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1. 发明申请

US20130062045A1 HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME 审中-公开
标题翻译：导热介质聚合物材料及其散热基板
公开(公告)号：US20130062045A1
公开(公告)日：2013-03-14
申请号：US13232515
申请日：2011-09-14
申请人： FU HUA CHU , DAVID SHAU CHEW WANG , YI AN SHA , KUO HSUN CHEN
发明人： FU HUA CHU , DAVID SHAU CHEW WANG , YI AN SHA , KUO HSUN CHEN
IPC分类号： F28F7/00
CPC分类号： H05K1/0373 , F28F7/00 , F28F21/06 , H05K1/0203 , H05K2201/0278 , H05K2201/0293
摘要： A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK.
摘要翻译：导热介电聚合物材料包括热固性环氧树脂，非织造纤维组分，固化剂和导热填料。热固性环氧树脂选自端环氧官能团环氧树脂，侧链环氧官能团环氧树脂，多官能环氧树脂或其混合物。热固性环氧树脂占导热介电聚合物材料的4％-60％（体积）。固化剂被配置为在固化温度下固化热固性环氧树脂。导热填料包含导热介电聚合物材料的40体积％-70体积％。非织造纤维组分包含1％-35％体积的导热介电聚合物材料。导热介电聚合物材料的导热率大于0.5W / mK。

2. 发明申请

US20110217462A1 METHODS FOR MANUFACTURING INSULATED HEAT CONDUCTIVE SUBSTRATE AND INSULATED HEAT CONDUCTIVE COMPOSITE SUBSTRATE 审中-公开
标题翻译：制造绝缘导热基板和绝缘导热复合基板的方法
公开(公告)号：US20110217462A1
公开(公告)日：2011-09-08
申请号：US13106596
申请日：2011-05-12
申请人： DAVID SHAU CHEW WANG , YI AN SHA , KUO HSUN CHEN
发明人： DAVID SHAU CHEW WANG , YI AN SHA , KUO HSUN CHEN
IPC分类号： B05D5/00
CPC分类号： B05D5/00
摘要： A method for manufacturing an insulated heat conductive substrate comprises the steps of: performing hydrolysis and condensation of at least one thermally conductive ceramic powder to prepare at least one modified thermally conductive ceramic powder, which comprises a plurality of modified powder particles, each grafted with an organic material; mixing the at least one modified thermally conductive ceramic powder with two substantially mutually soluble polymers to achieve a uniform mixture; blending the uniform mixture with a curing agent to obtain a melt extrudable dielectric curable material; extruding the dielectric curable material through a slit to form a sheet-like substrate; and disposing a first film and a second film on two side surfaces of the substrate to obtain an insulated heat conductive substrate, wherein each of the first and second films can be either a metal foil or a release film.
摘要翻译：绝缘导热基板的制造方法包括以下步骤：进行至少一种导热陶瓷粉末的水解和冷凝以制备至少一种改性导热陶瓷粉末，其包含多个改性粉末颗粒，每个改性粉末颗粒接枝有机材料; 将所述至少一种改性的导热陶瓷粉末与两种基本上相互溶解的聚合物混合以获得均匀的混合物; 将均匀混合物与固化剂混合以获得可熔融挤出的介电可固化材料; 通过狭缝挤出介电可固化材料以形成片状基材; 以及在所述基板的两个侧表面上设置第一膜和第二膜以获得绝热导热基板，其中所述第一膜和所述第二膜可以是金属箔或剥离膜。

3. 发明申请

US20110214852A1 HEAT CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME 有权
标题翻译：导热介质聚合物材料及其散热基板
公开(公告)号：US20110214852A1
公开(公告)日：2011-09-08
申请号：US13109284
申请日：2011-05-17
申请人： DAVID SHAU CHEW WANG , YI AN SHA , KUO HSUN CHEN
发明人： DAVID SHAU CHEW WANG , YI AN SHA , KUO HSUN CHEN
IPC分类号： F28F7/00 , C09K5/00
CPC分类号： C09K5/00 , F28F7/00 , Y02P20/124 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529
摘要： A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K.
摘要翻译：导热介电聚合物材料包括聚合物，固化剂和导热填料。聚合物包括热塑性和热固性环氧树脂。该热塑性塑料包含导热介电聚合物材料的3％至30％（体积），热固性环氧树脂选自端环氧官能团环氧树脂，侧链环氧官能团环氧树脂，多功能基环氧树脂或的混合物。固化剂可以在一定温度下固化热固性环氧树脂。导热填料均匀地分布在聚合物中，并且包含40体积％至70体积％的导热介电聚合物材料。导热介电聚合物材料具有互穿网络结构，导热系数大于1.0W / m-K。

4. 发明申请

US20130200988A1 OVER-CURRENT PROTECTION DEVICE 有权
标题翻译：过流保护装置
公开(公告)号：US20130200988A1
公开(公告)日：2013-08-08
申请号：US13531979
申请日：2012-06-25
申请人： KUO CHANG LO , YAO TE CHANG , YA FANG LIANG , YI AN SHA , DAVID SHAU CHEW WANG
发明人： KUO CHANG LO , YAO TE CHANG , YA FANG LIANG , YI AN SHA , DAVID SHAU CHEW WANG
IPC分类号： H02H9/02 , H01C7/13
CPC分类号： H01C7/13 , H01C7/027 , H01C17/0652 , H01C17/06586
摘要： An over-current protection device includes two metal foils and a PTC material layer. The PTC material layer is laminated between the two metal foils and has a resistivity less than 0.4 Ω-cm. The PTC material layer includes crystalline polymer and electrically conductive ceramic filler dispersed in the crystalline polymer. The conductive ceramic filler is of HCP structure and includes 70-95% by weight of the PTC material layer. The trip jump value of the over-current protection device after 300 times trip is less than or equal to 25. The resistance repeatability of the device can be effectively improved by adding the conductive ceramic filler.
摘要翻译：过电流保护装置包括两个金属箔和PTC材料层。 PTC材料层层压在两个金属箔之间并具有小于0.4Ω·cm的电阻率。 PTC材料层包括分散在结晶聚合物中的结晶聚合物和导电陶瓷填料。导电陶瓷填料为HCP结构，包括70-95％（重量）的PTC材料层。 300次跳闸后过电流保护装置跳闸值小于或等于25.通过添加导电陶瓷填料可以有效提高器件的电阻重复性。

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