waste liquid in a simple and easy way and a plating method utilizing the regenerating method.A method for regenerating plating liquid from plating waste liquid that is produced as a result of performing a copper plating on steel and that contains respective ions of Fe, Cu and Sn comprises repetitively performing processing steps of applying electric current with the plating waste liquid 11 side taken as a cathode 15 and electrolytic solution 12 side taken as an anode 16 in the state that the plating waste liquid 11 and the electrolytic solution 12 are connected through an anion exchange membrane 13; separating copper by making a copper deposition electrode as a result of depositing copper on the cathode 15 being in contact with the plating waste liquid 11, to turn the plating waste liquid to processed remaining liquid; and using as the anode 16 a copper deposition electrode formed previously and dissolving copper in the electrolytic solution 12 to generate copper ion-containing solution.
    • 要解决的问题是提供一种以简单易用的方式从电镀废液中再生电镀液的方法和利用再生方法的电镀方法。 通过在钢上进行镀铜而含有Fe,Cu,Sn的各种离子而生成的镀敷废液的电镀液的再生方法包括重复进行与电镀废液11侧的电流的加工工序 在电镀废液11和电解液12通过阴离子交换膜13连接的状态下作为阴极15和电解液12一侧作为阳极16; 通过在与镀液废液11接触的阴极15上沉积铜而制作铜沉积电极来分离铜,将镀液废液转化为处理的剩余液体; 并且使用先前形成的铜沉积电极作为阳极16并将铜溶解在电解液12中以产生含铜离子的溶液。