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1. 发明申请

US20170014931A1 SOLDER SUPPLY DEVICE AND SOLDER SUPPLY METHOD 审中-公开
标题翻译：焊接设备和焊接供应方法
公开(公告)号：US20170014931A1
公开(公告)日：2017-01-19
申请号：US15122032
申请日：2014-02-27
申请人： FUJI MACHINE MFG. CO., LTD.
发明人： Ritsuo HIRUKAWA , Takenobu KATO , Kento ASAOKA
IPC分类号： B23K3/06 , H05K3/12
CPC分类号： B23K3/0638 , B05C5/00 , B23K2101/42 , H05K3/1233 , H05K3/3484 , H05K2203/0139
摘要： A solder supply device is provided with solder cup housing liquid solder that is tubular and open at one end, a positive/negative pressure supply device capable of controlling the pressure inside the solder cup, a supply nozzle for dispensing solder from the solder cup, and a solder cutting device that cuts solder supplied from the supply nozzle by ejecting compressed air. Solder is supplied from the supply nozzle by increasing the pressure inside the solder cup using the positive/negative pressure supply device. When stopping the supply of solder from the supply nozzle, the pressure inside the solder cup is decreased using the positive/negative pressure supply device, and solder is cut by the solder cutting device to match the timing of pressure inside the solder cup decreasing.
摘要翻译：焊料供给装置设置有管状并且在一端开口的焊锡杯外壳液体焊料，能够控制焊锡杯内部的压力的正/负压供给装置，用于从焊料杯分配焊料的供应喷嘴，以及焊接切割装置，其通过喷射压缩空气来切断从供给喷嘴供给的焊料。使用正/负压供给装置，通过增加焊锡杯内的压力，从供给喷嘴供给焊料。当停止从供应喷嘴供应焊料时，使用正/负压力供应装置减小焊杯内部的压力，并且通过焊料切割装置切割焊料以匹配焊料杯内的压力正时降低。

2. 发明申请

US20160338209A1 SOLDER SUPPLY DEVICE 有权
标题翻译：焊接设备
公开(公告)号：US20160338209A1
公开(公告)日：2016-11-17
申请号：US15100499
申请日：2013-12-05
申请人： FUJI MACHINE MFG. CO., LTD
发明人： Akihiro SENGA , Shoji FUKAKUSA , Ritsuo HIRUKAWA , Yoji FUJITA , Yoshimune YOKOI
IPC分类号： H05K3/34 , B41F15/42 , B23K3/06
CPC分类号： H05K3/3468 , B05C11/1002 , B05C17/00533 , B23K3/06 , B23K3/0638 , B23K2101/42 , B41F15/40 , B41F15/405 , B41F15/42 , B41F15/423 , H05K3/1233
摘要： A solder supply device provided with a solder cup housing liquid solder that is tubular and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and an outer tube that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. Solder is supplied from the solder container without using an air cylinder, electromagnetic motor, or the like.
摘要翻译：一种焊料供应装置，其具有管状并在一端敞开的焊料杯容纳液体焊料; 用于从焊料容器喷出焊料的喷嘴部，其插入到焊料容器中; 凸缘部，其设置在所述喷嘴部的外周部并与所述焊锡杯接合的内部; 以及将气室与焊锡杯的底面分隔开的外管。通过焊锡杯从喷嘴部的末端供给焊料，通过向空气室供给空气来相对移动凸缘部。焊料从焊料容器供给而不使用气缸，电磁电动机等。

3. 发明申请

US20180162118A1 PRINTING DEVICE AND BOARD WORK DEVICE 审中-公开
公开(公告)号：US20180162118A1
公开(公告)日：2018-06-14
申请号：US15580522
申请日：2015-06-08
申请人： FUJI MACHINE MFG. CO., LTD.
发明人： Ritsuo HIRUKAWA , Yasunori KAMEGAI , Takeshi KONDO , Mitsuaki KATO , Tsuyoshi MIZUKOSHI , Atsushi TORII , Jun IISAKA , Kazuhiro KUSUNOKI
IPC分类号： B41F15/36 , B41F15/18 , B41F15/08
CPC分类号： B41F15/36 , B41F15/08 , B41F15/0881 , B41F15/18 , B41F15/20 , B41F15/26 , B41F27/005 , B41P2215/112 , B41P2215/114 , H05K3/1216
摘要： A printing device including a conveyance rod which discharges and introduces a screen mask and a board support member; and a control section. The control section performs a mask exchange process including a mask discharge process of discharging the screen mask to be discharged and a mask introduction process of introducing the screen mask to be introduced by controlling a conveyance rod. In addition, the control section performs a support member exchange process including a support member discharge process of discharging the board support member to be discharged and a support member introduction process of introducing the support member to be introduced by controlling the conveyance rod.

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